公开(公告)号：DE69533063T2

公开(公告)日：2005-05-19

申请号：DE69533063

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH W ,  DISTEFANO H ,  WALTON CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R12/04 ,  H01R12/32 ,  H01R12/16

Abstract: A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

公开(公告)号：DE69533063D1

公开(公告)日：2004-06-24

申请号：DE69533063

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH W ,  DISTEFANO H ,  WALTON CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R12/04 ,  H01R12/32 ,  H01R12/16

Abstract: A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.