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公开(公告)号：SG185347A1
公开(公告)日：2012-12-28
申请号：SG2012027959
申请日：2011-11-01
Applicant: TANAKA ELECTRONICS IND
Inventor： CHIBA JUN , TESHIMA SATOSHI , KOBAYASHI TASUKU , ANTOKU YUKI
Abstract: Abstract Ag-Au-Pd Ternary Alloy Bonding Wire[Objects] To improve the bonding reliability of a bonding wire upon an aluminum pads which are used in circumstances of high temperature and high humidity.[Means to solve] An Ag-Au-Pd ternary alloy bonding wire for semiconductor devices made from 4 - 10 mass % of gold having a purity of 99.999 mass % or higher, 2 - 5 mass % of palladium having a purity of 99.99 mass % or higher, and remaining mass % of silver (Ag) having a purity of 99.999 mass % or higher; and this wire contains 15 - 70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies , and is thermally tempered after being continuously drawn through said dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2A1 and a Pd rich layer produced in the interface between the Ag-Au-Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the AgAl intermetallic compound layer and the wire. Fig. 1
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公开(公告)号：EP2209136A4
公开(公告)日：2013-08-07
申请号：EP08846626
申请日：2008-10-15
Applicant: TANAKA ELECTRONICS IND
Inventor： TAKADA MITSUO , TESHIMA SATOSHI , KUWAHARA TAKESHI
CPC classification number: H01L24/85 , C22C5/02 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/78301 , H01L2224/7855 , H01L2224/85045 , H01L2224/85048 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01014 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01105 , H01L2924/01203 , H01L2924/01204 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/01039 , H01L2924/00014 , H01L2924/01202 , H01L2924/00 , H01L2924/013 , H01L2924/00013 , H01L2924/00015 , H01L2924/01049 , H01L2924/01006
Abstract: [Issues to be solved] To provide Au alloy wire for ball bonding, which is superior wire strength, and also is superior at formability of molten ball and roundness of compressed ball, moreover is superior at stitch bondability; is available for high density wiring of semiconductor divices. [Solution means] Au alloy wire for ball bonding comprising: 15 - 50 wt ppm Mg, 10 - 30 wt ppm Ca, 5 - 20 wt ppm Eu, 5 - 20 wt ppm Y, 5 - 20 wt ppm La and residual Au is more than 99.998 wt % purity, moreover, purity of more than 99.98 wt % Au, mass of additive Ca is less than the value of total amount of additive Eu and additive La, and mass of additive Y is less than the value of total amount of additive Ca and additive Eu, and mass of 20 - 40 wt ppm Mg.
Abstract translation: [待解决的问题]为了提供优良的丝强度的球形接合用Au合金丝，并且在熔融球的成形性和压缩球的圆度方面也优异，而且在针迹结合性方面优异; 可用于半导体分区的高密度布线。 [解决方案]用于球接合的Au合金线包括：15-50重量ppm的Mg，10-30重量ppm的Ca，5-20重量ppm的Eu，5-20重量ppm的Y，5-20重量ppm的La和残余的Au是 纯度大于99.998重量％，此外，纯度高于99.98重量％的Au，添加剂Ca的质量小于添加剂Eu和添加剂La的总量的值，添加剂Y的质量小于总量 的添加剂Ca和添加剂Eu，质量为20-40重量ppm的Mg。
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公开(公告)号：SG2013044755A
公开(公告)日：2014-04-28
申请号：SG2013044755
申请日：2013-06-10
Applicant: TANAKA ELECTRONICS IND
Inventor： CHIBA JUN , ANTOKU YUKI , TESHIMA SATOSHI , YASUHARA KAZUHIKO , CHEN WEI , MAEDA NANAKO
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Patent Agency Ranking
公开(公告)号：MY136030A
公开(公告)日：2008-07-31
申请号：MYPI20055175
申请日：2005-11-02
Applicant: TANAKA ELECTRONICS IND
Inventor： MURAI HIROSHI , CHIBA JUN , TESHIMA SATOSHI
IPC: H01L21/60
Abstract: AU ALLOY BONDING WIRE PROVIDED IS A THIN AU ALLOY BONDING WIRE HAVING DESIRED STRENGTH, GOOD BONCLABILITY AND STABILITY OVER TIME, AND IMPROVED CIRCULARITY OF A 5 SQUASHED BALL AND SPHERICITY OF A MELTED BALL, THE AU ALLOY BONDING WIRE CONTAINS, IN AN AU ALLOY MATRIX CONTAINING 0.05 TO 2 MASS IN TOTAL OF AT LEAST ONE SELECTED FRORN PD AND PT OF HIGH PURITY IN AU OF HIGH PURITY, AS TRACE ELEMENTS, 1 0 TO 1 00 PPRN BY MASS OF MG, 5 TO 1 00 PPM BY MASS OF CE, AND 5 TO 100 PPM BY MASS OF EACH OF AT LEAST ONE SELECTED FROM 10 BE, Y, GD, LA, EU AND SI, THE TOTAL CONTENT OF BE, Y, GD, LA, E-U AND SI BEING 5 TO 100 PPM BY MASS, OR AS TRACE ELEMENTS, MG, BE, AND AT LEAST ONE SELECTED FROM Y, LA, EU AND SI, OR AS TRACE ELEMENTS, 10 TO 100 PPRN BY MASS OF MG, 5 TO 30 PPRN BY MASS OF SI, 5 TO 30 PPM BY MASS C)F BE, AND 5 TO 30 PPM BY MASS OF AT LEAST ONE SELECTED FROM CA, CE AND SN. -D 01
