公开(公告)号：US11257814B2

公开(公告)日：2022-02-22

申请号：US16428682

申请日：2019-05-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Michael Szelong ,  James Robert Todd ,  Tobias Bernhard Fritz ,  Ralf Peter Brederlow

IPC: H01L27/08 ,  G01L1/18 ,  H01L49/02

Abstract: An integrated circuit comprises a semiconductor substrate having a surface. A lateral resistor is arranged in a first plane parallel to the surface of the substrate. A vertical reference resistor comprises a layer arranged in a second plane parallel to the surface of the substrate and deeper than the first plane. This layer is doped to promote current flow in the second plane. The vertical reference resistor further comprises a first trench and a second trench coupled between the layer and the surface of the substrate. The first and second trenches are arranged in a vertical direction orthogonal to the first and the second planes and are doped to impede current flow in the vertical direction. A cross-section of the first and second trenches is two-fold rotationally symmetric around the vertical direction, and the lateral resistor and the first and second trenches have the same temperature coefficient.

公开(公告)号：US20250017113A1

公开(公告)日：2025-01-09

申请号：US18886687

申请日：2024-09-16

Applicant: Texas Instruments Incorporated

Inventor： Umidjon Nurmetov ,  Ralf Peter Brederlow ,  Baher Haroun ,  Jose Antonio Vieira Formenti ,  Michael Szelong ,  Tobias Bernhard Fritz

IPC: H10N30/30 ,  G01L1/18 ,  G01L1/22 ,  H10N30/80

Abstract: In described examples, a circuit includes a substrate and a first resistor on the substrate, the first resistor in a first direction. The circuit also includes a second resistor on the substrate, the second resistor coupled to the first resistor, the second resistor in a second direction, the second direction and the first direction transversely oriented and a device on the substrate.

公开(公告)号：US11653568B2

公开(公告)日：2023-05-16

申请号：US17136413

申请日：2020-12-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Baher Haroun ,  Tobias Bernhard Fritz ,  Michael Szelong ,  Ernst Muellner

IPC: H01L41/113 ,  H01L27/20 ,  G01L1/18 ,  H01L41/311 ,  H01L25/16 ,  H01L23/31 ,  H01L41/053

CPC classification number: H01L41/311 ,  G01L1/18 ,  H01L23/3107 ,  H01L25/165 ,  H01L27/20 ,  H01L41/053 ,  H01L41/1132

Abstract: An integrated circuit is described herein that includes a semiconductor substrate. First and second piezoresistive sensors are on or in the substrate where each have a respective sensing axis extending in first and second directions respectively parallel with a surface of the substrate, where the second direction is perpendicular to the first direction. A third piezoresistive sensor is on or in the substrate and has a respective sensing axis extending in a third direction parallel with the surface of the substrate and neither parallel nor perpendicular to the first and second directions.

公开(公告)号：US11536773B2

公开(公告)日：2022-12-27

申请号：US17389415

申请日：2021-07-30

Applicant: Texas Instruments Incorporated

Inventor： Jose Antonio Vieira Formenti ,  Michael Szelong ,  Takao Oshida ,  Tobias Bernhard Fritz ,  Vishnu Ravinuthula

IPC: G01R31/374 ,  G01L1/22 ,  G01R31/3835 ,  H03M1/38

Abstract: An electronic device includes an ADC, a multiplexer, a voltage reference circuit, an analog circuit, and a digital circuit. The ADC has a signal input, a reference input, and an output. The multiplexer has signal inputs and a signal output coupled to the signal input of the ADC. The voltage reference circuit has an output coupled to the reference input of the ADC, a first strain sensor coupled to a first signal input of the multiplexer, a second strain sensor coupled to a second signal input of the multiplexer, and a temperature sensor. The analog circuit has an input coupled to a battery, and an output coupled to a fourth signal input of the multiplexer. The digital circuit is coupled to the output of the ADC and stores correction parameters for correcting a converted battery voltage value from the ADC.

