公开(公告)号：AU3896500A

公开(公告)日：2000-10-04

申请号：AU3896500

申请日：2000-03-17

Applicant: TESSERA INC

Inventor： SMITH JOHN ,  HABA BELGACEM

IPC: H01L21/44 ,  H01L23/36 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/03 ,  H05K1/14 ,  H05K3/40 ,  H05K3/46 ,  H01L23/495 ,  H01L23/48 ,  H01L23/053 ,  H01L23/12 ,  H01L23/52 ,  H01L29/40

Abstract: Multi-layer components such as circuit panels are fabricated by connecting conductive features such as traces one two or more superposed substrates using leads extending through an intermediate dielectric layer. The leads can be closely spaced to provide a high density vertical interconnection, and can be selectively connected to provide customization of the structure.