公开(公告)号：DE69533063T2

公开(公告)日：2005-05-19

申请号：DE69533063

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH W ,  DISTEFANO H ,  WALTON CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R12/04 ,  H01R12/32 ,  H01R12/16

Abstract: A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

公开(公告)号：DE69533063D1

公开(公告)日：2004-06-24

申请号：DE69533063

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH W ,  DISTEFANO H ,  WALTON CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R12/04 ,  H01R12/32 ,  H01R12/16

Abstract: A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

公开(公告)号：DE69535266T2

公开(公告)日：2007-01-18

申请号：DE69535266

申请日：1995-06-29

Applicant: TESSERA INC

Inventor： DISTEFANO H ,  SMITH W

IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/56 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

Abstract: A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.

公开(公告)号：DE69535266D1

公开(公告)日：2006-11-23

申请号：DE69535266

申请日：1995-06-29

Applicant: TESSERA INC

Inventor： DISTEFANO H ,  SMITH W

IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/56 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

Abstract: A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.

公开(公告)号：DE69531409D1

公开(公告)日：2003-09-04

申请号：DE69531409

申请日：1995-11-16

Applicant: TESSERA INC

Inventor： DISTEFANO H ,  SMITH W

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H05K7/20 ,  H01L23/433 ,  H01L25/065

Abstract: A thermal connector for conducting heat from microelectronic components such as semiconductor chips to a heat sink. The connector includes a large number of flexible thermal conductors desirably formed as elongated "S"-shaped strips or ribbons. The conductors can flex to accommodate tolerances in the assembly and displacement of the components caused by thermal expansion. The conductors may have relatively thin neck sections to increase the flexibility of the conductors, The connector may be fabricated by a process which includes fabrication of the conductors as flat strips, bonding of the conductors to a pair of opposed planar sheets and vertically moving the sheets away from one another to expand the conductors vertically to their final three-dimensional configuration.

公开(公告)号：DE69516725D1

公开(公告)日：2000-06-08

申请号：DE69516725

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO H ,  SMITH W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R12/04 ,  H01R12/32

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：DE69531409T2

公开(公告)日：2004-04-15

申请号：DE69531409

申请日：1995-11-16

Applicant: TESSERA INC

Inventor： DISTEFANO H ,  SMITH W

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H05K7/20 ,  H01L23/433 ,  H01L25/065

Abstract: A thermal connector for conducting heat from microelectronic components such as semiconductor chips to a heat sink. The connector includes a large number of flexible thermal conductors desirably formed as elongated "S"-shaped strips or ribbons. The conductors can flex to accommodate tolerances in the assembly and displacement of the components caused by thermal expansion. The conductors may have relatively thin neck sections to increase the flexibility of the conductors, The connector may be fabricated by a process which includes fabrication of the conductors as flat strips, bonding of the conductors to a pair of opposed planar sheets and vertically moving the sheets away from one another to expand the conductors vertically to their final three-dimensional configuration.

公开(公告)号：DE69516725T2

公开(公告)日：2000-10-26

申请号：DE69516725

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO H ,  SMITH W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R12/04 ,  H01R12/32

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.