公开(公告)号：JPH0481674A

公开(公告)日：1992-03-16

申请号：JP19544690

申请日：1990-07-24

Applicant: SHARP KK

Inventor： FUKUNAGA SATORU ,  SHIMOYAMA AKIO ,  HISATOMI JUNICHIRO

IPC: G01R31/26 ,  G01R1/073 ,  H01L21/66

Abstract: PURPOSE:To secure certain electric contact by securing electric contact with a probe pin corresponding to a non-contacting lead with a lead fixing jig after highly accurate positioning of an IC by means of image recognition or the like. CONSTITUTION:An IC 1 is a flat packaged IC with leads cut. After the IC 1 is highly accurately positioned by image recognition or the like so that it is aligned to a position of a probe pin 3 which has been placed corresponding to a lead 2 of the IC 1, it is mounted on an IC mount 4. Then, a lead tip 2a and a part close to lead resin 2b of the IC 1 are fixed by non-conductive lead fixing jigs 5 from upward and downward. The lead fixing jig 5 is provided with a hole 5c which permits the probe pin 3 through, wherein a non-contact part 2c between the lead 2 and the fixing jig 5 exists. The probe pin 3 is elevated and passed through the hole 5c provided on the lead fixing jig 5 to secure electric contact with the lead 2. The probe pin 3 houses a compression coil spring so that pressure force more than needed may not be applied to the lead 2.

公开(公告)号：JPH08264585A

公开(公告)日：1996-10-11

申请号：JP6949295

申请日：1995-03-28

Applicant: SHARP KK

Inventor： HISATOMI JUNICHIRO

IPC: H01L21/60

Abstract: PURPOSE: To provide a bonding device and a bonding method which can eliminate bonding defect almost entirely. CONSTITUTION: A bonding tool 1 has a main bonding head 1b and a sub-bonding head 1a. The sub-bonding head 1a has a separate pressing surface 1a-1 which can be protruded from a batch pressing surface lb-1 of the main head 1b. Thereby, the sub-head 1a can selectively press only an inner lead 9b of a junction defect place to a bump electrode B by the separate pressing surface 1a-1.

公开(公告)号：JPH05223872A

公开(公告)日：1993-09-03

申请号：JP2287992

申请日：1992-02-07

Applicant: TABAI ESPEC CORP ,  SHARP KK

Inventor： NAKAMURA KAZUHIRO ,  OI KENICHI ,  TANAKA HIDEKI ,  TABUCHI MASAYUKI ,  FUKUNAGA SATORU ,  HISATOMI JUNICHIRO

IPC: G01R31/00 ,  G01R31/01 ,  G01R31/26 ,  G01R31/28 ,  H01L21/66

Abstract: PURPOSE:To provide a package test device which can test packages on a package tape effectively, safely, and in a great quantity without cutting the package tape. CONSTITUTION:At an inlet station 2 a package tape PT paid off from a tape supply device 1 is fitted in a package socket on a test board 9. This is pushed out bit by bit by an inlet pusher 3 onto a roller conveyor 10 in the test area TA and laid in line, and a contact device E is connected with the test board 9 where each package tape PT is loaded followed by execution of the test on IC package, which is sent off to an outlet station 4 through the action of the inlet pusher 3 which pushes out the test board 9. The outlet station 4 supports the test board 9 with a reaction force pusher 5 which is retractable while supporting the test board 9 and a brake device 6 inhibiting the inertial force of the test board 9.

公开(公告)号：JPH05221431A

公开(公告)日：1993-08-31

申请号：JP2287792

申请日：1992-02-07

Applicant: TABAI ESPEC CORP ,  SHARP KK

Inventor： NAKAMURA KAZUHIRO ,  OI KENICHI ,  TANAKA HIDEKI ,  TABUCHI MASAYUKI ,  FUKUNAGA SATORU ,  HISATOMI JUNICHIRO

IPC: B65B69/00 ,  B65B15/04 ,  B65H19/14 ,  H05K13/02

Abstract: PURPOSE:To provide a package tape take-off device capable of automatically, safely taking off package tapes from package sockets which are sent in turn, holding the package tapes that have undergone specified tests and processes. CONSTITUTION:A package tape take-off device is provided with a latch driving roller 71, a tape wind-up reel 73b, a tape guide roller 72 and a detecting sensor, and package sockets 93 which clamp package tapes PT are arranged on test boards 9 and sent to the package take-off device. The latch driving roller 71 is located at a specified position along the track of the package sockets 93 on the boards 9 and comes in contact with latches and moves the latches to the unlock position. The wind-up reel 73b winds up the package tape PT from the sockets 93 whose latches are shifted to the unlock position. The tape guide roller 72 is located between the latch driving roller 71 and the reel 73b and swang corresponding to the take-off tension of the package tape PT. The detecting sensor stops the reel 73b when detecting the fact that the roller 72 is at the specified moving limit position.

公开(公告)号：JPH1022021A

公开(公告)日：1998-01-23

申请号：JP16794796

申请日：1996-06-27

Applicant: SHARP KK

Inventor： TSUKUSHI TOSHITAME ,  HISATOMI JUNICHIRO

IPC: H01R33/76 ,  H01L23/32 ,  H01R33/94

Abstract: PROBLEM TO BE SOLVED: To provide an IC socket which can easily be wired with external equipment while securing an electric contact with an IC package and which, if failed, becomes usable by replacing only the failed part. SOLUTION: An expansible bellow spring 21 is formed in each of spring pins 2.... The IC socket includes a spring pin locking stand 3 to which the spring pins 2... are locked; an interposer 4 having narrowly spaced surface contact terminals 41... on its surface which correspond to the spring pins 2..., and having back contact terminals 43... on its back which are widely spaced by a conductive pattern 42 formed from the surface contact terminals 41... through a through hole 4a; and a socket pin locking stand 7 whose end is brought into contact with each of the back contact terminals 43... and on which a plurality of socket pins 6... for connection to an external device from rear ends are mounted.

