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公开(公告)号：KR20200132820A
公开(公告)日：2020-11-25
申请号：KR20200155342
申请日：2020-11-19
Applicant: SUMITOMO CHEMICAL CO
Inventor： IKEUCHI JUNICHI , PYEON BORAM , ARIMURA TAKASHI , YOSHIKAWA GAKU
Abstract: [과제] 높은탄성률을가지는수지필름을제공한다. [해결수단] 폴리이미드계수지및 폴리아미드계수지로이루어지는군으로부터선택되는적어도 1종의수지를포함하는광학필름으로서, 당해광학필름의비행시간형 2차이온질량분석법에의해얻어지는 CH3의이온강도(ICH3)에대한 Na의이온강도(INa)의비율(INa/ICH3)이 0.2 이상인, 광학필름.
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Patent Agency Ranking2.发明公开METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开VERFAHREN ZUR HERSTELLUNG EINES LICHTEMITTIERENDEN HALBLEITERBAUELENTS
公开(公告)号：EP3101698A4
公开(公告)日：2017-06-28
申请号：EP15743494
申请日：2015-01-20
Applicant: SUMITOMO CHEMICAL CO
Inventor： YOSHIKAWA GAKU , TAKASHIMA MASAYUKI
CPC classification number: H01L33/52 , H01L23/296 , H01L33/486 , H01L33/56 , H01L2224/16225 , H01L2224/45144 , H01L2224/48227 , H01L2224/48237 , H01L2924/181 , H01L2933/005 , H01L2924/00012 , H01L2924/00
Abstract: A method for producing a semiconductor light-emitting device comprising a substrate, an element and an encapsulating material as constituent members, comprising a first step of providing the substrate with the element; a second step of potting un uncured encapsulating material onto the substrate to cover the element; and a third step of curing the potted encapsulating material in such a manner that all of the following formulae (1), (2) and (3) are satisfied when the absorbances which a cured encapsulating material having a thickness of t [nm] has at wavelengths of 380 nm, 316 nm and 260 nm are represented by Abs A (t), Abs B (t) and Abs C (t), respectively and the light transmittance thereof at 380 nm is represented by T(t): T 1.7 ‰¥ 90 % Abs B t ˆ’ Abs A t
Abstract translation: 一种半导体发光元件的制造方法，其特征在于，具备：第一工序，在所述基板上形成所述元件; 将未固化的封装材料封装在基板上以覆盖元件的第二步骤; 以及第三步骤，以使得固化的具有厚度t [nm]的密封材料的吸光度满足以下所有式（1），（2）和（3）的方式固化所述封装材料 在380nm，316nm和260nm的波长分别由Abs A（t），Abs B（t）和Abs C（t）表示，并且其在380nm处的光透射率由T（t）表示：T 1.7‰¥90％Abs B t'Abs A t <0.011 t Abs C t'Abs A t <0.125 t。
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公开(公告)号：EP3098266A4
公开(公告)日：2017-10-04
申请号：EP14880195
申请日：2014-01-24
Applicant: SUMITOMO CHEMICAL CO
Inventor： TAKASHIMA MASAYUKI , YOSHIKAWA GAKU , KAMEDA TSUYOSHI
CPC classification number: C09D183/06 , C08G77/44 , C08K3/22 , C08K3/36 , C08K2003/2227 , C08K2003/2237 , C08K2201/00 , C08L83/00 , C08L83/04 , C08L83/06 , H01L23/296 , H01L33/56 , H01L2933/005
Abstract: A silicone resin liquid composition comprising a silicone resin, the 29 Si-NMR measurement thereof affords a ratio of the area of signals assigned to A3 silicon atoms as defined below to the area of all signals derived from silicon atoms of 51% to 69%, where said A3 silicon atom represents a silicon atom to which are bonded three oxygen atoms bonded to another silicon atom.
Abstract translation: 包含有机硅树脂的有机硅树脂液体组合物通过其29 Si-NMR测量提供如下定义的指定给A3硅原子的信号的面积与源自硅原子的所有信号的面积之比为51％至69％ 其中所述A3硅原子代表与三个氧原子键合的硅原子键合到另一硅原子。
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公开(公告)号：EP3176238A4
公开(公告)日：2018-01-24
申请号：EP15828281
申请日：2015-07-27
Applicant: SUMITOMO CHEMICAL CO
Inventor： YOSHIKAWA GAKU , TAKASHIMA MASAYUKI , MASUI KENTARO
CPC classification number: C08L83/04 , C08G77/06 , C08G77/44 , C08L2201/10 , C08L2203/206 , C08L2205/025 , C09K3/10 , H01L27/156 , H01L33/502 , H01L33/56
Abstract: A silicone-based encapsulating material composition comprising: a bifunctional thermosetting silicone resin (A), a multifunctional thermosetting silicone resin having a hydroxyl group (B), and a curing catalyst (C), wherein a weight-average molecular weight of the component (A) is 300 to 4,500, a mass ratio of the component (B) relative to a total mass of the component (A) and the component (B) is 0.5% by mass or more and less than 100% by mass, an average functional number of the component (B) is 2.5 to 3.5, and the repeating units constituting the component (B) which are trifunctional account for 50% by mass or more relative to a total mass of the component (B), and a visible light transmittance measured at an optical path length of 1 cm and a wavelength of 600 nm is 70% or higher.
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公开(公告)号：EP3176840A4
公开(公告)日：2018-01-24
申请号：EP15826730
申请日：2015-07-27
Applicant: SUMITOMO CHEMICAL CO
Inventor： YOSHIKAWA GAKU , TAKASHIMA MASAYUKI
CPC classification number: H01L33/56 , C08G77/04 , C09D183/06
Abstract: A method for producing a semiconductor light-emitting device comprising: a step of applying a silicone resin composition to a surface of a semiconductor light-emitting element, and a step of forming an encapsulating portion covering the surface of the semiconductor light-emitting element by heat curing the applied silicone resin composition; wherein the silicone resin composition comprises a silicone resin in which the constituent silicon atoms are substantially only silicon atoms to which three oxygen atoms are bonded in an amount of 60% by mass or more relative to a total mass ofsolid components in the silicone resin composition, and the heat curing is performed under conditions in which an infrared absorption spectrum peak position assigned to Si-O-Si linkages in a range from 1,000 to 1,050 cm -1 of the silicone resin before the heat curing is designated a cm -1 , and an infrared absorption spectrum peak position assigned to Si-O-Si linkages in a range from 950 to 1,050 cm -1 of the silicone resin composition after the heat curing is designated b cm -1 , satisfying 5
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6.发明公开
公开(公告)号：EP3101068A4
公开(公告)日：2017-10-25
申请号：EP15743471
申请日：2015-01-20
Applicant: SUMITOMO CHEMICAL CO
Inventor： YOSHIKAWA GAKU , TAKASHIMA MASAYUKI
CPC classification number: C08G77/18 , C08G77/045 , C08G77/08 , C08G77/16 , C08G2190/00 , C08K5/52 , C08K5/521 , C08K2003/321 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2933/005
Abstract: Use of a phosphoric acid-based catalyst as a cure accelerator for a polysilsesquioxane-based UV-LED-encapsulating material a cured product of which has a light transmittance of 65% or more at 260 nm; a polysilsesquioxane-based UV-LED-encapsulating material composition comprising a polysilsesquioxane-based UV-LED-encapsulating material and a phosphoric acid-based catalyst.
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