公开(公告)号：CA2080814A1

公开(公告)日：1992-08-26

申请号：CA2080814

申请日：1992-02-24

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HARADA KEIZO ,  TAKIKAWA TAKATOSHI ,  MAEDA TAKAO ,  BAN SHUNSUKE ,  YAMANAKA SHOSAKU

IPC: H01L23/14 ,  H01L23/495 ,  H01L23/498 ,  H05K1/05

公开(公告)号：DE69207285D1

公开(公告)日：1996-02-15

申请号：DE69207285

申请日：1992-06-29

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HARADA KEIZO ,  TAKIKAWA TAKATOSHI ,  MAEDA TAKAO ,  BAN SHUNSUKE ,  YAMANAKA SHOSAKU

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/14 ,  H01L23/495 ,  H05K1/05 ,  C23C16/22

Abstract: A plastic package type semiconductor device is composed of a rolled metal substrate (1) made of copper or copper alloy and an insulating film (2) formed on the surface of the substrate. The film may be a single-layer film made of silicon oxynitride or a composite film formed by laminating a silicon oxide layer and a silicon oxynitride layer (or a silicon nitride layer). A semiconductor element (8) is mounted on the film or on the exposed surface of the substrate. Other passive elements (3) are provided on the film. After connecting these elements with bonding wires, the entire device is sealed in a resin molding (13). This device is thus free of cracks due to difference in thermal expansion between the film and the substrate, or peeling due to moisture absorption.

公开(公告)号：CA2048498A1

公开(公告)日：1992-02-08

申请号：CA2048498

申请日：1991-08-06

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： SHIMODA KOUHEI ,  MAEDA TAKAO ,  SOGABE KOUICHI ,  MIYAKE MASAYA

IPC: C04B35/581 ,  H01L23/08 ,  H01L23/15

Abstract: Disclosed herein is an A l N sintered body which is colored, excellent in thermal conductivity and useful as an electronic material, and a method of preparing the same. The thermal conductive colored A l N sintered body contains 100 parts by weight of A l N, 0.005 to 0.5 parts by weight of carbon, not more than 1 part by weight of a boron compound in terms of the simple substance of boron, 0.01 to 15 parts by weight of a rare earth aluminum oxide in terms of the simple substance of the rare earth element, and 0.01 to 15 parts by weight of a compound containing an element belonging to the group IVB of the periodic table in terms of the simple substance of the element, and its thermal conductivity is 100 to 270 W/m.K at the ordinary temperature. This A l N sintered body is obtained by shaping a mixture into a prescribed configuration and thereafter firing the as-formed compact in a non-oxidizing atmosphere containing at least 10 percent by volume of nitrogen under a temperature of 1500 to 2100 DEG C.

公开(公告)号：DE69207507T2

公开(公告)日：1996-09-12

申请号：DE69207507

申请日：1992-02-24

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HARADA KEIZO ,  TAKIKAWA TAKATOSHI ,  MAEDA TAKAO ,  BAN SHUNSUKE ,  YAMANAKA SHOSAKU

IPC: H01L23/14 ,  H01L23/495 ,  H01L23/498 ,  H05K1/05 ,  H01L23/12

公开(公告)号：DE69207285T2

公开(公告)日：1996-08-29

申请号：DE69207285

申请日：1992-06-29

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HARADA KEIZO ,  TAKIKAWA TAKATOSHI ,  MAEDA TAKAO ,  BAN SHUNSUKE ,  YAMANAKA SHOSAKU

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/14 ,  H01L23/495 ,  H05K1/05 ,  C23C16/22

Abstract: A plastic package type semiconductor device is composed of a rolled metal substrate (1) made of copper or copper alloy and an insulating film (2) formed on the surface of the substrate. The film may be a single-layer film made of silicon oxynitride or a composite film formed by laminating a silicon oxide layer and a silicon oxynitride layer (or a silicon nitride layer). A semiconductor element (8) is mounted on the film or on the exposed surface of the substrate. Other passive elements (3) are provided on the film. After connecting these elements with bonding wires, the entire device is sealed in a resin molding (13). This device is thus free of cracks due to difference in thermal expansion between the film and the substrate, or peeling due to moisture absorption.

