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公开(公告)号：DE102004014402A1
公开(公告)日：2005-01-13
申请号：DE102004014402
申请日：2004-03-24
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： NITTA KOJI , INAZAWA SHINJI , HAGA TSUYOSHI , ITO YASUHIKO , NOHIRA TOSHIYUKI , NISHIKIORI TOKUJIRO
Abstract: PURPOSE: To provide a molten salt bath for electroforming, the molten salt bath enabling electroforming to be performed at a low temperature by mixing three or more halides, thereby lowering melting point of molten salts composing the molten salt bath, and a method for manufacturing metal products using the molten salt bath for electroforming. CONSTITUTION: The molten salt bath for electroforming(9) contains halides of lithium bromide, cesium bromide and alkali metals and/or halides of alkaline earth metals. The method for manufacturing metal products comprises a process of forming a resist pattern on a conductive substrate so that a part of the conductive substrate is exposed; a process of dipping the resist pattern formed conductive substrate into a molten salt bath for electroforming to which precipitation metals and/or precipitation metal compounds are added; and a process of precipitating the metals on an exposed portion of the conductive substrate.
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公开(公告)号：CA2527241A1
公开(公告)日：2004-12-16
申请号：CA2527241
申请日：2004-06-04
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： IDOMOTO YUICHI , MASUDA YASUHITO , OKUDA YASUHIRO , FUJITA TARO , UENOYAMA MAYO , HAYASHI FUMIHIRO , HAGA TSUYOSHI
Abstract: A method of manufacturing a drilled porous resin base material with conducti ve drilled inner wall surfaces, comprising a step 1 for penetrating liquid or solution into the porous structure of the porous resin base material, a step 2 for forming solid matter from the penetrated liquid or solution, a step 3 fo r forming a plurality of drilled holes passed from the first surface to the second surface of the porous resin base material having the solid matter in the porous structure, and a step 4 for melting or dissolving the solid matte r and removing it from the porous structure. The method also comprises the ste p for selectively adhering catalysts to only the inner wall surfaces of the drilled holes and adhering a conductive metal to the inner wall surfaces.
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公开(公告)号：FI20041464A
公开(公告)日：2004-11-15
申请号：FI20041464
申请日：2004-11-15
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： HAGA TSUYOSHI
IPC: H01R13/03 , H01R13/05 , H01R13/115
Abstract: An object of the present invention is to provide an electrode for high-density connection capable of attachment/detachment of a package or an FPC. In order to attain this object, a snap electrode according to the present invention has a tubular ring presenting a circular or polygonal section and at least one spring electrode provided in the ring and coupled to the ring, to be connected to a substrate or an FPC by holding a pin electrode of an insertion-mount type package or the FPC with the spring electrode. The snap electrode preferably consists of nickel or a nickel alloy or consists of copper or a copper alloy, and is preferably coated with a noble metal or conductive diamondlike carbon.
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公开(公告)号：DE60218985T2
公开(公告)日：2007-12-20
申请号：DE60218985
申请日：2002-01-22
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： HIRATA YOSHIHIRO , HAGA TSUYOSHI , NUMAZAWA TOSHIYUKI , NAKAMAE KAZUO , OKADA KAZUNORI , YORITA JUN
Abstract: A contact is formed of a tip end portion (11) approximately cylindrical as a whole in shape, having at one end a contact end to come into contact with a circuit under test, and a base portion (12) provided to be opposed to and kept apart from the other end that is opposite to the contact end of the tip end portion. By pressing the tip end portion into contact with a circuit under test (20), the tip end portion and the base portion are brought into contact with each other, and further pushing causes dislocation at the contact surfaces (14,15) so that the tip end portion is moved in a direction parallel to a surface of the circuit under test. Therefore, when the contact probe is pressed into contact with the circuit under test, the contact end of the contact probe is moved such that it scrapes off the surface of the circuit under test to break the insulating film on the surface, resulting in reliable contact with the circuit under test.
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公开(公告)号：DE102004051374A1
公开(公告)日：2005-06-02
申请号：DE102004051374
申请日：2004-10-21
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： NITTA KOJI , INAZAWA SHINJI , HAGA TSUYOSHI
Abstract: An ion-implanted electroformed structural material is made of an electroformed body formed by electroforming and has an ion-implanted layer formed by implanting ions into the electroformed body. In the electroformed structural material, the microstructure is modulated at a position deeper than the ion-implanted layer, and the hardness becomes higher than that of the original electroformed body even at a position deeper than the ion-implanted layer.
