公开(公告)号：DE60133791D1

公开(公告)日：2008-06-12

申请号：DE60133791

申请日：2001-05-31

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HAGA TSUYOSHI ,  OKUMURA KATSUYA ,  HAYASAKA NOBUO ,  SHIBATA HIDEKI ,  MATSUNAGA NORIAKI

IPC: G01R1/067 ,  G01R31/26 ,  G01R3/00 ,  H01L21/66

Abstract: A contact probe is fabricated by a method including a lithography step and a plating step. The contact probe includes a plunger unit (1) to form contact with a circuit to be tested, a spring unit (2), and a lead wire connection unit (3), all formed integrally so as to have a three dimensional configuration with uniform thickness with respect to a predetermined plane configuration in a thickness direction perpendicular to the predetermined plane configuration. Preferably, a guide unit (6) parallel to the spring unit (2) is also formed integrally. Further preferably, the contact probe is formed integrally also including a stopper (7) for each unitary configuration of the spring unit (2) constituted by a leaf spring.

公开(公告)号：DE60133791T2

公开(公告)日：2009-06-25

申请号：DE60133791

申请日：2001-05-31

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HAGA TSUYOSHI ,  OKUMURA KATSUYA ,  HAYASAKA NOBUO ,  SHIBATA HIDEKI ,  MATSUNAGA NORIAKI

IPC: G01R1/067 ,  G01R31/26 ,  G01R3/00 ,  H01L21/66

Abstract: A contact probe is fabricated by a method including a lithography step and a plating step. The contact probe includes a plunger unit (1) to form contact with a circuit to be tested, a spring unit (2), and a lead wire connection unit (3), all formed integrally so as to have a three dimensional configuration with uniform thickness with respect to a predetermined plane configuration in a thickness direction perpendicular to the predetermined plane configuration. Preferably, a guide unit (6) parallel to the spring unit (2) is also formed integrally. Further preferably, the contact probe is formed integrally also including a stopper (7) for each unitary configuration of the spring unit (2) constituted by a leaf spring.

公开(公告)号：JP2001343397A

公开(公告)日：2001-12-14

申请号：JP2000164407

申请日：2000-06-01

Applicant: SUMITOMO ELECTRIC INDUSTRIES ,  TOSHIBA CORP

Inventor： HAGA TAKESHI ,  OKUMURA KATSUYA ,  HAYASAKA NOBUO ,  SHIBATA HIDEKI ,  MATSUNAGA NORIAKI

IPC: G01R31/26 ,  G01R1/067 ,  G01R3/00 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To provide a finer contact probe and its manufacturing method to cope with pitch narrowing. SOLUTION: This contact probe is manufactured by a manufacturing method including a lithography process and a plating process. The probe is formed integrally so that a plunger part 1 for bringing into contact with a circuit to be inspected, a spring part 2, and a lead wire connection part 3 form a three- dimensional shape having the uniform thickness in the plate thickness direction vertical to a plane shape relative to the fixed plane shape. Preferably, a guide part 6 is also formed integrally in parallel with the spring part 2. More preferably, integral formation is executed in a shape including stopper parts 7 for every unit shape of the spring part 2 comprising a plate spring.