公开(公告)号：US11655348B2

公开(公告)日：2023-05-23

申请号：US17355204

申请日：2021-06-23

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Jia-Hao Wu ,  Chia-Ying Chou ,  Chun-Yi Cheng

IPC: C08J5/18 ,  C08J7/04 ,  C08J3/11 ,  C08G73/10 ,  C08J3/24 ,  C08L33/24

CPC classification number: C08J5/18 ,  C08G73/1003 ,  C08J3/11 ,  C08J3/247 ,  C08J7/0427 ,  C08L33/24 ,  C08J2333/24

Abstract: A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.