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公开(公告)号：SG188385A1
公开(公告)日：2013-07-31
申请号：SG2013015953
申请日：2012-11-21
Applicant: TANAKA ELECTRONICS IND
Inventor： TESHIMA SATOSHI , CHIBA JUN , CHEN WEI , AMADA FUJIO
Abstract: Abstract Gold-Platinum-Palladium Alloy Bonding Wire[Objects]A gold-platinum-palladium alloy bonding wire is proposed for use with semiconductor devices for automotive vehicles, which exhibits excellent connection performance reliability when connected to an aluminum pad such that even in a case wherein an epoxy resin free of halogen elements is used, the durability throughout high temperature exposure and the capability of preserving electric properties despite high temperature exposure are excellent.[Means for Solution]A gold-platinum-palladium alloy bonding wire composed of platinum by 0.4 - 1.2 mass %, palladium by 0.01 - 0.5 mass %, aluminum by 10 - 30 mass ppm, at least one of calcium and magnesium by 10 - 60 mass ppm in sum, and a balance, which is gold of a purity of 99.999 mass % or greater.
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公开(公告)号：EP2204846A4
公开(公告)日：2014-01-15
申请号：EP08790566
申请日：2008-06-23
Applicant: TANAKA ELECTRONICS IND
Inventor： TAKADA MITSUO , TESHIMA SATOSHI , KUWAHARA TAKESHI
CPC classification number: H01L24/85 , B23K35/3013 , B23K2201/36 , C22C5/02 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/05644 , H01L2224/43 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/01105 , H01L2924/01204 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20106 , H01L2924/20752 , Y10T428/12 , H01L2924/01012 , H01L2924/01063 , H01L2924/0105 , H01L2924/0102 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/013 , H01L2924/00015 , H01L2924/01205 , H01L2924/01048 , H01L2924/00013 , H01L2924/01049 , H01L2924/01006
Abstract: [PROBLEMS] To provide a gold alloy wire which is excellent in the property of forming a melt ball, suitability for stitch bonding, and wire strength and, despite this, gives a press-bonded ball having excellent circularity, and which is usable in high-density wiring for a semiconductor device. [MEANS FOR SOLVING PROBLEMS] The gold alloy wire for use in ball bonding is made of a gold alloy comprising 10-50 mass ppm magnesium (Mg), 5-20 mass ppm europium (Eu), 2-9 mass ppm calcium (Ca), and gold (Au) having a purity of 99.995 mass% or higher as the remainder, wherein the calcium (Ca) content is up to half the europium (Eu) content by mass.
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公开(公告)号：EP1811555A4
公开(公告)日：2012-06-20
申请号：EP05787491
申请日：2005-09-28
Applicant: TANAKA ELECTRONICS IND
Inventor： MURAI HIROSHI , CHIBA JUN , TESHIMA SATOSHI
CPC classification number: C22C5/02 , B23K35/3013 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/48624 , H01L2224/48639 , H01L2224/85439 , H01L2924/00011 , H01L2924/01105 , H01L2924/01202 , H01L2924/01203 , H01L2924/01205 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1576 , H01L2924/181 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/01046 , H01L2924/01014 , H01L2924/01063 , H01L2924/01004 , H01L2924/01058 , H01L2924/01064 , H01L2924/01012 , H01L2924/01039 , H01L2924/01057 , H01L2924/01078 , H01L2924/01201 , H01L2924/00014 , H01L2924/0102 , H01L2924/01066 , H01L2924/0103 , H01L2924/0105 , H01L2924/013 , H01L2924/00013 , H01L2924/00 , H01L2924/01028 , H01L2924/01404 , H01L2924/01006
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公开(公告)号：EP1830398A4
公开(公告)日：2012-06-06
申请号：EP05809380
申请日：2005-11-22
Applicant: TANAKA ELECTRONICS IND
Inventor： TESHIMA SATOSHI , MIKAMI MICHITAKA
CPC classification number: C22C5/02 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/4845 , H01L2224/48624 , H01L2224/85207 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01027 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01064 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01205 , H01L2924/10253 , H01L2924/14 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , Y10T428/12431 , H01L2924/01004 , H01L2924/01204 , H01L2924/01039 , H01L2924/20105 , H01L2924/20106 , H01L2924/2011 , H01L2924/20111 , H01L2924/013 , H01L2924/01062 , H01L2924/01048 , H01L2924/01049 , H01L2924/00013 , H01L2924/00 , H01L2924/01006
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