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    SHIELDING MEMBER AND ELECTRONIC DEVICE INCLUDING THE SAME
    1.
    发明申请
    SHIELDING MEMBER AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
    屏蔽部件和包括该部件的电子设备

    公开(公告)号：WO2017188615A1

    公开(公告)日：2017-11-02

    申请号：PCT/KR2017/003638

    申请日：2017-04-03

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： BANG, Jung-Je ,  PARK, Min ,  YE, Jae-Heung ,  LEE, Yong-Won ,  KIM, Sang-Seob ,  KIM, Jun-Yeong

    IPC: H05K9/00 ,  C09J11/04 ,  C09J9/02 ,  C09J7/02 ,  C09J163/00 ,  C09J167/00

    Abstract: A shielding member is of a film type and includes an insulating layer, a shielding layer formed on a surface of the insulating layer, and a resin adhesive layer formed on a surface of the shielding layer. The resin adhesive layer may include a thermoplastic resin adhesive having an electrically conductive powder. The resin adhesive layer of the shielding member stably maintains connection with the ground after curing, thereby providing a stable operating environment of the electronic device.

    Abstract translation: 屏蔽构件是膜型的并且包括绝缘层，形成在绝缘层的表面上的屏蔽层以及形成在屏蔽层的表面上的树脂粘合剂层。 树脂粘合剂层可以包括具有导电粉末的热塑性树脂粘合剂。 屏蔽部件的树脂粘合剂层在固化后稳定地保持与地面的连接，由此提供电子装置的稳定操作环境。

    ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
    2.
    发明申请
    ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME 审中-公开
    电子装置及其制造方法

    公开(公告)号：WO2017122955A1

    公开(公告)日：2017-07-20

    申请号：PCT/KR2016/015460

    申请日：2016-12-29

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： BANG, Jung-Je ,  LEE, Yong-Won ,  KIM, Jeong-Ung ,  YE, Jae-Heung

    IPC: H05K9/00 ,  H05K1/11 ,  H05K3/34

    CPC classification number: H05K5/0004 ,  H01R4/02 ,  H05K1/18 ,  H05K5/0086 ,  H05K9/0007 ,  H05K9/0028

    Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.

    Abstract translation: 根据实施例，一种电子设备包括：壳体，包括面向第一方向的面; 电路板，其包括基本上平行于所述面的第一和第二板面以及面向第二方向的侧板面，所述电路板设置在所述壳体内; 布置在所述第一板面的第一区域中的第一部件; 设置在所述第二板面的与所述第一区域重叠的第二区域中的第二组件; 第一护罩，其包括形成为面向所述第二方向的第一侧壁，所述第一护罩覆盖所述第一区域; 第二护罩，其包括形成为面向所述第二方向的第二侧壁，所述第二护罩覆盖所述第二区域; 以及形成在第一侧壁或第二侧壁与侧板面之间的接合材料。 如上所述的电子设备可根据实施例不同地实现。

    ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
    6.
    发明公开
    ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME 审中-公开
    电子装置及其制造方法

    公开(公告)号：EP3193573A1

    公开(公告)日：2017-07-19

    申请号：EP17150113.3

    申请日：2017-01-03

    Applicant: Samsung Electronics Co., Ltd

    Inventor： BANG, Jung-Je ,  LEE, Yong-Won ,  KIM, Jeong-Ung ,  YE, Jae-Heung

    IPC: H05K9/00

    CPC classification number: H05K5/0004 ,  H01R4/02 ,  H05K1/18 ,  H05K5/0086 ,  H05K9/0007 ,  H05K9/0028

    Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction , the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.

    Abstract translation: 根据实施例，一种电子设备包括：壳体，包括面向第一方向的面; 电路板，其包括基本上平行于所述面的第一和第二板面以及面向第二方向的侧板面，所述电路板设置在所述壳体内; 布置在所述第一板面的第一区域中的第一部件; 设置在所述第二板面的与所述第一区域重叠的第二区域中的第二组件; 第一护罩，其包括形成为面向所述第二方向的第一侧壁，所述第一护罩覆盖所述第一区域; 第二护罩，其包括形成为面向所述第二方向的第二侧壁，所述第二护罩覆盖所述第二区域; 以及形成在第一侧壁或第二侧壁与侧板面之间的接合材料。 如上所述的电子设备可以根据实施例不同地实现。

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