公开(公告)号：KR780000421B1

公开(公告)日：1978-10-10

申请号：KR700000901

申请日：1970-06-30

Applicant: TEXAS INSTRUMENTS INC

Inventor： ADAMS A ,  ALTENBURGER E ,  KING L

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/16 ,  H01L23/488

公开(公告)号：US3737983A

公开(公告)日：1973-06-12

申请号：US3737983D

申请日：1971-06-14

Applicant: TEXAS INSTRUMENTS INC

Inventor： KING L ,  YEARSLEY G ,  ALTENBURGER E ,  YAGER B ,  ADAMS A ,  SIMMONS M

IPC: G06F17/00 ,  H01L21/00 ,  B01J17/00

CPC classification number: H01L21/67121 ,  Y10T29/49004 ,  Y10T29/49144

Abstract: An automatic method and system for packaging discrete semiconductor devices such as transistors is described. The system includes a chasis for indexing a plurality of chucks past a series of work stations. The work stations include three wire loading stations for loading flat-headed lead wires in the chucks, a glass loading station for placing a glass ring around the necks of the lead wires, a series of heaters for heating the glass rings, a pair of molding stations for molding the heated glass rings around the necks of the lead wires to form a header, an alloy station for placing the semiconductor devices in a predetermined orientation on the head of one of the lead wires, and a series of automatic bonding stations for connecting the base and emitter contacts of the semiconductor devices to the heads of the other lead wires. The overall system is controlled by a digital computer. Stations are provided for detecting the absence of a lead wire, the absence of a glass ring, or the absence of a transistor device. The system also detects failure of any one of the bonder stations and terminates operation of the system. The computer is programmed to provide shift registers which define each index position of the chasis and logic signals are shifted through the shift register to continually locate any chuck which is defectively loaded so as to prevent the successful completion of a header assembly. The computer then disables each subsequent station as the defectively loaded chuck is positioned at the respective station.

Abstract translation: 描述了用于封装诸如晶体管的分立半导体器件的自动方法和系统。 该系统包括用于通过一系列工作站索引多个卡盘的凹槽。 工位包括用于在平台上装载平头引线的三线加载站，用于将玻璃环放置在引线颈部的玻璃装载站，一系列用于加热玻璃环的加热器，一对成型 用于在引线的颈部周围模制加热的玻璃环的工位，以形成集管，用于将半导体器件以预定取向放置在一条引线的头部上的合金工位，以及一系列用于连接的自动焊接站 半导体器件的基极和发射极触点到另一导线的头部。