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    Semiconductor chip mounting device and method for manufacturing semiconductor device
    1.
    发明授权
    Semiconductor chip mounting device and method for manufacturing semiconductor device 有权

    公开(公告)号：US11296048B2

    公开(公告)日：2022-04-05

    申请号：US16338700

    申请日：2017-09-29

    Applicant: SHINKAWA LTD.

    Inventor： Tomonori Nakamura ,  Toru Maeda

    IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

    Abstract: Provided is a mounting device in which two or more semiconductor chips are laminated and mounted at a plurality of locations on a substrate, said mounting device including: a stage that supports the substrate; a bonding part that laminates and mounts the plurality of semiconductor chips on the substrate while heating the plurality of semiconductor chips and the substrate; and a heat insulating member that is interposed between the stage and the substrate, said heat insulating member including a first layer which is in contact with the substrate and to which heat is applied from the bonding part via the semiconductor chips and the substrate, and a second layer which is disposed closer to the stage side than the first layer, wherein the first layer has a larger heat resistance than the second layer.

    Antioxidant gas supply unit
    2.
    发明授权
    Antioxidant gas supply unit 有权
    抗氧化剂供气装置

    公开(公告)号：US09044821B2

    公开(公告)日：2015-06-02

    申请号：US14321134

    申请日：2014-07-01

    Applicant: Shinkawa Ltd.

    Inventor： Toru Maeda ,  Mitsuaki Sakakura

    IPC: B23K37/00 ,  B23K20/00 ,  B23K9/16 ,  H01L23/00

    CPC classification number: B23K20/007 ,  B23K9/16 ,  B23K20/005 ,  B23K37/00 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/781 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85054 ,  H01L2924/00014 ,  H01L2924/00015 ,  Y10T137/6416 ,  H01L2224/48

    Abstract: Provided is an antioxidant gas supply unit including: a base body (10) in a shape of a hollow plate having antioxidant gas flow paths (53) and (54) defined therein; an antioxidation gas inlet (20) for letting an antioxidant gas flow into the antioxidant gas flow paths (53) and (54); a through hole (30) penetrating through the base body (10) in a through-thickness direction so that a capillary (72) is allowed to be inserted into and removed from the hole, and communicating with the antioxidant gas flow paths (53) and (54) to let the antioxidant gas flow out; and a film heater (40) attached to an outer surface of the base body (10) around the through hole (30). The antioxidant gas supply unit has a compact structure and is capable of effectively heating a free air ball.

    Abstract translation: 提供一种抗氧化剂气体供给单元，包括：具有限定在其中的抗氧化剂气体流路（53）和（54）的中空板形状的基体（10） 用于使抗氧化剂气体流入抗氧化剂气体流路（53）和（54）的抗氧化气体入口（20）; 穿过所述基体（10）的贯穿孔（30）的通孔（30），使得允许毛细管（72）从所述孔插入和移出，并与所述抗氧化剂气体流路（53）连通， 和（54）使抗氧化剂气体流出; 以及围绕所述通孔（30）附接到所述基体（10）的外表面的膜加热器（40）。 抗氧化剂气体供给装置结构紧凑，能够有效地加热空气球。

    Mounting apparatus and mounting system
    3.
    发明授权
    Mounting apparatus and mounting system 有权

    公开(公告)号：US11545462B2

    公开(公告)日：2023-01-03

    申请号：US16486155

    申请日：2018-01-30

    Applicant: SHINKAWA LTD.

    Inventor： Tomonori Nakamura ,  Toru Maeda

    IPC: H01L23/00

    Abstract: A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.

    Mounting apparatus and mounting system
    4.
    发明授权
    Mounting apparatus and mounting system 有权

    公开(公告)号：US11508689B2

    公开(公告)日：2022-11-22

    申请号：US16486155

    申请日：2018-01-30

    Applicant: SHINKAWA LTD.

