公开(公告)号：US20240012481A1

公开(公告)日：2024-01-11

申请号：US18218966

申请日：2023-07-06

Applicant: Silicon Integrated Systems Corp.

Inventor： Yi-chen CHEN ,  Min-han LEE ,  Kun-tien TING

IPC: G06F3/01 ,  H04W76/14

CPC classification number: G06F3/016 ,  H04W76/14

Abstract: A haptic feedback method for an electronic system includes pairing an electronic device with a first wireless communication module and an input device with a second wireless communication module and a haptic feedback motor unit, inputting a control signal to the electronic device through the input device, and sending a wireless motor driving signal to the second wireless communication module of the input device by the first wireless communication module of the electronic device according to the control signal, so that the second wireless communication module generates a wired motor driving signal according to the wireless motor driving signal and directly transmits the wired motor driving signal to the haptic feedback motor unit to directly enable vibration of the haptic feedback motor unit.