公开(公告)号：US20210305835A1

公开(公告)日：2021-09-30

申请号：US17205002

申请日：2021-03-18

Applicant: Silicon Integrated Systems Corp.

Inventor： Song-Sheng LIN ,  Keng-Nan CHEN

IPC: H02J7/00 ,  G05F3/26

Abstract: A constant current charging device is configured to charge a device to be charged and includes: a reference current source configured to provide a reference current; a current mirror electrically coupled to the reference current source and configured to output a mirror current; a current adjusting unit electrically coupled to the current mirror and the device to be charged and configured to output a charging current according to the mirror current to charge the device to be charged; and a current compensation unit electrically coupled to the current mirror and the current adjusting unit and configured to adjust the charging current according to a reference voltage.

公开(公告)号：US20210305834A1

公开(公告)日：2021-09-30

申请号：US17205017

申请日：2021-03-18

Applicant: Silicon Integrated Systems Corp.

Inventor： Song-Sheng LIN ,  Keng-Nan CHEN

IPC: H02J7/00

Abstract: A constant current charging device is configured to charge a device to be charged and includes: a current regulating unit electrically coupled to the device to be charged and configured to provide a regulating current and a charging current according to a reference voltage; a current-to-voltage converting unit electrically coupled to the current regulating unit and configured to output a regulating voltage according to the regulating current; and a first operational amplifier electrically coupled to the current regulating unit, the current-to-voltage converting unit, and the device to be charged and configured to regulate the regulating current.

公开(公告)号：US20150300890A1

公开(公告)日：2015-10-22

申请号：US14254683

申请日：2014-04-16

Applicant: Silicon Integrated Systems Corp.

Inventor： Song-Sheng LIN

IPC: G01K7/01 ,  H03B5/02

CPC classification number: G01K7/01 ,  H03K3/0231 ,  H03K3/0315

Abstract: An on-chip temperature sensing device is disclosed. The disclosed on-chip temperature sensing device is capable of sensing an environmental temperature of the chip. The device comprises a reference generating circuit, a first oscillator, a second oscillator, and an arithmetic logic unit. The reference generating circuit is configured to generate a first control voltage to control the first oscillator and the second oscillator. The bias current of the first oscillator and the bias current of the second oscillator are both controlled by the first control voltage so that the bias current of the first oscillator is directly proportional the bias current of the second oscillator regardless the environmental temperature. The first oscillator generates a first oscillation signal, while the second oscillator generates a second oscillation signal. The arithmetic logic unit may calculate the environmental temperature according to the first oscillation signal and the second oscillation signal.

Abstract translation: 公开了片上温度感测装置。 所公开的片上温度感测装置能够感测芯片的环境温度。 该装置包括参考产生电路，第一振荡器，第二振荡器和算术逻辑单元。 参考产生电路被配置为产生第一控制电压以控制第一振荡器和第二振荡器。 第一振荡器的偏置电流和第二振荡器的偏置电流都由第一控制电压控制，使得第一振荡器的偏置电流与第二振荡器的偏置电流成正比，而与环境温度无关。 第一振荡器产生第一振荡信号，而第二振荡器产生第二振荡信号。 算术逻辑单元可以根据第一振荡信号和第二振荡信号来计算环境温度。