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公开(公告)号：US11799190B2
公开(公告)日：2023-10-24
申请号：US17673352
申请日：2022-02-16
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Meysam Moallem , Ross Allan Kulak
CPC classification number: H01Q1/2283 , H01L23/3128 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L23/66 , H01P3/08 , H01Q1/48 , H01L2223/6627 , H01L2223/6677 , H01L2223/6683
Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.
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2.发明授权公开(公告)号：US11735806B2
公开(公告)日：2023-08-22
申请号：US16151441
申请日：2018-10-04
Applicant: Texas Instruments Incorporated
Inventor： Vikas Gupta , Meysam Moallem , Sadia Naseem
CPC classification number: H01Q1/2283 , H01L23/49838 , H01L23/66 , H01Q1/3233 , H01Q1/50 , H01Q1/525 , H01Q13/02 , H01Q21/0006 , H01L2223/6627 , H01L2223/6677
Abstract: A high frequency wireless device includes a three-dimensional (3D) antenna structure mounted on a PCB including a first antenna connected to a first waveguide feed and second antenna connected to a second waveguide feed. A packaged device on the PCB has a top metal surface including a transmit (Tx) radiating structure under the second waveguide feed and a receive (Rx) radiating structure under the first waveguide feed, and an RF connection from the top metal surface to its bottom surface. An IC die is flipchip attached to the bottom surface including at least one Rx channel and at least one Tx channel connected by the RF connection to the Rx and Tx radiating structures. Protruding metal features are on the dielectric layer under the first and second waveguide feeds on ≥2 sides of the Tx and the Rx radiating structure to create a waveguiding wall structure for directing signals.
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公开(公告)号：US11650304B2
公开(公告)日：2023-05-16
申请号：US17019509
申请日：2020-09-14
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Dan Wang , Meysam Moallem , Brian Ginsburg
IPC: G01S13/44 , G01S7/02 , G01S7/35 , G01S13/50 , G01S13/87 , G01S13/34 , G01S13/931 , G01S13/933
CPC classification number: G01S13/449 , G01S7/024 , G01S7/025 , G01S7/026 , G01S7/354 , G01S13/50 , G01S13/878 , G01S13/346 , G01S13/931 , G01S13/933
Abstract: A millimeter or mm-wave system includes transmission of a millimeter wave (mm-wave) radar signal by a transmitter to an object. The transmitted mm-wave radar signal may include at least two signal orientations, and in response to each signal orientation, the object reflects corresponding signal reflections. The signal reflections are detected and a determination is made as to location of the object.
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公开(公告)号：US11258161B2
公开(公告)日：2022-02-22
申请号：US16559019
申请日：2019-09-03
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Meysam Moallem , Ross Allan Kulak
Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.
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公开(公告)号：US20240297433A1
公开(公告)日：2024-09-05
申请号：US18658350
申请日：2024-05-08
Applicant: Texas Instruments Incorporated
Inventor： Meysam Moallem
CPC classification number: H01Q1/2283 , H01Q23/00 , H01L27/0203 , H01Q1/24
Abstract: Integrated circuit packages are provided. In an example integrated circuit package, a first substrate includes a set of conductor layers including first and second conductor layers, and at least one dielectric layer disposed between the first and second conductor layers; antennas disposed in the first conductor layer. A ground plane is disposed in the second conductor layer, and a set of vias is coupled between the antennas and the ground plane. A second substrate having a first side is coupled to the first substrate via a first set of package connectors. An integrated circuit die is disposed between the first and second substrates and has a side that is coupled to the set of conductor layers. A second set of package connectors coupled to a second side of the second substrate.
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Patent Agency Ranking
公开(公告)号：US12015191B2
公开(公告)日：2024-06-18
申请号：US16559094
申请日：2019-09-03
Applicant: Texas Instruments Incorporated
Inventor： Meysam Moallem
CPC classification number: H01Q1/2283 , H01Q23/00 , H01L27/0203 , H01Q1/24
Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes an integrated circuit die and an antenna substrate coupled to the integrated circuit die. The antenna substrate includes a conductor layer and a first dielectric layer disposed between the conductor layer and the integrated circuit die. The conductor layer includes antennas electrically coupled to the integrated circuit die. The integrated circuit package further includes an I/O substrate coupled to the integrated circuit die opposite the antenna substrate. In some such examples, the I/O substrate includes interconnect connectors and a second dielectric layer disposed between the interconnect connectors and the integrated circuit die. In some such examples, the integrated circuit package includes interconnect connectors extending between the antenna substrate and the I/O substrate.
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公开(公告)号：US20220209779A1
公开(公告)日：2022-06-30
申请号：US17246300
申请日：2021-04-30
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Nikita Mahjabeen , Hassan Omar Ali , Meysam Moallem
Abstract: In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.
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公开(公告)号：US20190393581A1
公开(公告)日：2019-12-26
申请号：US16559492
申请日：2019-09-03
Applicant: Texas Instruments Incorporated
Inventor： Meysam Moallem
Abstract: In described examples, an integrated waveguide transition includes a substrate with a waveguide side and an opposing waveguide termination side. A first layer of metal covers a portion of the waveguide side, a second layer of metal is separated from the first layer of metal by a first layer of dielectric, and a third layer of metal covers a portion of the waveguide termination side and is separated from the second layer of metal by a second layer of dielectric. A substrate waveguide perpendicular to a plane of the substrate extends from the waveguide side to the waveguide termination side; and a length and a width of the substrate waveguide is defined by a fence of ground-stitching vias that short the first layer of metal and the second layer of metal to a plate of the third layer of metal that forms a back short.
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公开(公告)号：US11552382B2
公开(公告)日：2023-01-10
申请号：US17088877
申请日：2020-11-04
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Meysam Moallem , Guor-Chaur Jung , Brian P. Ginsburg
Abstract: A radio frequency (RF) loopback substrate or printed circuit board (PCB) which contains receive and transmit antennas located on the bottom of the loopback substrate which are aligned with the complementary transmit and receive antennas on an antenna on package (AOP) device under test. The loopback substrate receive and transmit antennas are coupled to each other. The device under test contacts are driven by a conventional tester, which causes RF circuitry in the integrated circuit to drive an AOP transmit antenna. The corresponding loopback substrate receive antenna receives the RF signal from the AOP transmit antenna and provides it to the loopback substrate transmit antennas. The integrated circuit package AOP receive antennas then receive the RF signals from the loopback substrate transmit antennas. The signals at the integrated circuit package AOP receive antennas are monitored through the integrated circuit contacts to monitor the received RF signals.
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公开(公告)号：US11417938B2
公开(公告)日：2022-08-16
申请号：US16559492
申请日：2019-09-03
Applicant: Texas Instruments Incorporated
Inventor： Meysam Moallem
Abstract: In described examples, an integrated waveguide transition includes a substrate with a waveguide side and an opposing waveguide termination side. A first layer of metal covers a portion of the waveguide side, a second layer of metal is separated from the first layer of metal by a first layer of dielectric, and a third layer of metal covers a portion of the waveguide termination side and is separated from the second layer of metal by a second layer of dielectric. A substrate waveguide perpendicular to a plane of the substrate extends from the waveguide side to the waveguide termination side; and a length and a width of the substrate waveguide is defined by a fence of ground-stitching vias that short the first layer of metal and the second layer of metal to a plate of the third layer of metal that forms a back short.
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