Abstract:
An antenna bracket for electronic devices includes a solid bracket having an aperture formed therethrough. The solid antenna bracket has side walls that are rounded to a predetermined radius, and at least one antenna pocket positioned on said side walls. The antenna pocket receives and secures at least one antenna. The antenna bracket has a polygon shape that follows the contours of the electronic device housing.
Abstract:
The present disclosure relates to a printed circuit board assembly including a printed circuit board, a first shielding structure located on a first surface of the printed circuit board and having a first extension element extending from the first shielding structure and through a first hole in the printed circuit board, a second shielding structure located on a second surface of the printed circuit board. According to at least one embodiment on the present disclosure, a first contacting element of the first extension element makes a mechanical and electrical contact between the first shielding structure and the second shielding structure in a contact region entirely located outside the first hole from which the first extension element is extending through.
Abstract:
An electronic device is provided that includes a vertical chassis wall having an aperture; a horizontal circuit board that extends toward the vertical chassis wall; an F-connector connected to the horizontal circuit board on a first side and extending out of the vertical chassis wall through the aperture; and an inner shield that shields a radiofrequency circuit components mounted on the first side of the circuit board. The inner shield includes tabs that extend partially into solder plated clearance holes in the horizontal circuit board and are reflow-soldered into the clearance holes. The tabs have distal ends that terminate between a plane of the first side and a plane of a second side of the circuit board.
Abstract:
A retaining clip adapted to be applied to secure and/or compress e.g., a heat sink element, to one or more assemblies of an electronic device may include a first planar region having a first end (e.g., a top end), and a second end, e.g., opposite or distal to the first end (e.g., a bottom end); a second planar region on the second end of the first planar region; a third planar region on the first end of the first planar region; a V-shape bend on an end of the third planar region; and an L-shape bend on an end of the second planar region.
Abstract:
An electronic device includes a circuit board having heat generating components thereon. A heat sink with air current generating electric device assembly lies over the circuit board, through which heat from the circuit board and the components thereon is dispersed. The assembly includes a heat sink having a solid central core and a plurality of fins protruding from the core. An air current generating electric device is disposed over the heat sink and having an air intake facing a top of the heat sink and an exhaust opening directed parallel to a plane of the circuit board. An air duct extends from the exhaust opening of the air current generating electric device to exhaust apertures on at least one side wall of the electronic device.