公开(公告)号：US20160050744A1

公开(公告)日：2016-02-18

申请号：US14826207

申请日：2015-08-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eung-chang LEE ,  Seok-jae HAN

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L23/49822 ,  H01L24/00 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83224 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/181 ,  H05K1/113 ,  H05K1/115 ,  H05K2201/09345 ,  H05K2201/096 ,  H05K2201/10159 ,  H05K2201/10674 ,  H05K2201/10969 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00

Abstract: An electronic device and semiconductor package include a printed circuit board and a semiconductor device mounted thereon. The printed circuit board includes one or more thermally conductive vias for dissipating heat.

Abstract translation: 电子器件和半导体封装包括安装在其上的印刷电路板和半导体器件。 印刷电路板包括用于散热的一个或多个导热通孔。