公开(公告)号：US5984293A

公开(公告)日：1999-11-16

申请号：US882479

申请日：1997-06-25

Applicant: Steve Abrahamson ,  Curtis C. Thompson, Sr.

Inventor： Steve Abrahamson ,  Curtis C. Thompson, Sr.

IPC: B25B1/24 ,  B25B11/00 ,  H05K3/34 ,  H05K13/00

CPC classification number: B23Q1/035 ,  B25B1/2421 ,  B25B11/00 ,  H05K13/0069 ,  H05K3/3415

Abstract: A universal fixture for holding printed circuit board assemblies during stencil printing, pick-and-place processing, and other PCB assembly processes. In one embodiment, a universal printed circuit board holder has a base and a plurality of support members movably attached to the base. The support members may project away from the base along support paths, and the support members are selectively positionable along the support paths when the support members engage a side of a printed circuit board assembly. Accordingly, the support members may be selectively positioned at heights corresponding to a topography of the side of the printed circuit board assembly to uniformly support the printed circuit board assembly.

Abstract translation: 用于在模版印刷，拾取和放置处理以及其他PCB组装过程中保持印刷电路板组件的通用夹具。 在一个实施例中，通用印刷电路板保持器具有可移动地附接到基座的基部和多个支撑构件。 支撑构件可以沿着支撑路径突出离开基部，并且当支撑构件接合印刷电路板组件的侧面时，支撑构件可沿着支撑路径选择性地定位。 因此，支撑构件可以选择性地定位在与印刷电路板组件的侧面的形状相对应的高度处，以均匀地支撑印刷电路板组件。

公开(公告)号：US5942078A

公开(公告)日：1999-08-24

申请号：US895765

申请日：1997-07-17

Applicant: Steve Abrahamson

Inventor： Steve Abrahamson

IPC: H05K3/30 ,  H05K13/08 ,  G01B21/08 ,  B32B31/00

CPC classification number: H05K13/08 ,  H05K3/305

Abstract: An apparatus for calibrating surface mounting processes in the manufacturing of printed circuit board assemblies. In one embodiment of the invention, a test pad of adhesive is deposited onto a substrate, and then a test module is mounted to the substrate at the test pad. The test module is representative of an electrical component that is to be mounted to a printed circuit board, and the test module is mounted to the substrate in a manner in which the electrical component is to be mounted to a printed circuit board. After the test module is mounted to the substrate, the profile of the test pad is detected through the substrate and/or the test module to determine whether the test pad contacts enough of the test module to sufficiently adhere the test module to the substrate without interfering with the terminals of the test module. Accordingly, this embodiment of the invention provides an indication or estimate of the desired volume of an adhesive pad to mount a specific component to a PCB.

Abstract translation: 一种用于校准印刷电路板组件制造中的表面安装工艺的装置。 在本发明的一个实施例中，将粘合剂测试垫沉积到基底上，然后在测试垫处将测试模块安装到基底上。 测试模块代表要安装到印刷电路板的电气部件，并且测试模块以将电气部件安装到印刷电路板的方式安装到基板。 在将测试模块安装到衬底之后，通过衬底和/或测试模块检测测试焊盘的轮廓，以确定测试焊盘是否接触足够的测试模块，以充分地将测试模块粘附到衬底而不干扰 与测试模块的终端。 因此，本发明的该实施例提供了将特定部件安装到PCB上的粘合垫的期望体积的指示或估计。

公开(公告)号：US5906364A

公开(公告)日：1999-05-25

申请号：US21791

申请日：1998-02-11

Applicant: Curtis C. Thompson ,  Steve Abrahamson

Inventor： Curtis C. Thompson ,  Steve Abrahamson

IPC: B25B5/06 ,  H05K13/00 ,  B23Q3/08 ,  B25B11/00

CPC classification number: B25B5/065 ,  H05K13/0069 ,  Y10S269/903

Abstract: A fixture tooling for supporting a back side of a printed circuit board during component placement on a top side of the board includes an inflatable air bladder that is sized substantially coextensive with the circuit board. The bladder is positioned below the circuit board within a containment unit adapted for use with conventional railed assembly equipment. The bladder is selectively inflated for supporting the complete back side of the printed circuit board during assembly operations. The bladder provides evenly distributed support across, substantially, the entire circuit board without damaging any components on the back side by pliably conforming to component irregularities on the back side.

