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公开(公告)号：US20190381779A1
公开(公告)日：2019-12-19
申请号：US16012500
申请日：2018-06-19
Applicant: Sensel, Inc.
Inventor： Scott Gregory ISAACSON , Ilya Daniel ROSENBERG , Stephanie Jeanne OBERG , Brogan Carl MILLER
Abstract: Techniques for modifying surfaces of electrodes are provided. An electrode surface can be processed by applying an abrasive material or chemical solution to or against the surface to modify the surface to reduce the amount of roughness on, and/or alter the shape of, the surface. The shape of the surface can be altered by rounding or doming the surface. During surface processing, flexible or compressible support material can be applied to the back of an abrasive material, such as sandpaper, to desirably distribute pressure from the support material to the sandpaper and/or mold the shape of the sandpaper to facilitate maintaining desirable contact by the sandpaper on electrode surfaces. With regard to a flexible circuit board on which electrodes are formed, a vacuum chuck component or a temporary abrasive can be used to hold the circuit board in a flat and stationary position during surface processing.
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公开(公告)号：US20220011890A1
公开(公告)日：2022-01-13
申请号：US17484853
申请日：2021-09-24
Applicant: Sensel, Inc.
Inventor： Ilya Daniel ROSENBERG
Abstract: A method for improving flexibility of a circuit board, e.g., comprising a touch-based sensor, and reducing manufacturing costs by eliminating routing around a border of the touch-based sensor is presented herein. The method comprises forming an array of touch sensors on a first side of the circuit board, in which portions of the circuit board located between three edges of the circuit board and a border of the array of touch sensors exclude traces; and forming first traces between respective second traces in a singular direction on a second side of the circuit board, in which the first traces are electrically coupled, using a first group of vias, to respective rows of the array of touch sensors, and the second traces are electrically coupled, using a second group of vias, to respective columns of the array of touch sensors.
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Patent Agency Ranking
公开(公告)号：US20220137744A1
公开(公告)日：2022-05-05
申请号：US17492470
申请日：2021-10-01
Applicant: Sensel, Inc.
Inventor： Ilya Daniel ROSENBERG , Stephanie Jeanne OBERG , Scott Gregory ISAACSON , Elliott Chen Wu , Darren Lochun , Alexander Meagher Grau , Jacob Terracina
Abstract: The disclosed subject matter provides structures, devices, and methods for environmental compensation of temperature and humidity impacts on resistive force or touch sensor devices. Accordingly, various disclosed embodiments can be configured to determine sheet resistance of a device comprising force-sensing membrane and to apply an environmental compensation factor based on the sheet resistance. Further disclosed embodiments are directed to devices, systems and methods associated with disclosed environmental compensating elements and methods related thereto.
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公开(公告)号：US20200241727A1
公开(公告)日：2020-07-30
申请号：US16847595
申请日：2020-04-13
Applicant: Sensel, Inc.
Inventor： Tomer MOSCOVICH , Ilya Daniel ROSENBERG
IPC: G06F3/041 , G06F3/044 , G06F3/0488
Abstract: Facilitating dynamic adjustment of a click/unclick threshold corresponding to a force-based tactile sensor is presented herein. A system can comprise a tactile sensor comprising force-based sensor(s); and a motion detection component that can determine a rate of change of a movement that has been detected via a group of sensors comprising the force-based sensor(s), and based on the rate of change of the movement, modify a defined sensitivity of the force-based sensor(s) with respect to detection of a click and/or unclick event corresponding to the tactile sensor. Further, the motion detection component can decrease the defined sensitivity with respect to detection of the click and/or unclick event in response to the rate of change being determined to satisfy a defined condition representing an increase in the speed at which the stylus or the finger has moved across the tactile sensor.
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公开(公告)号：US20230400947A1
公开(公告)日：2023-12-14
申请号：US18455434
申请日：2023-08-24
Applicant: Sensel, Inc.
