公开(公告)号：US20220137744A1

公开(公告)日：2022-05-05

申请号：US17492470

申请日：2021-10-01

Applicant: Sensel, Inc.

Inventor： Ilya Daniel ROSENBERG ,  Stephanie Jeanne OBERG ,  Scott Gregory ISAACSON ,  Elliott Chen Wu ,  Darren Lochun ,  Alexander Meagher Grau ,  Jacob Terracina

IPC: G06F3/041 ,  G06F3/045

Abstract: The disclosed subject matter provides structures, devices, and methods for environmental compensation of temperature and humidity impacts on resistive force or touch sensor devices. Accordingly, various disclosed embodiments can be configured to determine sheet resistance of a device comprising force-sensing membrane and to apply an environmental compensation factor based on the sheet resistance. Further disclosed embodiments are directed to devices, systems and methods associated with disclosed environmental compensating elements and methods related thereto.

公开(公告)号：US12197676B2

公开(公告)日：2025-01-14

申请号：US17492470

申请日：2021-10-01

Applicant: Sensel, Inc.

Inventor： Ilya Daniel Rosenberg ,  Stephanie Jeanne Oberg ,  Scott Gregory Isaacson ,  Elliott Chen Wu ,  Darren Lochun ,  Alexander Meagher Grau ,  Jacob Terracina

IPC: G06F3/041 ,  G06F3/045

Abstract: The disclosed subject matter provides structures, devices, and methods for environmental compensation of temperature and humidity impacts on resistive force or touch sensor devices. Accordingly, various disclosed embodiments can be configured to determine sheet resistance of a device comprising force-sensing membrane and to apply an environmental compensation factor based on the sheet resistance. Further disclosed embodiments are directed to devices, systems and methods associated with disclosed environmental compensating elements and methods related thereto.

公开(公告)号：US12299209B2

公开(公告)日：2025-05-13

申请号：US18141308

申请日：2023-04-28

Applicant: Sensel, Inc.

Inventor： Ninad Sathe ,  Ilya Daniel Rosenberg ,  Jacob Terracina

IPC: G06F3/02 ,  G06F3/01 ,  H01H13/85 ,  H01H3/00 ,  H01H13/785

Abstract: One variation for a seamless touch sensor includes: a substrate, a baseplate, a haptic actuator, a cover layer, and a controller. The substrate includes: a top layer including a set of drive and sense electrode pairs; and a bottom layer including an array of force sensors. The baseplate: is arranged below the substrate; and including an array of spring elements coupling the baseplate to the substrate. The haptic actuator is arranged below the substrate and includes: a multi-layer inductor; and a first magnetic element facing the multi-layer inductor. The cover layer is arranged over the substrate to define a continuous surface defining an active region and a inactive touch region. The controller is configured to drive an oscillating voltage across the multi-layer inductor to: induce alternating magnetic coupling between the multi-layer inductor and the magnetic element; and oscillate the active touch region of the cover layer relative to the magnetic element.

公开(公告)号：US20240281083A1

公开(公告)日：2024-08-22

申请号：US18607048

申请日：2024-03-15

Applicant: Sensel, Inc.

Inventor： Jacob Terracina ,  Ilya Daniel Rosenberg ,  Shuangming Li ,  Darren Lochun ,  Tomer Moscovich

IPC: G06F3/041 ,  G06F3/044

CPC classification number: G06F3/04142 ,  G06F3/04166 ,  G06F3/044

Abstract: A system includes: a substrate including an edge supported by a chassis; a first electrode spanning a first area of the substrate and arranged proximal a center of the substrate; and a second electrode spanning a second area, greater than the first area, on the substrate and interposed between the first electrode and the edge of the substrate. The system further includes a first coupling region: facing the first electrode; and electrically coupling to the first electrode to yield a first electrical value at the first electrode responsive to application of a first force magnitude proximal the center of the substrate. The system also includes a second coupling region: facing the second electrode; and electrically coupling to the second electrode to yield a second electrical value, approximating the first electrical value, at the second electrode responsive to application of the first force magnitude proximal the center of the substrate.

公开(公告)号：US20240319822A1

公开(公告)日：2024-09-26

申请号：US18615863

申请日：2024-03-25

Applicant: Sensel, Inc.

Inventor： Ninad Sathe ,  Ilya Daniel Rosenberg ,  Kirsten Etzold ,  Tomer Moscovich ,  Darren Lochun ,  Jacob Terracina ,  Yasukazu Nakatani

IPC: G06F3/041 ,  G06F3/01

CPC classification number: G06F3/0418 ,  G06F3/016

Abstract: A touch assembly includes: an outer tip; an inner tip; a circuit board; a vibration sensor; and a spring element. The outer tip includes a distal end defining an outer contact surface. The inner tip: is arranged concentrically within the outer tip; extends from the distal end of the outer tip; and defines an inner contact surface. The circuit board is arranged over a proximal end of the outer tip. The spring element: is interposed between the circuit board and the inner tip; couples the inner tip to a reference potential; and is configured to, during a haptic feedback cycle at a touch sensor in response to application of the inner tip toward the touch sensor, yield to locate the inner contact surface coplanar with the outer contact surface. The vibration sensor is arranged on the circuit board and configured to output vibration signals during the haptic feedback cycle.

公开(公告)号：US20230266829A1

公开(公告)日：2023-08-24

申请号：US18141308

申请日：2023-04-28

Applicant: Sensel, Inc.

Inventor： Ninad Sathe ,  Ilya Daniel Rosenberg ,  Jacob Terracina

IPC: G06F3/02 ,  H01H13/85 ,  G06F3/01

CPC classification number: G06F3/0202 ,  H01H13/85 ,  G06F3/016 ,  H01H2201/036 ,  H01H2003/008

Abstract: One variation for a seamless touch sensor includes: a substrate, a baseplate, a haptic actuator, a cover layer, and a controller. The substrate includes: a top layer including a set of drive and sense electrode pairs; and a bottom layer including an array of force sensors. The baseplate: is arranged below the substrate; and including an array of spring elements coupling the baseplate to the substrate. The haptic actuator is arranged below the substrate and includes: a multi-layer inductor; and a first magnetic element facing the multi-layer inductor. The cover layer is arranged over the substrate to define a continuous surface defining an active region and a inactive touch region. The controller is configured to drive an oscillating voltage across the multi-layer inductor to: induce alternating magnetic coupling between the multi-layer inductor and the magnetic element; and oscillate the active touch region of the cover layer relative to the magnetic element.