公开(公告)号：US20230005652A1

公开(公告)日：2023-01-05

申请号：US17363115

申请日：2021-06-30

Applicant: Texas Instruments Incorporated

Inventor： Dongbin Hou ,  Zhemin Zhang

IPC: H01F27/06 ,  H01F27/28 ,  H01F27/24

Abstract: An apparatus has a laminate substrate that has a first surface and an opposite second surface. A laminate transformer is located within the laminate substrate between the first surface and the second surface. The transformer has a first coil adjacent the first surface and a second coil adjacent the second surface. A magnetic core element on the first surface overlaps a portion of the first coil. A lead frame on the first surface is spaced apart from the magnetic core element. A portion of the lead frame overlaps a portion of the first coil to provide a thermal conductive path.

公开(公告)号：US20210375537A1

公开(公告)日：2021-12-02

申请号：US17405017

申请日：2021-08-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin Hou ,  Sombuddha Chakraborty ,  Kenji Kawano ,  Jeffrey Morroni ,  Yuki Sato

IPC: H01F27/34 ,  H01F27/28 ,  H01F27/02 ,  H01F41/00 ,  H02M3/158 ,  H01F27/24

Abstract: A device includes a first inductor and a second inductor reversely coupled with the first inductor. The first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor. The housing is filled with a magnetic molding compound.

公开(公告)号：US20210375540A1

公开(公告)日：2021-12-02

申请号：US17240656

申请日：2021-04-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Zhemin Zhang ,  Byron Lovell Williams ,  Dongbin Hou ,  Sombuddha Chakraborty

IPC: H01F41/04 ,  H01F17/00 ,  H01F17/04

Abstract: A laminate embedded core and coil structure comprises a magnetic core embedded in a laminate structure that includes two types of laminates. A first laminate embeds the coils of the structure and a second laminate fills space between the magnetic core and the first laminate, as well as space below the magnetic core and lower surface of the first laminate. The first and second laminates form a laminate structure that protects and improves isolation of the magnetic components. Solder resist encloses the laminate structure, magnetic core and coils. The laminate embedded core and coil structure may be assembled on a transformer leadframe of various types using non-conductive paste.

公开(公告)号：US12087498B2

公开(公告)日：2024-09-10

申请号：US17405017

申请日：2021-08-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin Hou ,  Sombuddha Chakraborty ,  Kenji Kawano ,  Jeffrey Morroni ,  Yuki Sato

IPC: H01F17/04 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28 ,  H01F27/34 ,  H01F41/00 ,  H02M3/158

CPC classification number: H01F27/346 ,  H01F27/022 ,  H01F27/24 ,  H01F27/2847 ,  H01F41/005 ,  H02M3/1584 ,  H02M3/1586

Abstract: A device includes a first inductor and a second inductor reversely coupled with the first inductor. The first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor. The housing is filled with a magnetic molding compound.

公开(公告)号：US11094455B2

公开(公告)日：2021-08-17

申请号：US16233804

申请日：2018-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin Hou ,  Sombuddha Chakraborty ,  Kenji Kawano ,  Jeffrey Morroni ,  Yuki Sato

IPC: H01F27/24 ,  H01F27/34 ,  H01F27/28 ,  H01F27/02 ,  H01F41/00 ,  H02M3/158

Abstract: A device includes a first inductor and a second inductor reversely coupled with the first inductor, wherein the first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor, wherein the housing is filled with a magnetic molding compound.

公开(公告)号：US20240428987A1

公开(公告)日：2024-12-26

申请号：US18826688

申请日：2024-09-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin Hou ,  Sombuddha Chakraborty ,  Kenji Kawano ,  Jeffrey Morroni ,  Yuki Sato

IPC: H01F27/34 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28 ,  H01F41/00 ,  H02M3/158

Abstract: In one example, an apparatus includes a base, a first inductor, and a second inductor. The first inductor is on the base. The first inductor has a first winding extension, a second winding extension, and a first winding coupled between the first winding extension and the second winding extension, in which at least a part of the second winding extension is vertically between at least a part of the first winding extension and the base. Also, the second inductor is on the base. The second inductor has a third winding extension, a fourth winding extension, and a second winding coupled between the third winding extension and the fourth winding extension, in which at least a part of the fourth winding extension is vertically between at least a part of the third winding extension and the base, and the second winding is laterally adjacent to the first winding.

公开(公告)号：US20220310302A1

公开(公告)日：2022-09-29

申请号：US17215457

申请日：2021-03-29

Applicant: Texas Instruments Incorporated

Inventor： Yi Yan ,  Zhemin Zhang ,  Ken Pham ,  Vijaylaxmi Khanolkar ,  Dongbin Hou

IPC: H01F27/26 ,  H01F27/28 ,  H01F41/02 ,  H01F41/06

Abstract: A microelectronic device includes a magnetic component having a first magnetic core segment and a second magnetic core segment, with a winding lamina between them. The first magnetic core segment includes a winding support portion with ferromagnetic material. The winding lamina is attached to the winding support portion. The first magnetic core segment also includes an extension portion with ferromagnetic material extending from the winding support portion. The winding lamina has winding loops of electrically conductive material that surround ferromagnetic material. A filler material is formed between the winding lamina and the first magnetic core segment, contacting both the winding lamina and the first magnetic core segment. The second magnetic core segment is attached to the extension portion of the first magnetic core segment. The second magnetic core segment includes ferromagnetic material. The winding loops are electrically coupled to external leads through electrical connections.

公开(公告)号：US11270937B2

公开(公告)日：2022-03-08

申请号：US16232684

申请日：2018-12-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin Hou ,  Steven Alfred Kummerl ,  Roberto Giampiero Massolini ,  Joyce Marie Mullenix

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/495 ,  H01L23/29 ,  H01L21/56 ,  H01L49/02

Abstract: An integrated circuit (IC) package comprises a semiconductor die, a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die, and an electrically conductive member electrically coupled to the leadframe. A magnetic mold compound encapsulates the electrically conductive member to form an inductor. A non-magnetic mold compound encapsulates the semiconductor die, the leadframe, and the magnetic mold compound.