公开(公告)号：US20150004739A1

公开(公告)日：2015-01-01

申请号：US14490924

申请日：2014-09-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Christopher Daniel Manack ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: B81C1/00

CPC classification number: B81C1/00246 ,  B81B7/0067 ,  B81B2201/0207 ,  B81C1/00269 ,  G01J5/045 ,  G01J5/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24245 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82

Abstract: A method for fabricating a micro-electro-mechanical system (MEMS) provides a semiconductor chip having a cavity with a radiation sensor MEMS. The opening of the cavity at the chip surface is covered by a plate transmissive to the radiation sensed by the MEMS. A patterned metal film is placed across the plate surface remote from the cavity.

Abstract translation: 微机电系统（MEMS）的制造方法提供具有辐射传感器MEMS的空腔的半导体芯片。 在芯片表面处的空腔的开口由对MEMS感测的辐射透射的板覆盖。 图案化的金属膜跨过位于空腔的板表面。

公开(公告)号：US09572261B2

公开(公告)日：2017-02-14

申请号：US14668085

申请日：2015-03-25

Applicant: Texas Instruments Incorporated

Inventor： Matthew D. Romig ,  Frank Stepniak ,  Saumya Gandhi

IPC: H05K1/18

CPC classification number: H01L23/5223 ,  H01L21/288 ,  H01L21/31051 ,  H01L21/76805 ,  H01L21/76831 ,  H01L21/76874 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/14 ,  H01L28/60 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H05K1/113 ,  H05K1/162 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0187 ,  H05K2201/0215 ,  H05K2201/10734

Abstract: An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.

Abstract translation: 一种电子系统，包括具有端子焊盘（310）的电子体（301）和嵌入电子体中的至少一个电容器。 所述电容器包括绝缘和粘合的第一聚合物膜（302），所述绝缘和粘合的第一聚合物膜（302）覆盖除了所述端子焊盘之外 高密度电容元件的片材（320），所述第一电容器端子是附着到膜（302）上的金属箔（321），所述第二端子是导电聚合物（324），所述绝缘体是介电性皮层（323） 。 片（320）具有一组通孔：第一组孔到达金属箔321），第二组孔到达端子（310），第三组孔到达导电聚合物（324）。 绝缘的第二聚合物膜（303），其衬在所述孔的侧壁上并平坦化所述片材表面; 和填充聚合物侧壁之间的通孔的金属（432），并在系统表面上形成导电迹线和附着垫。

公开(公告)号：US08847349B2

公开(公告)日：2014-09-30

申请号：US13723874

申请日：2012-12-21

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Screenivasan K. Koduri

IPC: H01L29/00 ,  H01L49/02

CPC classification number: H01L24/17 ,  H01L23/28 ,  H01L23/5226 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L28/00 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/16 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.

Abstract translation: 一种集成电路（IC）封装，其包括IC芯片和与IC芯片电连接的导电油墨印刷电路层。

公开(公告)号：US09899339B2

公开(公告)日：2018-02-20

申请号：US13668901

申请日：2012-11-05

Applicant: Texas Instruments Incorporated

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L21/60 ,  H01L23/64 ,  H01L23/00 ,  H01L23/522 ,  H01L23/532

CPC classification number: H01L23/64 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/5328 ,  H01L24/24 ,  H01L24/29 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24265 ,  H01L2224/245 ,  H01L2224/2919 ,  H01L2224/73217 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/82102 ,  H01L2224/822 ,  H01L2224/8221 ,  H01L2224/82399 ,  H01L2224/8284 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/92144 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/27 ,  H01L2224/8312 ,  H01L2924/00

Abstract: A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.

公开(公告)号：US09852979B2

公开(公告)日：2017-12-26

申请号：US15339550

申请日：2016-10-31

Applicant: Texas Instruments Incorporated

Inventor： Matthew D. Romig ,  Frank Stepniak ,  Saumya Gandhi

IPC: H01L23/522 ,  H01L21/768 ,  H01L23/528 ,  H01L21/288 ,  H01L21/78 ,  H01L29/02 ,  H01L21/3105 ,  H05K1/18 ,  H05K1/11 ,  H05K1/16 ,  H01L49/02 ,  H01L23/00

CPC classification number: H01L23/5223 ,  H01L21/288 ,  H01L21/31051 ,  H01L21/76805 ,  H01L21/76831 ,  H01L21/76874 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/14 ,  H01L28/60 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H05K1/113 ,  H05K1/162 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0187 ,  H05K2201/0215 ,  H05K2201/10734

Abstract: An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.

公开(公告)号：US20170047283A1

公开(公告)日：2017-02-16

申请号：US15339550

申请日：2016-10-31

Applicant: Texas Instruments Incorporated

Inventor： Matthew D. Romig ,  Frank Stepniak ,  Saumya Gandhi

IPC: H01L23/522 ,  H01L21/768 ,  H01L23/528 ,  H01L21/288 ,  H01L21/78 ,  H01L49/02 ,  H01L21/3105

CPC classification number: H01L23/5223 ,  H01L21/288 ,  H01L21/31051 ,  H01L21/76805 ,  H01L21/76831 ,  H01L21/76874 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/14 ,  H01L28/60 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H05K1/113 ,  H05K1/162 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0187 ,  H05K2201/0215 ,  H05K2201/10734

Abstract: An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.

