公开(公告)号：US20230033082A1

公开(公告)日：2023-02-02

申请号：US17389619

申请日：2021-07-30

Applicant: Texas Instruments Incorporated

Inventor： Ting-Ta YEN ,  Yao YU ,  Hassan Omar ALI

IPC: H03H9/54 ,  H03H9/17 ,  H03H9/02

Abstract: A circuit includes a semiconductor substrate and an integrated passive device. The integrated passive device is on a surface of the semiconductor substrate. The integrated passive device is in a metal layer on the semiconductor substrate. The metal layer is at least tens of micrometers thick. The integrated passive device may be an inductor or a capacitor in some examples.

公开(公告)号：US20240002216A1

公开(公告)日：2024-01-04

申请号：US17854457

申请日：2022-06-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hakhamanesh MANSOORZARE ,  Ting-Ta YEN ,  Yao YU

IPC: B81B3/00 ,  B81B7/02

CPC classification number: B81B3/0021 ,  B81B7/02 ,  B81B3/0051 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/0163 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/033

Abstract: A circuit includes: integrated circuit (IC) layers; a cavity formed in at least one of the IC layers; and a micro-acoustic resonator suspended in the cavity by an anchor. The anchor includes: a bridge portion coupled to the micro-acoustic resonator and extending over the cavity; a first acoustic reflector portion adjacent the bridge portion, extending over the cavity, and oriented differently than the bridge portion; and a second acoustic reflector portion adjacent the first acoustic reflector portion, extending over the cavity, and oriented differently than the first acoustic reflector portion.