    Inventor： Tomonori Nakamura ,  Toru Maeda

    IPC: H01L23/00

    Abstract: A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.

    Mounting apparatus and method for manufacturing semiconductor device
    5.
    发明授权
    Mounting apparatus and method for manufacturing semiconductor device 有权

    公开(公告)号：US11094567B2

    公开(公告)日：2021-08-17

    申请号：US16624302

    申请日：2018-05-29

    Applicant: SHINKAWA LTD.

    Inventor： Tomonori Nakamura ,  Toru Maeda ,  Tetsuo Takano

    IPC: H01L21/67 ,  H01L21/50 ,  H01L23/00 ,  H01L21/60

    Abstract: A mounting apparatus for manufacturing a semiconductor device by bonding a semiconductor chip (12) to a mounted object that is a substrate (30) or another semiconductor chip (12) is provided. The mounting apparatus includes: a stage (120) on which the substrate (30) is placed, a mounting head (124) that is capable of moving relative to the stage (120) and bonds the semiconductor chip (12) to the mounted object, and an irradiation unit (108 that irradiates, from a lower side of the stage (120), an electromagnetic wave transmitting through the stage and heating the substrate (30). The stage (120) has a first layer (122) formed on an upper surface side, and the first layer (122) has a greater thermal resistance in a plane direction than the thermal resistance in a thickness direction.

    Method of manufacturing semiconductor device, and mounting device
    6.
    发明授权
    Method of manufacturing semiconductor device, and mounting device 有权

    公开(公告)号：US10896901B2

    公开(公告)日：2021-01-19

    申请号：US16337926

    申请日：2017-09-28

    Applicant: SHINKAWA LTD.

    Inventor： Tomonori Nakamura ,  Toru Maeda

    IPC: H01L25/07 ,  H01L21/44 ,  H01L21/50 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L23/00 ,  H01L25/18

    Abstract: The disclosure is provided with: a temporary crimping step in which one or more semiconductor chips 10 are sequentially laminated while being temporarily crimped in each of two or more locations on a substrate 30 to thereby form chip stacks ST in a temporarily crimped state; and a permanent crimping step in which the top surfaces of all of the chip stacks ST formed in the temporarily crimped state are sequentially heated, pressurized, and permanently crimped. Furthermore, a specifying step is provided prior to the temporary crimping step for specifying a separation distance Dd which is the distance from the chip stacks ST under permanent crimping to a location at which the temperature of the substrate 30, the temperature having been raised by heating for the permanent crimping, becomes less than or equal to a prescribed permissible temperature Td, and in the temporary crimping step, the chip stacks ST in the temporarily crimped state are formed separated from each other by the separation distance Dd or more.

    Bonding apparatus and alignment method
    8.
    发明授权
    Bonding apparatus and alignment method 有权

    公开(公告)号：US12080679B2

    公开(公告)日：2024-09-03

    申请号：US18010458

    申请日：2021-08-26

    Applicant: SHINKAWA LTD.

    Inventor： Toru Maeda ,  Osamu Kakutani

    IPC: B23K20/00 ,  B23K20/10 ,  H01L23/00 ,  B23K101/40

    CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K20/005 ,  B23K20/106 ,  B23K2101/40 ,  H01L2224/78621 ,  H01L2224/78701 ,  H01L2224/78753

    Abstract: A bonding apparatus includes: a clamper able to clamp a wire between a pair of arms; a horn, in which a first through hole able to hold a capillary, and a second through hole adjacent to the first through hole and penetrating the horn in an up-down direction are further formed; and a bonding stage able to carry a workpiece. An alignment method for aligning a horn and a damper of a bonding apparatus with each other includes: disposing a mirror surface to be parallel to a bonding stage; aligning a mirror image of a second through hole reflected on the mirror surface with a center of the second through hole when the mirror surface is viewed through the second through hole; and aligning the damper based on a position of the mirror image and the horn.

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