METHOD AND APPARATUS FOR DECHUCKING A SUBSTRATE FROM AN ELECTROSTATIC CHUCK
    1.
    发明公开
    METHOD AND APPARATUS FOR DECHUCKING A SUBSTRATE FROM AN ELECTROSTATIC CHUCK 审中-公开
    方法和装置去除形成在基底由静电窗撑

    公开(公告)号:EP1090421A1

    公开(公告)日:2001-04-11

    申请号:EP99926612.5

    申请日:1999-06-15

    CPC classification number: H01L21/6833

    Abstract: There is provided a method of dechucking from an electrostatic chuck a substrate held by one or more residual forces to the chuck, the method comprising the steps of: (a) reducing a residual chucking force due to the electrostatic chuck polarisation; (b) contracting the chuck with the substrate attached thereto with a plasma for a time sufficient substantially to remove any residual charge from the surface of the substrate and the chuck; and (c) subsequently to, or simultaneously with, step (b) removing the substrate from the chuck. Also disclosed is an apparatus for performing the method.

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