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公开(公告)号:EP4552187A1
公开(公告)日:2025-05-14
申请号:EP23836117.4
申请日:2023-07-07
Applicant: Samtec, Inc.
Inventor: SEGER, Joseph B., Jr. , BIRCH, Daniel R. , BERAUN, David S. , HOLLAND, Troy B.
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公开(公告)号:WO2021231024A1
公开(公告)日:2021-11-18
申请号:PCT/US2021/027587
申请日:2021-04-16
Applicant: SAMTEC, INC.
Inventor: BIRCH, Daniel R.
IPC: H01R13/66 , H01R24/38 , H01R103/00
Abstract: A connector includes a housing including a conductive material, a base connected to the housing and including a base center hole and a base groove extending from the base center hole to an edge of the base, a center pin including a trunk and a leg extending perpendicular or substantially perpendicular to the trunk, and a protrusion protruding from the leg to provide electrical contact to a pad on a printed circuit board.
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公开(公告)号:EP4552189A1
公开(公告)日:2025-05-14
申请号:EP23836122.4
申请日:2023-07-07
Applicant: Samtec, Inc.
Inventor: BIRCH, Daniel R. , HOLLAND, Troy B.
IPC: H01R24/38 , H01R13/6589
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公开(公告)号:EP4406071A2
公开(公告)日:2024-07-31
申请号:EP22873590.8
申请日:2022-09-22
Applicant: Samtec, Inc.
Inventor: GARRISON, Kelly F. , HALL, Thomas A., III , BIRCH, Daniel R. , BUCK, Jonathan E. , FAITH, Chadrick P. , SHELLY, Christopher W.
IPC: H01R13/646 , H01R13/629
CPC classification number: H01R24/50 , H01R13/2464 , H01R24/44 , H01R2103/0020130101
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公开(公告)号:WO2023049281A2
公开(公告)日:2023-03-30
申请号:PCT/US2022/044414
申请日:2022-09-22
Applicant: SAMTEC, INC.
Inventor: GARRISON, Kelly F. , HALL, Thomas A., III , BIRCH, Daniel R. , BUCK, Jonathan E. , FAITH, Chadrick P. , SHELLEY, Christopher W.
IPC: H01R13/646 , H01R13/629
Abstract: An electrical connector includes a housing and an aligner. The aligner is defined by a connector base of the housing or by an alignment peg. The aligner defined by the connector base is configured to cooperate with a corresponding fiducial to properly align the electrical connector on a mounting surface of a substrate. The aligner defined by an alignment peg includes a main body and an embossed portion that defines a protrusion that extends from the main body. The embossed portion is configured to mate with a raised or recessed portion of a substrate to properly locate and align the electrical connector to the substrate.
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