公开(公告)号：US20210198528A1

公开(公告)日：2021-07-01

申请号：US17106211

申请日：2020-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： CHUN-CHI HSU ,  CHUN-TING LAI ,  CHIH-WEI LIN

IPC: C09J7/38 ,  H01L33/00

Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.