Inventor： Tomer MOSCOVICH , Ilya Daniel ROSENBERG
IPC: G06F3/041 , G06F3/044 , G06F3/0488
CPC classification number: G06F3/04186 , G06F3/0446 , G06F3/0488 , G06F3/0418 , G06F3/04144 , G06F2203/04102 , G06F3/042
Abstract: Facilitating dynamic adjustment of a click/unclick threshold corresponding to a force-based tactile sensor is presented herein. A system can comprise a tactile sensor comprising force-based sensor(s); and a motion detection component that can determine a rate of change of a movement that has been detected via a group of sensors comprising the force-based sensor(s), and based on the rate of change of the movement, modify a defined sensitivity of the force-based sensor(s) with respect to detection of a click and/or unclick event corresponding to the tactile sensor. Further, the motion detection component can decrease the defined sensitivity with respect to detection of the click and/or unclick event in response to the rate of change being determined to satisfy a defined condition representing an increase in the speed at which the stylus or the finger has moved across the tactile sensor.
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公开(公告)号：US20200218373A1
公开(公告)日：2020-07-09
申请号：US16733190
申请日：2020-01-02
Applicant: Sensel, Inc.
Inventor： Ilya Daniel ROSENBERG
Abstract: A method for improving flexibility of a circuit board, e.g., comprising a touch-based sensor, and reducing manufacturing costs by eliminating routing around a border of the touch-based sensor is presented herein. The method comprises forming an array of touch sensors on a first side of the circuit board, in which portions of the circuit board located between three edges of the circuit board and a border of the array of touch sensors exclude traces; and forming first traces between respective second traces in a singular direction on a second side of the circuit board, in which the first traces are electrically coupled, using a first group of vias, to respective rows of the array of touch sensors, and the second traces are electrically coupled, using a second group of vias, to respective columns of the array of touch sensors.
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公开(公告)号：US20170075496A1
公开(公告)日：2017-03-16
申请号：US15271953
申请日：2016-09-21
Applicant: Sensel, Inc.
Inventor： Ilya Daniel ROSENBERG , John Aaron ZARRAGA
CPC classification number: G06F3/0418 , G01L1/146 , G01L1/205 , G06F3/03545 , G06F3/0414 , G06F3/0416 , G06F3/044 , G06F3/045 , G06F3/046 , G06F3/047 , G06F2203/04103 , G06F2203/04104 , G06F2203/04105 , G06F2203/04106
Abstract: A touch sensor detector system and method incorporating a diamond patterned optionally-interpolated sensor array is disclosed. The system and method utilize a touch sensor array (TSA) configured to detect proximity/contact/pressure (PCP) via a variable impedance array (VIA) electrically coupling interlinked/independent impedance columns (IIC) coupled to an array column driver (ACD), and interlinked/independent impedance rows (IIR) coupled to an array row sensor (ARS). The ACD is configured to select the IIC based on a column switching register (CSR) and electrically drive the IIC using a column driving source (CDS). The VIA conveys current from the driven IIC to the IIC sensed by the ARS. The ARS selects the IIR within the TSA and electrically senses the IIR state based on a row switching register (RSR). Interpolation of ARS sensed current/voltage allows accurate detection of TSA PCP and/or spatial location.
Abstract translation: 公开了一种结合有金刚石图案的任选插值的传感器阵列的触摸传感器检测器系统和方法。 该系统和方法利用配置成通过电耦合耦合到阵列列驱动器（ACD）的互连/独立阻抗列（IIC）的可变阻抗阵列（VIA）来检测接近/接触/压力（PCP）的触摸传感器阵列（TSA） ，以及耦合到阵列行传感器（ARS）的互连/独立阻抗行（IIR）。 ACD配置为基于列切换寄存器（CSR）选择IIC，并使用列驱动源（CDS）电驱动IIC。 威盛（VIA）传达了从驱动的IIC到由ARS感测到的IIC的电流。 ARS选择TSA内的IIR，并根据行切换寄存器（RSR）电触发IIR状态。 ARS感测电流/电压的插值可以准确检测TSA PCP和/或空间位置。
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