公开(公告)号：EP3771108A1

公开(公告)日：2021-01-27

申请号：EP20163318.7

申请日：2020-03-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： KIM, Youngmin ,  PARK, Hongjong ,  YOON, Daeyoung ,  LEE, Sunwoo ,  LEE, Youngki ,  CHOI, Dooseok

IPC: H04B1/04 ,  H04B1/18 ,  H04B1/036

Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a first active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves. The RF chip is on a bottom surface of the multilayer board, and includes transmission circuits each of which constitutes a part of each of transmission paths for generating RF signals to be provided to the antenna. The first active device array is on the bottom surface of the multilayer board, and includes a first group of active devices respectively included in a portion of power amplifiers in the transmission paths of the transmission circuits, and first input pins and first output pins respectively connected to electrodes of the first group of active devices.