公开(公告)号：US20240162188A1

公开(公告)日：2024-05-16

申请号：US18356771

申请日：2023-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chajea JO ,  Dohyun KIM ,  Seungryong OH

IPC: H01L25/065 ,  H01L23/31

CPC classification number: H01L25/0652 ,  H01L23/3128 ,  H01L24/16 ,  H01L2224/16145 ,  H01L2224/16227

Abstract: A semiconductor package includes a substrate; a first chip structure on the substrate and having a first thickness in a first direction; a second chip structure on the substrate adjacent to the first chip structure along a second direction and having a second thickness in the first direction; a third chip structure on the substrate and adjacent to the first chip structure and the second chip structure in a third direction perpendicular to the second direction; and an encapsulant covering the first chip structure, the second chip structure, and the third chip structure, wherein the third chip structure includes a lower chip structure that overlaps a first portion of a space between the first chip structure and the second chip structure in the third direction, and an upper chip structure on the lower chip structure such that a second portion of the space is exposed in the third direction.

公开(公告)号：US20200340476A1

公开(公告)日：2020-10-29

申请号：US16861673

申请日：2020-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon PARK ,  Sunghea CHO ,  Jongcheun SEO ,  Namkyu CHO ,  Dohyun KIM ,  Junguk JUN

IPC: F04C18/02 ,  F04C29/12

Abstract: A scroll compressor includes a main body, a cover to divide the main body into a low pressure section and a high pressure section, a fixed scroll including a first discharge port, an orbiting scroll to rotate with respect to the fixed scroll and to form a compression chamber together with the fixed scroll, a discharge guide disposed between the fixed scroll and the cover and including a second discharge port connected to the first discharge port, and a back pressure actuator configured to form a back pressure chamber together with the discharge guide and to move in a direction toward the cover with respect to the discharge guide to selectively connect the second discharge port with the high pressure section. The fixed scroll includes a bypass flow path connecting the compression chamber and the second discharge port and a bypass valve to open or close the bypass flow path.

公开(公告)号：US20230366401A1

公开(公告)日：2023-11-16

申请号：US18358408

申请日：2023-07-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yanghee CHO ,  Sunghea CHO ,  Dohyun KIM ,  Jongcheun SEO ,  Junguk JUN ,  Namkyu CHO

IPC: F04C29/12 ,  F04C18/02

CPC classification number: F04C29/12 ,  F04C18/0215

Abstract: A scroll compressor is provided. The scroll compressor includes a fixed scroll having an outlet and multiple release holes, a release valve ring installed on the top surface of the fixed scroll and formed to open and close the multiple release holes, and a retainer ring installed on the release valve ring and formed to restrict the movement of the release valve ring. The release valve ring has a ring shape, and comprises a fixing part, multiple release valves, and at least one connection part. The retainer ring comprises a retainer fixing part, multiple retainers, and at least one retainer connection part connecting at least one of the multiple retainers to the retainer fixing part.

公开(公告)号：US20250105127A1

公开(公告)日：2025-03-27

申请号：US18659864

申请日：2024-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dohyun KIM ,  Yeongseon KIM ,  JUHYEON KIM ,  HYOEUN KIM ,  SUNKYOUNG SEO ,  Haksun LEE

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/48 ,  H01L23/528 ,  H01L23/544 ,  H01L25/10

Abstract: A semiconductor package may include a first dielectric structure, a first pad in the first dielectric structure, a first semiconductor chip provided on the first dielectric structure, and a bump electrically connected to the first pad. The first semiconductor chip includes: a first substrate; a first chip dielectric layer in contact with the first dielectric structure; and a first chip pad in contact with a top surface of the first pad. The first pad may be provided between the bump and the first chip of the first semiconductor chip. The first pad may include a first conductive layer and a second conductive layer covered by the first conductive layer. The bump may be positioned closer to the first conductive layer than to the second conductive layer.

公开(公告)号：US20240290669A1

公开(公告)日：2024-08-29

申请号：US18385082

申请日：2023-10-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunkyoung SEO ,  Dohyun KIM ,  Yeongseon KIM ,  Juhyeon KIM ,  Hyoeun KIM ,  Jeongoh HA

IPC: H01L21/66 ,  H01L23/00 ,  H01L25/065 ,  H10B80/00

CPC classification number: H01L22/32 ,  H01L24/08 ,  H01L25/0657 ,  H10B80/00 ,  H01L2224/08145 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/1436

Abstract: A semiconductor structure according to an embodiment may include: an interconnect structure on a substrate; an interlayer dielectric layer on the interconnect structure; a first conductive pad within the interlayer dielectric layer and electrically coupled with the interconnect structure; a second conductive pad within the interlayer dielectric layer and electrically decoupled from the interconnect structure; a first via plug within the interlayer dielectric layer; and a bonding structure on the interlayer dielectric layer and including a first bonding pad, a plurality of second bonding pads, and a bonding dielectric layer, wherein the first bonding pad is electrically coupled to the first via plug, some of the plurality of second bonding pads are spaced apart from the first conductive pad in a vertical direction, and others of the plurality of second bonding pads are spaced apart from the second conductive pad in the vertical direction.

