公开(公告)号：US20190214358A1

公开(公告)日：2019-07-11

申请号：US16038334

申请日：2018-07-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Su HA ,  Gun Rae KIM ,  Cheol Hyeon PARK ,  In Hak BAICK ,  Sang Chul SHIN

IPC: H01L23/00

CPC classification number: H01L24/17 ,  H01L23/562 ,  H01L24/08 ,  H01L24/11 ,  H01L24/32 ,  H01L24/81 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079

Abstract: A semiconductor device including a high-reliability bump structure including a pillar structure is provided. The semiconductor device includes a substrate, a connection pad on the substrate, and a bump structure on the connection pad, wherein the bump structure includes a pillar structure having a side wall and an upper surface, a metal protection film including a first portion extending along the side wall of the pillar structure and a second portion extending along the upper surface of the pillar structure, and a solder layer on the second portion of the metal protection film.