Abstract translation: 用于在组件放置在板的顶部的部件放置期间支撑印刷电路板的背面的固定工具包括可充气的气囊，其尺寸与电路板基本上共同延伸。 气囊位于电路板的下方，位于适用于常规轨道组装设备的容纳单元内。 在组装操作期间，膀胱被选择性地充气以支撑印刷电路板的完整背面。 膀胱在整个电路板的基本上提供均匀分布的支撑，而不会通过柔软地符合背侧的部件不规则性而损坏背面上的任何部件。

公开(公告)号：US5978093A

公开(公告)日：1999-11-02

申请号：US895766

申请日：1997-07-17

Applicant: Steve Abrahamson

Inventor： Steve Abrahamson

IPC: H05K1/02 ,  H05K3/30 ,  H05K13/04 ,  G01B11/00 ,  G01J1/02 ,  G06K9/00 ,  H01L21/66

CPC classification number: H05K3/305 ,  H05K13/0465 ,  H05K1/0269 ,  H05K2201/0108 ,  H05K2201/10204 ,  H05K2203/161 ,  H05K2203/162 ,  Y02P70/613

Abstract: A method and apparatus for calibrating surface mounting processes in the manufacturing of printed circuit board assemblies. In one embodiment of a method in accordance with the invention, a test pad of adhesive is deposited onto a substrate, and then a test module is mounted to the substrate at the test pad. The test module is representative of an electrical component that is to be mounted to a printed circuit board, and the test module is mounted to the substrate in a manner in which the electrical component is to be mounted to a printed circuit board. After the test module is mounted to the substrate, the profile of the test pad is detected through the substrate and/or the test module to determine whether the test pad contacts enough of the test module to sufficiently adhere the test module to the substrate without interfering with the terminals of the test module. Accordingly, this embodiment of the inventive method provides an indication or estimate of the desired volume of an adhesive pad to mount a specific component to a PCB.

Abstract translation: 一种用于校准印刷电路板组件制造中的表面安装工艺的方法和装置。 在根据本发明的方法的一个实施例中，将粘合剂测试垫沉积到基底上，然后在测试垫处将测试模块安装到基底上。 测试模块代表要安装到印刷电路板的电气部件，并且测试模块以将电气部件安装到印刷电路板的方式安装到基板。 在将测试模块安装到衬底之后，通过衬底和/或测试模块检测测试焊盘的轮廓，以确定测试焊盘是否接触足够的测试模块，以充分地将测试模块粘附到衬底而不干扰 与测试模块的终端。 因此，本发明方法的该实施例提供了将特定部件安装到PCB的粘合垫的期望体积的指示或估计。

公开(公告)号：US5820117A

公开(公告)日：1998-10-13

申请号：US800069

申请日：1997-02-12

Applicant: Curtis C. Thompson, Sr. ,  Steve Abrahamson

Inventor： Curtis C. Thompson, Sr. ,  Steve Abrahamson

IPC: B25B5/06 ,  H05K13/00 ,  B23Q3/08 ,  B25B11/00

CPC classification number: B25B5/065 ,  H05K13/0069 ,  Y10S269/903

Abstract: A fixture tooling for supporting a back side of a printed circuit board during component placement on a top side of the board includes an inflatable air bladder that is sized substantially coextensive with the circuit board. The bladder is positioned below the circuit board within a containment unit adapted for use with conventional railed assembly equipment. The bladder is selectively inflated for supporting the complete back side of the printed circuit board during assembly operations. The bladder provides evenly distributed support across, substantially, the entire circuit board without damaging any components on the back side by pliably conforming to component irregularities on the back side.