公开(公告)号：US20220020915A1

公开(公告)日：2022-01-20

申请号：US16932343

申请日：2020-07-17

Applicant: Texas Instruments Incorporated

Inventor： Umidjon Nurmetov ,  Ralf Peter Brederlow ,  Baher Haroun ,  Jose Antonio Vieira Formenti ,  Michael Szelong ,  Tobias Bernhard Fritz

IPC: H01L41/113 ,  H01L41/04 ,  G01L1/22 ,  G01L1/18

Abstract: In described examples, a circuit includes an analog frontend arranged to generate an analog stress compensating signal in response to a to-be-compensated analog signal and a first-axis stress sensing signal. The analog frontend can comprise a first precision component (e.g., 220) arranged on a piezoelectric material and arranged to generate the to-be-compensated analog signal that is affected by a stress exerted in the piezoelectric material and a directional stress sensor arranged on the piezoelectric material and coupled to the first precision component. The directional stress sensor is arranged to generate the first-axis sensing signal in response to a longitudinal resultant of a stress exerted in the piezoelectric material. A compensating circuit is arranged to generate a compensated output signal in response to the compensating analog signal and to-be-compensated analog signal.

公开(公告)号：US12127480B2

公开(公告)日：2024-10-22

申请号：US16932343

申请日：2020-07-17

Applicant: Texas Instruments Incorporated

Inventor： Umidjon Nurmetov ,  Ralf Peter Brederlow ,  Baher Haroun ,  Jose Antonio Vieira Formenti ,  Michael Szelong ,  Tobias Bernhard Fritz

IPC: G01L1/18 ,  G01L1/22 ,  H10N30/30 ,  H10N30/80

CPC classification number: H10N30/302 ,  G01L1/18 ,  G01L1/2268 ,  H10N30/802

Abstract: In described examples, a circuit includes an analog frontend arranged to generate an analog stress compensating signal in response to a to-be-compensated analog signal and a first-axis stress sensing signal. The analog frontend can comprise a first precision component (e.g., 220) arranged on a piezoelectric material and arranged to generate the to-be-compensated analog signal that is affected by a stress exerted in the piezoelectric material and a directional stress sensor arranged on the piezoelectric material and coupled to the first precision component. The directional stress sensor is arranged to generate the first-axis sensing signal in response to a longitudinal resultant of a stress exerted in the piezoelectric material. A compensating circuit is arranged to generate a compensated output signal in response to the compensating analog signal and to-be-compensated analog signal.

公开(公告)号：US11581309B2

公开(公告)日：2023-02-14

申请号：US17675066

申请日：2022-02-18

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Michael Szelong ,  James Robert Todd ,  Tobias Bernhard Fritz ,  Ralf Peter Brederlow

IPC: H01L27/08 ,  G01L1/18 ,  H01L49/02

Abstract: An integrated circuit comprises a semiconductor substrate having a surface. A lateral resistor is arranged in a first plane parallel to the surface of the substrate. A vertical reference resistor comprises a layer arranged in a second plane parallel to the surface of the substrate and deeper than the first plane. This layer is doped to promote current flow in the second plane. The vertical reference resistor further comprises a first trench and a second trench coupled between the layer and the surface of the substrate. The first and second trenches are arranged in a vertical direction orthogonal to the first and the second planes and are doped to impede current flow in the vertical direction. A cross-section of the first and second trenches is two-fold rotationally symmetric around the vertical direction, and the lateral resistor and the first and second trenches have the same temperature coefficient.

公开(公告)号：US20220187378A1

公开(公告)日：2022-06-16

申请号：US17389415

申请日：2021-07-30

Applicant: Texas Instruments Incorporated

Inventor： Jose Antonio Vieira Formenti ,  Michael Szelong ,  Takao Oshida ,  Tobias Bernhard Fritz ,  Vishnu Ravinuthula

IPC: G01R31/374 ,  H03M1/38 ,  G01R31/3835 ,  G01L1/22

Abstract: An electronic device includes an ADC, a multiplexer, a voltage reference circuit, an analog circuit, and a digital circuit. The ADC has a signal input, a reference input, and an output. The multiplexer has signal inputs and a signal output coupled to the signal input of the ADC. The voltage reference circuit has an output coupled to the reference input of the ADC, a first strain sensor coupled to a first signal input of the multiplexer, a second strain sensor coupled to a second signal input of the multiplexer, and a temperature sensor. The analog circuit has an input coupled to a battery, and an output coupled to a fourth signal input of the multiplexer. The digital circuit is coupled to the output of the ADC and stores correction parameters for correcting a converted battery voltage value from the ADC.