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1.发明公开Apparatus and method of manufacture of pressure sensor having a laminated substrate 失效用于生产压力换能器与层叠基板的方法和装置。
公开(公告)号：EP0553725A2
公开(公告)日：1993-08-04
申请号：EP93100947.6
申请日：1993-01-22
Applicant: THE FOXBORO COMPANY
Inventor： Koen, Edward F. , Vernon, Robert D.
CPC classification number: G01L19/0084 , G01L9/0042 , G01L19/147 , G01L27/007 , H01L2224/48091 , H01L2224/73265 , Y10T29/49103 , H01L2924/00014
Abstract: A pressure sensor sub-assembly (18) has a solid-state sensing element (22) mounted on a laminated ceramic substrate (20) and has the electrical signal contacts (22a) on the sensing element electrically connected to connector pins (24) on the substrate. A manufacturing process can fabricate a batch of sub-assemblies on a substrate structure that is sub-divided to form the separate sub-assemblies. The sensor sub-assemblies can be tested, and graded, before or after the sub-division step, and then each mounted in a housing.
Abstract translation: 一种压力传感器子组件（18）具有安装在层叠陶瓷衬底（20）（22）的固态检测元件和具有电连接到上连接器引脚（24）的感测元件上的电信号触头（22a）的 基板。 的制造方法可以制造一批子组件上的基底结构没有被细分以形成单独的子组件。 所述传感器子组件可以被测试，和分级，之前或子分割步骤之后，再分别安装在壳体中。
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2.发明授权Apparatus and method of manufacture of pressure sensor having a laminated substrate 失效用于制造压力转换器的带的层叠基板的方法和装置
公开(公告)号：EP0553725B1
公开(公告)日：1997-03-26
申请号：EP93100947.6
申请日：1993-01-22
Applicant: THE FOXBORO COMPANY
Inventor： Koen, Edward F. , Vernon, Robert D.
CPC classification number: G01L19/0084 , G01L9/0042 , G01L19/147 , G01L27/007 , H01L2224/48091 , H01L2224/73265 , Y10T29/49103 , H01L2924/00014
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3.发明公开Apparatus and method of manufacture of pressure sensor having a laminated substrate 失效具有层压基板的压力传感器的装置及其制造方法
公开(公告)号：EP0553725A3
公开(公告)日：1993-10-20
申请号：EP93100947.6
申请日：1993-01-22
Applicant: THE FOXBORO COMPANY
Inventor： Koen, Edward F. , Vernon, Robert D.
CPC classification number: G01L19/0084 , G01L9/0042 , G01L19/147 , G01L27/007 , H01L2224/48091 , H01L2224/73265 , Y10T29/49103 , H01L2924/00014
Abstract: A pressure sensor sub-assembly (18) has a solid-state sensing element (22) mounted on a laminated ceramic substrate (20) and has the electrical signal contacts (22a) on the sensing element electrically connected to connector pins (24) on the substrate. A manufacturing process can fabricate a batch of sub-assemblies on a substrate structure that is sub-divided to form the separate sub-assemblies. The sensor sub-assemblies can be tested, and graded, before or after the sub-division step, and then each mounted in a housing.
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