公开(公告)号：DE3477207D1

公开(公告)日：1989-04-20

申请号：DE3477207

申请日：1984-11-21

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： NAKAI TETSUO ,  YAZU SYUZI ,  ASAI KEIZO ,  KUMAZAWA YOSHIAKI

IPC: B01J3/06 ,  C22C26/00

Abstract: Herein is disclosed a high hardness sintered diamond compact and a process for the production of the same. The high hardness sintered diamond compact comprises 80 to 95% by volume of diamond particles, 0.5 to 5% by volume of a carbide particles selected from a group consisting of WC and (Mo,W)C and having a diameter not larger than 1 micron, and 4.5 to 15% by volume of an iron group metal, at least 95% by volume of said diamond particles having a diameter from 0.1 to 2 micron and the remainder of the diamond particles being particles having a diameter smaller than 0.1 micron. The ratio by volume of the amount of the diamond particles having a diameter from 1 to 2 micron to that of the diamond particles having a diameter from 0.1 to 1 micron ranges from 4 to 1. The high hardness sintered diamond compact according to the present invention is preferably usable as a drawing die for drawing a high hardness plated-steel wire and as a tool bit. The process according to the invention, comprises the steps of: preparing a diamond powder having a particle diameter distribution from 0.2 to 2 micron; mixing the diamond powder with an iron group metal and one member selected from the group consisting of WC and (Mo,W)C powders each having a particle diameter not larger than 1 micron; hot-pressing the thus obtained mixture of powders at an ultra-high pressure and a high temperature where diamond may be stable.

公开(公告)号：ZA849143B

公开(公告)日：1985-07-31

申请号：ZA849143

申请日：1984-11-23

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： NAKAI TETSUO ,  YAZU SYUZI ,  ASAI KEIZO ,  KUMAZAWA YOSHIAKI

IPC: B21C20060101 ,  B22F20060101 ,  C01B20060101 ,  B21C ,  B22F ,  C01B

公开(公告)号：ZA8409143B

公开(公告)日：1985-07-31

申请号：ZA8409143

申请日：1984-11-23

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： NAKAI TETSUO ,  YAZU SYUZI ,  ASAI KEIZO ,  KUMAZAWA YOSHIAKI

IPC: B21C20060101 ,  B22F20060101 ,  C01B20060101 ,  B21C ,  B22F ,  C01B

公开(公告)号：JPH03154776A

公开(公告)日：1991-07-02

申请号：JP29521089

申请日：1989-11-13

Applicant: SUMITOMO ELECTRIC INDUSTRIES ,  OSAKA DIAMOND IND

Inventor： SAHASHI TOSHIYUKI ,  ASAI KEIZO ,  OOMASAMINARU NOBUO ,  KASAI MAKOTO

IPC: B24B53/02

Abstract: PURPOSE:To perform grinding with extremely high efficiency by performing dressing with the pressing of the grinding face of a cup type grindwheel for dressing by a spring. CONSTITUTION:Grinding is performed by pressing a work 10 to the grinding face 11 of a rotating cup type super abrasive grain grindwheel 1 and at the same time a sliding member 6, namely the grinding face 11 of the cup type grindwheel 3 for dressing is pressed to the grinding face 11 of the cup type super abrasive grain grindwheel 1 for grinding by the tensile forces of springs 15, 17 by adjusting a drum 18. In this case, because of the grinding faces of both grindstones 1, 3 being not coaxial, the grindstone 3 is also subjected to back rotation by the friction force when the grindwheel 1 is rotated and the both grinding faces are moved in almost orthogonal direction each other and so a uniform dressing is performed over the whole grinding face of the grindwheel 1. Consequently no dulling and clogging is caused on the grinding face 11, there is no need of removing the work for dressing and the grinding can be performed efficiently.

公开(公告)号：JPH02274405A

公开(公告)日：1990-11-08

申请号：JP9322489

申请日：1989-04-14

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： NAKAI TETSUO ,  ASAI KEIZO

IPC: B23B27/20 ,  B23B27/18

Abstract: PURPOSE:To facilitate work so as to make it possible to manufacture a rotary tool and reinforce its edge point by connecting sintered diamond of 0.05 to 0.2mm thickness to an alloy of cemented carbide or the like and reducing a diamond area when a flank is ground by a diamond glindstone. CONSTITUTION:Polycrystal diamond of 0.2mm or less and 0.05mm or more thickness, which is sintered diamond manufactured by the gas phase synthesizing method or under a condition of super high pressure and high temperature, is connected to cemented carbide or steel. A thin film of Ti or Ti compound and iron group metal or the like adheres to a polycrystal diamond surface connected to the cemented carbide or the steel by silver brazing and palladium brazing or a Ni steel material and the like. A rotary tool of diameter less than 6mm can be also manufactured by setting a wedge angle in the tool edge point to 40 deg. to 75 deg., and a polycrystal diamond tool for cutting excellent in its wear resistance and defect resistance and with a low cost is manufactured, showing performance excellent in non-metal cutting, facilitating edging and easily obtaining also dimensional accuracy.

公开(公告)号：JPH03154777A

公开(公告)日：1991-07-02

申请号：JP29521189

申请日：1989-11-13

Applicant: SUMITOMO ELECTRIC INDUSTRIES ,  OSAKA DIAMOND IND

Inventor： SAHASHI TOSHIYUKI ,  ASAI KEIZO ,  OOMASAMINARU NOBUO ,  KASAI MAKOTO

IPC: B24B53/02

Abstract: PURPOSE:To perform grinding with extremely high efficiency by performing dressing with the contact of the grinding face of a cup type grindwheel. CONSTITUTION:Grinding is performed by pressing a work 10 to the grinding face 11 of a rotating cup type super abrasive grain grindwheel. When a blinding and clogging are caused on the grinding face 11 by this grinding, the work 10 is adequately separated from the grinding face 11, a ball screw 7 is rotated by a stepper motor 9, a cup type grindwheel 3 is moved to the left direction together with a support body 6, the grinding face 13 thereof is brought into contact with the cup type super abrasive grain grindwheel 1 with its pressing thereto and the dressing of this grindwheel 1 is performed.