公开(公告)号：US20240243111A1

公开(公告)日：2024-07-18

申请号：US18489493

申请日：2023-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chajea JO ,  Dohyun KIM ,  SeungRyong OH

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/522 ,  H01L25/065

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/5226 ,  H01L24/16 ,  H01L25/0657 ,  H01L24/17 ,  H01L24/30 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/30181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253

Abstract: A semiconductor package includes a lower package and an upper package on the lower package. The lower package includes a first substrate, chip stacks on the first substrate, a first mold structure on the first substrate that covers the chip stacks, and a second substrate on the first mold structure. The chip stacks include a first semiconductor chip and a second semiconductor chip on the first semiconductor chip. The first semiconductor chip includes a first semiconductor substrate, a first wiring layer adjacent the first semiconductor substrate and including wiring patterns, a first circuit layer on the first semiconductor substrate and including a transistor and circuit wirings connected to the transistor, and a chip through electrode penetrating at least a portion of the first circuit layer and the first semiconductor substrate and a height of the chip through electrode ranges from 2 μm to 50 μm.

公开(公告)号：US20230196499A1

公开(公告)日：2023-06-22

申请号：US18096363

申请日：2023-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dohyun KIM ,  Joonyong PARK

IPC: G06T1/20 ,  G06T1/60

CPC classification number: G06T1/20 ,  G06T1/60 ,  G06T2200/24

Abstract: Provided is an electronic device including a first processor configured to generate frames by performing render operation stages based on graphics data, a memory configured to store an application to obtain information corresponding to the first processor, a display, and a second processor electrically connected to the first processor, the memory, and the display, wherein the second processor is configured to execute the application, obtain render stage information corresponding to the frames through the executed application, extract first render stage information corresponding to a first frame, among the frames, from the obtained render stage information, process the extracted first render stage information, and control the display to display a user interface (UI) screen including the processed first render stage information.

公开(公告)号：US20220156877A1

公开(公告)日：2022-05-19

申请号：US17544411

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyun KIM ,  Igor NAZAROV

IPC: G06T1/20 ,  H04N7/01

Abstract: An electronic device is provided. The electronic devices includes a display, a memory, and a processor configured to be operatively connected to the display and the memory. The processor is configured to generate a main thread related to a user input and data processing on an application in response to execution of the application and a render thread related to rendering image data in units of frames based on data processed in the main thread, configure a target frame rate for displaying an execution screen of the application on the display, calculate an expected processing time of a current frame based on a processing time of at least one previous frame output through the display, determine a time margin based on the target frame rate and the calculated expected processing time, and perform the user input and data processing after the main thread waits in a sleep state for the time margin.

公开(公告)号：US20210285444A1

公开(公告)日：2021-09-16

申请号：US17199267

申请日：2021-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghea CHO ,  Junghoon PARK ,  Jongcheun SEO ,  Namkyu CHO ,  Dohyun KIM ,  Junguk JUN

IPC: F04C15/00 ,  F04C2/02

Abstract: Provided is a scroll compressor with enhanced sealing structure of a back pressure chamber. The scroll compressor includes a housing, a fixed scroll fixed to inside of the housing and including a fixed wrap, an orbit scroll including an orbit wrap which forms a compression chamber together with the fixed wrap, a back pressure chamber formed at a frame supporting the orbit scroll, and accommodating refrigerant for pressurizing the orbit scroll to a direction of the fixed scroll, and a sealing ring arranged between the fixed scroll and the orbit scroll to prevent the refrigerant in the back pressure chamber from flowing in or out through a gap between the fixed scroll and the orbit scroll, wherein the sealing ring includes a cut portion cut for the sealing ring to be deformable in a circumferential direction.

公开(公告)号：US20240342336A1

公开(公告)日：2024-10-17

申请号：US18755195

申请日：2024-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongkwan CHO ,  Youngchul KO ,  Keonpyo KOO ,  Dohyun KIM ,  Kyoungmok KIM ,  Donghyo KIM

IPC: A61L9/20 ,  A61L9/014 ,  B01D53/00 ,  B01D53/04 ,  B01D53/88 ,  B09B3/35 ,  B09B3/38 ,  B09B3/40 ,  B09B101/70

CPC classification number: A61L9/205 ,  A61L9/014 ,  B01D53/007 ,  B01D53/04 ,  B01D53/885 ,  B09B3/35 ,  B09B3/38 ,  B09B3/40 ,  A61L2209/12 ,  A61L2209/22 ,  B01D2253/102 ,  B01D2257/90 ,  B01D2258/0275 ,  B01D2259/804 ,  B09B2101/70

Abstract: A food waste disposal apparatus, according to one embodiment of the present disclosure, comprises: a chamber for accommodating food waste; and a deodorizing device for deodorizing gas inside the chamber. The deodorizing device may comprise: a photocatalyst filter arranged to be inclined; a light source unit for irradiating light having a frequency within a specific range to the photocatalyst filter; and an activated carbon filter in which activated carbon is accommodated so as to deodorize gas passing through the photocatalyst filter.