公开(公告)号：EP0713117B1

公开(公告)日：1999-09-08

申请号：EP95117185.9

申请日：1995-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Smith, Gregory C. ,  Gove, Robert J. ,  Boysel, Robert M. ,  Markandey, Vishal ,  Hornbeck, Larry J.

IPC: G02B26/08

CPC classification number: B81C1/00111 ,  B81B2201/042 ,  B81C2201/014 ,  G02B26/0841 ,  G06K15/1252 ,  G09G3/20 ,  G09G3/2022 ,  G09G2340/0407 ,  G09G2340/0414 ,  G09G2340/0421 ,  G09G2340/0442 ,  G09G2360/02 ,  H04N1/1934 ,  H04N5/4401 ,  H04N5/7458 ,  H04N7/01

公开(公告)号：EP0614102A3

公开(公告)日：1994-11-30

申请号：EP94103104.9

申请日：1994-03-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Smith, Gregory C.

IPC: G02B26/08 ,  H01L21/00

CPC classification number: G02B26/08 ,  G02B26/0841 ,  Y10T156/1082

Abstract: A method of fabricating debris intolerant devices 30 , and especially micro-mechanical devices such as DMDs, that allows wafers to be sawn prior to completing all fabrication steps. Some devices are too fragile to allow cleaning operations to be performed after fabrication of the device. A solution is to saw and clean the wafers prior to completing the fabrication steps that make the device fragile. To prevent having to process the chips 30 individually, a substrate wafer 28 is attached to the backside of the dicing tape 24 . This substrate wafer holds the sawn chips 30 in alignment allowing the remaining fabrication steps to be performed in wafer form.

Abstract translation: 一种制造碎片不允许装置30的方法，尤其是微机械装置，例如DMD，其允许在完成所有制造步骤之前锯切晶片。 有些设备太脆弱，无法在制造设备后进行清洁操作。 解决方案是在完成使器件易碎的制造步骤之前切割并清洁晶片。 为了防止必须单独处理芯片30，将衬底晶片28附接到切割带24的背面。该衬底晶片保持锯齿状芯片30对齐，以允许剩余的制造步骤以晶片形式进行。

公开(公告)号：EP0614102B1

公开(公告)日：1998-12-09

申请号：EP94103104.9

申请日：1994-03-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Smith, Gregory C.

IPC: G02B26/08 ,  H01L21/00

CPC classification number: G02B26/08 ,  G02B26/0841 ,  Y10T156/1082

公开(公告)号：EP0713117A1

公开(公告)日：1996-05-22

申请号：EP95117185.9

申请日：1995-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Smith, Gregory C. ,  Gove, Robert J. ,  Boysel, Robert M. ,  Markandey, Vishal ,  Hornbeck, Larry J.

IPC: G02B26/08

CPC classification number: B81C1/00111 ,  B81B2201/042 ,  B81C2201/014 ,  G02B26/0841 ,  G06K15/1252 ,  G09G3/20 ,  G09G3/2022 ,  G09G2340/0407 ,  G09G2340/0414 ,  G09G2340/0421 ,  G09G2340/0442 ,  G09G2360/02 ,  H04N1/1934 ,  H04N5/4401 ,  H04N5/7458 ,  H04N7/01

Abstract: A support pillar 408 for use with a micromechanical device, particularly a digital micromirror device, comprising a pillar material 404 supported by a substrate 400 and covered with a metal layer 406. The support pillar 408 is fabricated by depositing a layer of pillar material on a substrate 400, patterning the pillar layer to define a support pillar 408, and depositing a metal layer 406 over the support pillar 408 enclosing the support pillar. A planar surface even with the top of the pillar may be created by applying a spacer layer 410 over the pillars 408. After applying the spacer layer 410, holes 414 are patterned into the spacer layer to remove any spacer material that is covering the pillars. The spacer layer is then reflowed to fill the holes and lower the surface of the spacer layer such that the surface is coplanar with the tops of the support pillars 408.

Abstract translation: 用于微机械装置，特别是数字微镜装置的支撑柱408，其包括由衬底400支撑并被金属层406覆盖的支柱材料404.支撑柱408通过将柱材料层沉积在 衬底400，图案化柱层以限定支撑柱408，以及在包围支撑柱的支撑柱408上沉积金属层406。 可以通过在柱408上施加间隔层410来产生甚至具有柱顶部的平面。在施加间隔层410之后，将孔414图案化成间隔层，以移除覆盖柱的任何间隔物材料。 然后将间隔层回流以填充孔并降低间隔层的表面，使得表面与支撑柱408的顶部共面。图像

公开(公告)号：EP0614102A2

公开(公告)日：1994-09-07

申请号：EP94103104.9

申请日：1994-03-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Smith, Gregory C.

IPC: G02B26/08 ,  H01L21/00

CPC classification number: G02B26/08 ,  G02B26/0841 ,  Y10T156/1082

Abstract: A method of fabricating debris intolerant devices 30 , and especially micro-mechanical devices such as DMDs, that allows wafers to be sawn prior to completing all fabrication steps. Some devices are too fragile to allow cleaning operations to be performed after fabrication of the device. A solution is to saw and clean the wafers prior to completing the fabrication steps that make the device fragile. To prevent having to process the chips 30 individually, a substrate wafer 28 is attached to the backside of the dicing tape 24 . This substrate wafer holds the sawn chips 30 in alignment allowing the remaining fabrication steps to be performed in wafer form.

Abstract translation: 制造碎片不耐受装置30，特别是诸如DMD的微机械装置的方法，其允许在完成所有制造步骤之前锯切锯片。 一些设备太脆弱，不允许在制造设备之后进行清洁操作。 解决方案是在完成使器件易碎的制造步骤之前锯切和清洁晶片。 为了防止必须单独处理芯片30，将衬底晶片28附接到切割带24的背面。该衬底晶片将锯切芯片30保持对准，从而可以以晶片形式执行剩余的制造步骤。