公开(公告)号：DE69207507D1

公开(公告)日：1996-02-22

申请号：DE69207507

申请日：1992-02-24

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HARADA KEIZO ,  TAKIKAWA TAKATOSHI ,  MAEDA TAKAO ,  BAN SHUNSUKE ,  YAMANAKA SHOSAKU

IPC: H01L23/14 ,  H01L23/495 ,  H01L23/498 ,  H05K1/05 ,  H01L23/12

公开(公告)号：CA2092767A1

公开(公告)日：1993-09-27

申请号：CA2092767

申请日：1993-03-26

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： TAKIKAWA TAKATOSHI ,  YAMANAKA SHOSAKU ,  MAEDA TAKAO ,  HARADA KEIZO ,  BAN SHUNSUKE

IPC: H01L23/14 ,  H01L23/495 ,  H01L23/498 ,  H01L23/32 ,  H01L23/373 ,  H01L23/66

Abstract: A semiconductor device which can reduce noise, which can be used for a variety of different purposes in a flexible manner, and which is suitable for automatic assembly. It has a metal board carrying a semiconductor device chip on the central part thereof. An insulating layer, a ceramic laminated wiring board, an organic film, and a lead frame are laminated one on another on the metal board so as to surround the semiconductor device chip. The lead frame is connected to the semiconductor device chip through the ceramic laminated wiring board. The assembly thus formed is sealed with a synthetic resin.

公开(公告)号：DE69402437T2

公开(公告)日：1997-12-04

申请号：DE69402437

申请日：1994-01-04

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： BAN SHUNSUKE ,  YOSHINO HIROSHI ,  MAEDA TAKAO ,  OOKA TSUTOMU

IPC: F01N3/02 ,  B01D39/20 ,  F01N3/022 ,  F01N3/027 ,  F02B3/06

Abstract: A particulate trap (11) for use in a diesel engine which can efficiently trap particulates contained in exhaust gas with low pressure drop and which can burn collected particulates for regeneration with lesser power consumption. A filter element (10) having a built-in electric heater (32) is mounted in a case provided in the exhaust line of a diesel engine. The filter (10) has two mutually opposed surfaces between which is mounted the electric heater (3). With this arrangement, it is possible to increase the filtration area and also the heating efficiency.

公开(公告)号：SG43219A1

公开(公告)日：1997-10-17

申请号：SG1996005746

申请日：1991-07-31

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： SHIMODA KOUHEI ,  SOGABE KOUICHI ,  MIYAKE MASAYA ,  MAEDA TAKAO

IPC: C04B35/581 ,  H01L23/08 ,  H01L23/15 ,  C04B35/58

Abstract: Disclosed herein is an A l N sintered body which is colored, excellent in thermal conductivity and useful as an electronic material, and a method of preparing the same. The thermal conductive colored A l N sintered body contains 100 parts by weight of A l N, 0.005 to 0.5 parts by weight of carbon, not more than 1 part by weight of a boron compound in terms of the simple substance of boron, 0.01 to 15 parts by weight of a rare earth aluminum oxide in terms of the simple substance of the rare earth element, and 0.01 to 15 parts by weight of a compound containing an element belonging to the group IVB of the periodic table in terms of the simple substance of the element, and its thermal conductivity is 100 to 270 W/m.K at the ordinary temperature. This A l N sintered body is obtained by shaping a mixture into a prescribed configuration and thereafter firing the as-formed compact in a non-oxidizing atmosphere containing at least 10 percent by volume of nitrogen under a temperature of 1500 to 2100 DEG C.

公开(公告)号：DE69402437D1

公开(公告)日：1997-05-15

申请号：DE69402437

申请日：1994-01-04

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： BAN SHUNSUKE ,  YOSHINO HIROSHI ,  MAEDA TAKAO ,  OOKA TSUTOMU

IPC: F01N3/02 ,  B01D39/20 ,  F01N3/022 ,  F01N3/027 ,  F02B3/06

Abstract: A particulate trap (11) for use in a diesel engine which can efficiently trap particulates contained in exhaust gas with low pressure drop and which can burn collected particulates for regeneration with lesser power consumption. A filter element (10) having a built-in electric heater (32) is mounted in a case provided in the exhaust line of a diesel engine. The filter (10) has two mutually opposed surfaces between which is mounted the electric heater (3). With this arrangement, it is possible to increase the filtration area and also the heating efficiency.