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公开(公告)号：CA2721698A1
公开(公告)日：2009-10-29
申请号：CA2721698
申请日：2009-04-24
Applicant: STORA ENSO OYJ
Inventor： PETTERSSON JONAS , SIRVIO PETRI , RYYNAENEN MARKO , LEHTOLA JUHA
Abstract: Packages are manufactured in a digitally controlled process. A digital printing machine (101) produces printed workpieces and a cutting machine (104) cuts packaging blanks (105) from them. A conveyor line (107) transfers the printed workpieces automatically from the digital printing machine (101) to the cutting machine (104). A digital control system (109) exchanges digital control information with at least the digital printing machine (101) and the cutting machine (104).
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公开(公告)号：MY174932A
公开(公告)日：2020-05-24
申请号：MYPI2014003328
申请日：2008-05-09
Applicant: STORA ENSO OYJ
Inventor： MAIJALA JUHA , SIRVIO PETRI
Abstract: An apparatus (100), a method, a planar insulating substrate (101) and a chipset have been presented, comprising at least one module configured to establish a predefined pattern (99) on a planar insulating substrate so that conductive particles (102) can gather according to the predefined pattern. At least one other module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane (99') on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web. Fig. 6
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公开(公告)号：MY168368A
公开(公告)日：2018-10-31
申请号：MYPI2013001303
申请日：2010-10-14
Applicant: STORA ENSO OYJ
Inventor： MAIJALA JUHA , SIRVIO PETRI
Abstract: A CHIP IS ATTACHED TO A PRINTED CONDUCTIVE SURFACE. THE CHIP IS FIRST HEATED TO A FIRST TEMPERATURE, WHICH IS LOWER THAN WHAT THE CHIP CAN STAND WITHOUT BEING DAMAGED BY THE HEAT. THE HEATED CHIP IS PRESSED AGAINST THE PRINTED CONDUCTIVE SURFACE WITH A FIRST PRESSING FORCE. A COMBINATION OF SAID FIRST TEMPERATURE AND SAID FIRST PRESSING FORCE IS SUFFICIENT TO AT LEAST PARTLY MELT THE MATERIAL OF AT LEAST ONE OF: THE PRINTED CONDUCTIVE SURFACE, CONTACT POINT ON THE CHIP.
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公开(公告)号：AU2010362421A1
公开(公告)日：2013-05-02
申请号：AU2010362421
申请日：2010-10-14
Applicant: STORA ENSO OYJ
Inventor： MAIJALA JUHA , SIRVIO PETRI
Abstract: A chip (201) is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip (205, 206).
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公开(公告)号：CA2862587C
公开(公告)日：2020-04-07
申请号：CA2862587
申请日：2013-01-30
Applicant: STORA ENSO OYJ
Inventor： MAIJALA JUHA , SIRVIO PETRI
Abstract: A method and an arrangement are disclosed for transferring electrically conductive material in fluid form onto a substrate. Said substrate is preheated to a first temperature, and of said electrically conductive material there is produced fluid electrically conductive material. The fluid electrically conductive material is sprayed onto the preheated substrate to form a pattern of predetermined kind. The substrate onto which said fluid electrically conductive material was sprayed is cooled to a third temperature, which is lower than the melting point of said electrically conductive material.
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Patent Agency Ranking
公开(公告)号：CA2723886C
公开(公告)日：2017-01-17
申请号：CA2723886
申请日：2008-05-09
Applicant: STORA ENSO OYJ
Inventor： MAIJALA JUHA , SIRVIO PETRI
IPC: H05K3/10
Abstract: An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.
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公开(公告)号：CA2721698C
公开(公告)日：2016-08-09
申请号：CA2721698
申请日：2009-04-24
Applicant: STORA ENSO OYJ
Inventor： PETTERSSON JONAS , SIRVIO PETRI , RYYNAENEN MARKO , LEHTOLA JUHA
Abstract: Packages are manufactured in a digitally controlled process. A digital printing machine (101) produces printed workpieces and a cutting machine (104) cuts packaging blanks (105) from them. A conveyor line (107) transfers the printed workpieces automatically from the digital printing machine (101) to the cutting machine (104). A digital control system (109) exchanges digital control information with at least the digital printing machine (101) and the cutting machine (104).
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8.发明专利
公开(公告)号：CA2941100C
公开(公告)日：2022-07-19
申请号：CA2941100
申请日：2015-03-13
Applicant: STORA ENSO OYJ
Inventor： MIIKKI NINA , SIRVIO PETRI , BACKFOLK KAJ
Abstract: The invention refers to a method to produce a packaging material comprising the steps of; treating at least one surface of a paperboard substrate with a binder and with a metal salt, printing at least a part of said treated surface with ink, and applying at least one polymer layer on said printed surface. The packaging material produced in accordance with the invention shows good printability and simultaneously good adhesion of the applied polymer layer.
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公开(公告)号：CA2863130C
公开(公告)日：2021-06-22
申请号：CA2863130
申请日：2013-01-30
Applicant: STORA ENSO OYJ
Inventor： SIRVIO PETRI , MAIJALA JUHA
Abstract: CA 02863130 2014-07-29 22 Abstract A method and an arrangement are disclosed for producing an electrically con-ductive pattern on a surface. Electrically conductive solid particles are trans-ferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point. Fig. 1
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10.发明专利
公开(公告)号：RU2728797C2
公开(公告)日：2020-07-31
申请号：RU2018116631
申请日：2016-10-05
Applicant: STORA ENSO OYJ
Inventor： MAIJALA JUHA , SIRVIO PETRI
Abstract: Изобретениеотноситсяк системеи способуотслеживанияизделий. Техническийрезультатзаключаетсяв повышениинадежностиметки, размещаемойнаизделии. Вспособеполучаютинформациюобизделии, указывающуюсвойстваединицыизделия, иконфигурируютэлектроннуюметкудляединицыизделиядляидентификацииединицыизделияс помощьюсчитываемойвнешнеидентификационнойинформации, переносимойметкой, приэтомопределяютадаптированнуютехническуюхарактеристикуреализацииметки, включающуюв себясвойстваметки, наоснованииконфигурациисчитывателяв местоположенияхв цепочкепоставокилиценностейилиусловияхокружающейсреды, преобладающихв этихместоположениях, приэтомхарактеристикаадаптируетсянаосновеполученнойинформацииобизделии, чтобыоптимизироватьработуметкипоотношениюк единицеизделия, используякритерииоптимизации, создаютилиприкрепляютметкук единицеизделияв соответствиис адаптированнойтехническойхарактеристикойи сохраняютв электроннойсистемеуправленияданнымиуказанияцифровыхуведомленийо событияхсчитыванияметокв множестведействийассоциированнойцепочкипоставокилиценностей, указывающихидентификационнуюинформациюметки. 2 н. и 18 з.п. ф-лы, 3 ил.
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