公开(公告)号：JPH0856100A

公开(公告)日：1996-02-27

申请号：JP11828295

申请日：1995-05-17

Applicant: TANDEM COMPUTERS INC

Inventor： UIRIAMU JIEI ABUERII ,  JIYON ESU SUI ,  DEIBUITSUDO EMU TEIICHIEIN

IPC: B23P21/00 ,  H05K3/32 ,  H05K13/00 ,  H05K13/04

Abstract: PURPOSE: To provide a device for exactly aligning and mounting surface mount electric parts on a printed circuit board. CONSTITUTION: A base plate 12 having alignment elements it fitted to a circuit board 20, besides, a chuck 18 is attached to sample parts, and an alignment plate 15 is positioned to engage the alignment elements on the base plate 12. A chuck assembly 14 is formed while being affixed to the chuck 18. This is aligned to the base plate 12 and put in order at the attachment place of a circuit board 20. The chuck 18 holding parts practically equal with ones formed on the arrangement stage exactly arranges leads 26 of parts on a circuit pad on the circuit board 20 through the base plate 12 while using the alignment plate 15.