公开(公告)号：KR780000421B1

公开(公告)日：1978-10-10

申请号：KR700000901

申请日：1970-06-30

Applicant: TEXAS INSTRUMENTS INC

Inventor： ADAMS A ,  ALTENBURGER E ,  KING L

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/16 ,  H01L23/488

公开(公告)号：US3776447A

公开(公告)日：1973-12-04

申请号：US3776447D

申请日：1971-05-26

Applicant: TEXAS INSTRUMENTS INC

Inventor： SIMMONS M ,  YAGER B ,  ADAMS A ,  YEARSLEY G

IPC: B23K20/00 ,  H01L21/00 ,  H01L21/607 ,  B23K21/00

CPC classification number: H01L24/85 ,  B23K20/007 ,  H01L21/00 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12043 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/20752 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: An automatic machine for ball bonding a lead wire to an expanded contact of a semiconductor device and stitch bonding the wire to a lead of the semiconductor package is described. The machine automactically aligns an X-Y table in predetermined relationship to the semiconductor device by means of an electrooptical system. A bonding needle mounted on the table is then moved in a predetermined manner to press the balled end of the wire against the expanded contact. Wire is then positively payed out as the bonding needle is moved to the lead where a stitch bond is performed. After the stitch bond, the needle is raised to pull out a length of wire, then the wire is clamped to break the wire near the stitch bond. The length of the wire protruding from the needle is then passed through a flame to form a new ball preparatory to a new cycle. The wire is payed out to the bonding needle from a spool supported by an air bearing. After the ball is formed, reverse torque is applied to the spool to pull the ball up against the end of the bonding needle. After the ball bond, forward torque is applied to pay out the wire, and the wire is positively fed through the needle by an air stream. After the stitch bond is completed and the ball reformed by the flame, reverse torque is again applied to the spool to draw the ball up against the end of the needle preparatory to the next bonding cycle.

Abstract translation: 描述了一种用于将引线与半导体器件的扩展接触并将引线接合到半导体封装的引线的自动机器。 机器通过电光学系统自动对准与半导体器件预定关系的X-Y工作台。 然后，以预定的方式移动安装在工作台上的接合针以将电线的球端压靠在扩展接触件上。 然后当接合针移动到进行针迹接合的引线时，线被正确地支付。 针迹结合后，针头被拉出以拉出一定长度的线，然后将线夹紧，以使针线接合处的线断开。 然后从针头突出的线的长度通过火焰，形成一个准备新的循环的新球。 线从由空气轴承支撑的线轴支付到接合针。 在球形成之后，向卷轴施加反向扭矩以将球拉到接合针的端部。 在球接合之后，施加正向扭矩以支付线，并且线通过空气流积极地馈送通过针。 在线圈接合完成并且由火焰重新形成球之后，反向扭矩再次施加到线轴上，以将球向上拉出，以防止在下一个结合循环中预备针的末端。

公开(公告)号：US3737983A

公开(公告)日：1973-06-12

申请号：US3737983D

申请日：1971-06-14

Applicant: TEXAS INSTRUMENTS INC

Inventor： KING L ,  YEARSLEY G ,  ALTENBURGER E ,  YAGER B ,  ADAMS A ,  SIMMONS M

IPC: G06F17/00 ,  H01L21/00 ,  B01J17/00

CPC classification number: H01L21/67121 ,  Y10T29/49004 ,  Y10T29/49144

Abstract: An automatic method and system for packaging discrete semiconductor devices such as transistors is described. The system includes a chasis for indexing a plurality of chucks past a series of work stations. The work stations include three wire loading stations for loading flat-headed lead wires in the chucks, a glass loading station for placing a glass ring around the necks of the lead wires, a series of heaters for heating the glass rings, a pair of molding stations for molding the heated glass rings around the necks of the lead wires to form a header, an alloy station for placing the semiconductor devices in a predetermined orientation on the head of one of the lead wires, and a series of automatic bonding stations for connecting the base and emitter contacts of the semiconductor devices to the heads of the other lead wires. The overall system is controlled by a digital computer. Stations are provided for detecting the absence of a lead wire, the absence of a glass ring, or the absence of a transistor device. The system also detects failure of any one of the bonder stations and terminates operation of the system. The computer is programmed to provide shift registers which define each index position of the chasis and logic signals are shifted through the shift register to continually locate any chuck which is defectively loaded so as to prevent the successful completion of a header assembly. The computer then disables each subsequent station as the defectively loaded chuck is positioned at the respective station.

Abstract translation: 描述了用于封装诸如晶体管的分立半导体器件的自动方法和系统。 该系统包括用于通过一系列工作站索引多个卡盘的凹槽。 工位包括用于在平台上装载平头引线的三线加载站，用于将玻璃环放置在引线颈部的玻璃装载站，一系列用于加热玻璃环的加热器，一对成型 用于在引线的颈部周围模制加热的玻璃环的工位，以形成集管，用于将半导体器件以预定取向放置在一条引线的头部上的合金工位，以及一系列用于连接的自动焊接站 半导体器件的基极和发射极触点到另一导线的头部。