公开(公告)号：JPS62286287A

公开(公告)日：1987-12-12

申请号：JP13061386

申请日：1986-06-04

Applicant: SHARP KK

Inventor： ASAI SHIGEMI ,  SHIMANO KIYOJI ,  HISATOMI JUNICHIRO

IPC: H01L27/14 ,  H01L31/02 ,  H01L31/0203

Abstract: PURPOSE:To fix a device readily and highly accurately by a simple structure, by forming an attaching surface to an optical device as a ground surface so that a photodetector bonding surface is a reference surface. CONSTITUTION:An attaching surface A' of a base 3 is a ground surface so that a photodetector element bonding surface is a reference surface. Since the attaching surface is the surface of a raw material after burning, the dimensional error of about + or -0.1 mm is found. The attaching surface undergoes grinding machining so that the dimensional accuracy in parallelism and distance between two surfaces is + or -0.05 mm or less with respect to a light receiving surface B of the photodetector. Usually, the machining accuracy of several mum order is obtained when grinding machning is performed. Therefore, in this case, a ceramic package satisfying the dimensional accuracy can be obtained.

公开(公告)号：JPS5162691A

公开(公告)日：1976-05-31

申请号：JP13753574

申请日：1974-11-27

Applicant: Sharp Kk

Inventor： KAWAMURA KOICHI ,  PPONDA JUNICHI ,  HISATOMI JUNICHIRO ,  SHIGEMASA JUNICHIRO

IPC: H01L31/042 ,  H01L23/28 ,  H01L31/02 ,  H01L31/048

CPC classification number: B32B17/10761 ,  H01L31/0488 ,  H01L2924/0002 ,  Y02E10/50 ,  H01L2924/00

公开(公告)号：JPH05218143A

公开(公告)日：1993-08-27

申请号：JP2287892

申请日：1992-02-07

Applicant: TABAI ESPEC CORP ,  SHARP KK

Inventor： TANAKA HIDEKI ,  NAKAMURA KAZUHIRO ,  TABUCHI MASAYUKI ,  FUKUNAGA SATORU ,  HISATOMI JUNICHIRO

IPC: B65D85/00 ,  H01L21/60

Abstract: PURPOSE:To provide a reel supporting device for a package tape by which even a plurality of sets of tape supply reels and tape take-up reels paired therewith are parallely provided while the reels can be easily exchanged in a small space with little pains and which can be manufactured at a low price. CONSTITUTION:This is a reel supporting device for a package tape wherein a plurality of reel supporting arms 113 turnably equipped with tape supply reels 11a on one end part 113a and tape take-up reels 11b paired with the tape supply reels on the other end part 113b respectively air parallely arranged and are turnably supported by an arm shaft 112 at a part between both end parts thereof so as to enable respective arms to be selectively and turnably arranged in the reel exchange position or a reel operating position.

公开(公告)号：JPS635546A

公开(公告)日：1988-01-11

申请号：JP15057086

申请日：1986-06-25

Applicant: SHARP KK

Inventor： ASAI SHIGEMI ,  SHIMANO KIYOJI ,  HISATOMI JUNICHIRO

IPC: H01L23/02

Abstract: PURPOSE:To ensure high-precision dimensional control being not subjected to shrinkage or warp present in materials by a method wherein a grinding process is accomplished with a package chip bonding surface serving as refer ence. CONSTITUTION:A unit of this design is constituted of a package fixing jig 15 for the fixation of a package 1, package fixing bed 13 for the package fixing jig 15, and a reference block 22 for the positioning of a grinding reference surface in the package 1. The package fixing bed 13 is caused to travel by adjusting a trimming screw 14, a surface B of the package 1 installed on the package fixing bed 13 is caused for positioning to abut against an end 22a of the reference block 22, and then grinding is accomplished with the package 1 fixed to the packaging fixing jig 15 with the surface B serving as the reference surface. In this way, with the surface B to serve as the reference level for the fixation of the package 1 during a grinding process being located nearest to a light-receiving surface D, a surface A may be directly controlled in terms of its dimensions, which results in a very accurately ground surface.

公开(公告)号：JPS62287969A

公开(公告)日：1987-12-14

申请号：JP13061486

申请日：1986-06-04

Applicant: SHARP KK

Inventor： ASAI SHIGEMI ,  SHIMANO KIYOJI ,  HISATOMI JUNICHIRO

IPC: B24B41/06 ,  H01L23/08

Abstract: PURPOSE:To enable obtaining the ground surface of high precision at high efficiency by clamping both sides of a base with each one clamp for package positioning and pressing, and applying the constitution wherein vertical and horizontal vectors appear on the claw of the pressing clamp. CONSTITUTION:A clamping claw 9 is so fixed with a screw 11 as to be in contact with the upper surface 4c of a package fixing jig 4 and the side 4d thereof. Then, when another clamping claw 10 is gradually tightened with another screw 12 in such a way that a base 1 is placed on the fixing jig 4 and the side 1c of the base 1 comes in contact with the edge of another claw 9, the claw 10 is tightened and fixed, while pressing the side 1d of the base 1 in an 'E' direction with the edge 10a thereof about an edge 10b as a support point. It follows, therefore, that the edge 10a of the claw 10 is pressing the side 1d of the base 1 by a force f'0, thereby causing a horizontal pressing vector f2 for fixing the package in a horizontal direction and a vertical pressing vector f1 for fixing the package in a vertical direction (or for preventing the floating of the package). As a result, the package does not float during a grinding process, thereby ensuring high-precision grinding at high efficiency.