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Patent Agency Ranking
公开(公告)号：DE60133791D1
公开(公告)日：2008-06-12
申请号：DE60133791
申请日：2001-05-31
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： HAGA TSUYOSHI , OKUMURA KATSUYA , HAYASAKA NOBUO , SHIBATA HIDEKI , MATSUNAGA NORIAKI
Abstract: A contact probe is fabricated by a method including a lithography step and a plating step. The contact probe includes a plunger unit (1) to form contact with a circuit to be tested, a spring unit (2), and a lead wire connection unit (3), all formed integrally so as to have a three dimensional configuration with uniform thickness with respect to a predetermined plane configuration in a thickness direction perpendicular to the predetermined plane configuration. Preferably, a guide unit (6) parallel to the spring unit (2) is also formed integrally. Further preferably, the contact probe is formed integrally also including a stopper (7) for each unitary configuration of the spring unit (2) constituted by a leaf spring.
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公开(公告)号：MY134671A
公开(公告)日：2007-12-31
申请号：MYPI20024844
申请日：2002-12-23
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： HAGA TSUYOSHI , SHIMADA SHIGEKI , KIMURA ATSUSHI
Abstract: A CONTACT PROBE COMPRISES A TIP PORTION (1) FOR MAKING CONTACT WITH A SUBJECT SURFACE (20), A SUPPORTING PORTION (3), AND A SPRING PORTION (2) FOR CONNECTING THE OTHER TWO MEMBERS. THE TIP PORTION (1) HAS A COMER PORTION WHOSE RADIUS OF CURVATURE IS LARGER THAN THAT OF THE OPPOSITE CORNER PORTION THAT MOVES IN THE LEAD DURING THE SCRUBBING BY THE PRESSING FORCE.THE INSULATING LAYER (25) ON THE SUBJECT SURFACE (20) IS SUFFICIENTLY REMOVED BY THE SCRUBBING TO SECURE THE ELECTRICAL CONTACT, AND THE AMOUNT OF SHAVINGS IS MINIMIZED DURING THE DISSOCIATION OF THE CONTACT PROBE. FORMATION OF SCRATCHES ON THE SUBJECT SURFACE (20) IS REDUCED. ANOTHER CONTACT PROBE FOR A BALL-SHAPED ELECTRODE HAS A TIP PORTION (1) WITH A RECESS, WHICH HAS A PROTRUSION AND BOTTOM.THE PROTRUSION BREAKS THE INSULATING LAYER (25) ON THE ELECTRODE TO SECURE THE ELECTRICAL CONTACT.THE BOTTOM MAKES CONTACT WITH THE ELECTRODE TO PREVENT THE PROTRUSION FROM EXCESSIVELY BITING THE ELECTRODE.(FIG 10)
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公开(公告)号：DE60236426D1
公开(公告)日：2010-07-01
申请号：DE60236426
申请日：2002-04-10
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： HAGA TSUYOSHI , OKADA KAZUNORI
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公开(公告)号：CA2522239A1
公开(公告)日：2004-10-14
申请号：CA2522239
申请日：2004-03-12
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： HAGA TSUYOSHI , OKUDA YASUHIRO , MASUDA YASUHITO , HAYASHI FUMIHIRO
IPC: H01R11/01 , G01R1/04 , G01R31/28 , H01L21/48 , H01L23/482 , H01L23/498 , H01R43/00 , H05K3/40
Abstract: An anisotropic electrically conductive film comprising a base film in the fo rm of a porous film made of synthetic resin and having an electric insulation property, and an electrically conductive metal adhered to a resin section of porous construction in such a manner as to penetrate from a first surface to a second surface at a plurality of places on the base film, wherein electrical ly conductive sections which can be made electrically conductivity in the direction of the film thickness are independently provided; and a method of producing the same.
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公开(公告)号：AU2003236276A1
公开(公告)日：2003-12-02
申请号：AU2003236276
申请日：2003-04-04
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： HAGA TSUYOSHI
IPC: H01R13/03 , H01R13/05 , H01R13/115 , H01R33/76
Abstract: An object of the present invention is to provide an electrode for high-density connection capable of attachment/detachment of a package or an FPC. In order to attain this object, a snap electrode according to the present invention has a tubular ring presenting a circular or polygonal section and at least one spring electrode provided in the ring and coupled to the ring, to be connected to a substrate or an FPC by holding a pin electrode of an insertion-mount type package or the FPC with the spring electrode. The snap electrode preferably consists of nickel or a nickel alloy or consists of copper or a copper alloy, and is preferably coated with a noble metal or conductive diamondlike carbon.
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