公开(公告)号：US11799190B2

公开(公告)日：2023-10-24

申请号：US17673352

申请日：2022-02-16

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Meysam Moallem ,  Ross Allan Kulak

IPC: H01Q1/22 ,  H01Q1/48 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01P3/08

CPC classification number: H01Q1/2283 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/66 ,  H01P3/08 ,  H01Q1/48 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6683

Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.

公开(公告)号：US11258161B2

公开(公告)日：2022-02-22

申请号：US16559019

申请日：2019-09-03

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Meysam Moallem ,  Ross Allan Kulak

IPC: H01Q1/22 ,  H01Q1/48 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01P3/08

Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.