Abstract:
The present application provides a polyimide film having low gloss and a process of fabricating the same. The process includes forming a polyimide precursor solution by reacting diamine monomers with dianhydride monomers in a solvent, forming a wet polyimide film on a support with the polyimide precursor solution, pressing the wet film with an embossing roller at a temperature equal to or higher than 100° C. and an applied pressure equal to or higher than 1 kg, thereby causing the wet film to exhibit an uneven surface, and heating the wet film to form a polyimide film.
Abstract:
A colored polyimide film includes a polyimide polymer obtained by reacting diamine monomers with dianhydride monomers, wherein the diamine monomers are oxydianiline (ODA) and phenylene diamine (PDA) monomers, and the dianhydride monomers are pyromellitic dianhydride (PMDA); a matting agent comprised of polyimide particles; and one or more color pigment. The polyimide films described herein have low gloss, low transparency, and low coefficient of thermal expansion.