Abstract translation: 一种电子系统，包括具有端子焊盘（310）的电子体（301）和嵌入电子体中的至少一个电容器。 所述电容器包括绝缘和粘合的第一聚合物膜（302），所述绝缘和粘合的第一聚合物膜（302）覆盖除了所述端子焊盘之外 高密度电容元件的片材（320），所述第一电容器端子是附着到膜（302）上的金属箔（321），所述第二端子是导电聚合物（324），所述绝缘体是介电性皮层（323） 。 片（320）具有一组通孔：第一组孔到达金属箔321），第二组孔到达端子（310），第三组孔到达导电聚合物（324）。 绝缘的第二聚合物膜（303），其衬在所述孔的侧壁上并平坦化所述片材表面; 和填充聚合物侧壁之间的通孔的金属（432），并在系统表面上形成导电迹线和附着垫。

公开(公告)号：US20160286654A1

公开(公告)日：2016-09-29

申请号：US14668085

申请日：2015-03-25

Applicant: Texas Instruments Incorporated

Inventor： Matthew D. Romig ,  Frank Stepniak ,  Saumya Gandhi

IPC: H05K1/18

CPC classification number: H01L23/5223 ,  H01L21/288 ,  H01L21/31051 ,  H01L21/76805 ,  H01L21/76831 ,  H01L21/76874 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/14 ,  H01L28/60 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H05K1/113 ,  H05K1/162 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0187 ,  H05K2201/0215 ,  H05K2201/10734

Abstract: An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.

Abstract translation: 一种电子系统，包括具有端子焊盘（310）的电子体（301）和嵌入电子体中的至少一个电容器。 所述电容器包括绝缘和粘合的第一聚合物膜（302），所述绝缘和粘合的第一聚合物膜（302）覆盖除了所述端子焊盘之外 高密度电容元件的片材（320），所述第一电容器端子是附着到膜（302）上的金属箔（321），所述第二端子是导电聚合物（324），所述绝缘体是介电性皮层（323） 。 片（320）具有一组通孔：第一组孔到达金属箔321），第二组孔到达端子（310），第三组孔到达导电聚合物（324）。 绝缘的第二聚合物膜（303），其衬在所述孔的侧壁上并平坦化所述片材表面; 和填充聚合物侧壁之间的通孔的金属（432），并在系统表面上形成导电迹线和附着垫。

公开(公告)号：US09321631B2

公开(公告)日：2016-04-26

申请号：US14490924

申请日：2014-09-19

Applicant: Texas Instruments Incorporated

Inventor： Christopher Daniel Manack ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: B81C1/00 ,  B81B7/00 ,  G01J5/12 ,  G01J5/04 ,  H01L23/00

CPC classification number: B81C1/00246 ,  B81B7/0067 ,  B81B2201/0207 ,  B81C1/00269 ,  G01J5/045 ,  G01J5/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24245 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82

Abstract: A method for fabricating a micro-electro-mechanical system (MEMS) provides a semiconductor chip having a cavity with a radiation sensor MEMS. The opening of the cavity at the chip surface is covered by a plate transmissive to the radiation sensed by the MEMS. A patterned metal film is placed across the plate surface remote from the cavity.

Abstract translation: 微机电系统（MEMS）的制造方法提供具有辐射传感器MEMS的空腔的半导体芯片。 在芯片表面处的空腔的开口由对MEMS感测的辐射透射的板覆盖。 图案化的金属膜跨过位于空腔的板表面。

公开(公告)号：US20150061103A1

公开(公告)日：2015-03-05

申请号：US14012145

申请日：2013-08-28

Applicant: Texas Instruments Deutschland GMBH ,  Texas Instruments Incorporated

Inventor： Christopher Daniel Manack ,  Frank Stepniak ,  Anton Winkler

IPC: H01L23/48 ,  H01L25/00

CPC classification number: H01L23/49827 ,  H01L23/49805 ,  H01L23/49838 ,  H01L23/5389 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/403 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method of making an electrical assembly includes making a laminate substrate, embedding a plurality of integrated circuit dies in the laminate substrate, forming a plurality of through-holes in the laminate substrate and adding conductive material to the through-holes, and making at least one saw cut extending through the laminate substrate and through the plurality of through-holes and the conductive material therein to form at least one laminate block with a cut face and a plurality of sectioned through-holes.

Abstract translation: 制造电气组件的方法包括制造层叠基板，将多个集成电路管芯嵌入层叠基板中，在层压基板中形成多个通孔并将导电材料添加到通孔，并至少使 一个锯切延伸穿过层叠基板并穿过多个通孔和其中的导电材料以形成具有切割面和多个分段通孔的至少一个层压块。

公开(公告)号：US10104764B2

公开(公告)日：2018-10-16

申请号：US14218523

申请日：2014-03-18

Applicant: Texas Instruments Incorporated ,  Texas Instruments Deutschland GmbH

Inventor： Frank Stepniak ,  Anton Winkler

IPC: H01H9/28 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18

Abstract: A system-in-a-package (SIP) has a semiconductor chip embedded in a dielectric substrate. An inductor is on a top surface of a substrate and is connected to the semiconductor chip. A thin film capacitor may be placed between the inductor and the dielectric substrate. A second thin film capacitor may be placed on the top surface of the semiconductor chip, or be embedded in the dielectric substrate with a thermal pad on a bottom surface of the substrate which is connected to the second thin film capacitor to facilitate heat dissipation.