THERMAL MITIGATION CONTROL RETAINING CLIP
    4.
    发明申请

    公开(公告)号:US20180158755A1

    公开(公告)日:2018-06-07

    申请号:US15811004

    申请日:2017-11-13

    CPC classification number: H01L23/4093

    Abstract: A retaining clip adapted to be applied to secure and/or compress e.g., a heat sink element, to one or more assemblies of an electronic device may include a first planar region having a first end (e.g., a top end), and a second end, e.g., opposite or distal to the first end (e.g., a bottom end); a second planar region on the second end of the first planar region; a third planar region on the first end of the first planar region; a V-shape bend on an end of the third planar region; and an L-shape bend on an end of the second planar region.

    ELECTRONIC DEVICE WITH COMBINATION HEAT SINK/BLOWER OR FAN ASSEMBLY HAVING AIR DUCT
    5.
    发明申请
    ELECTRONIC DEVICE WITH COMBINATION HEAT SINK/BLOWER OR FAN ASSEMBLY HAVING AIR DUCT 有权
    具有组合式散热器/鼓风机或风扇组件的电子设备

    公开(公告)号:US20150305137A1

    公开(公告)日:2015-10-22

    申请号:US14437550

    申请日:2013-10-22

    Abstract: An electronic device includes a circuit board having heat generating components thereon. A heat sink with air current generating electric device assembly lies over the circuit board, through which heat from the circuit board and the components thereon is dispersed. The assembly includes a heat sink having a solid central core and a plurality of fins protruding from the core. An air current generating electric device is disposed over the heat sink and having an air intake facing a top of the heat sink and an exhaust opening directed parallel to a plane of the circuit board. An air duct extends from the exhaust opening of the air current generating electric device to exhaust apertures on at least one side wall of the electronic device.

    Abstract translation: 电子设备包括其上具有发热部件的电路板。 具有气流发生电气装置组件的散热器位于电路板上方,来自电路板和其上的部件的热量分散在该电路板上。 该组件包括具有实心中心芯片的散热器和从芯体突出的多个翅片。 气流发生电气装置设置在散热器上方并且具有面向散热器顶部的进气口和平行于电路板平面的排气口。 空气管道从气流发生电气设备的排气口延伸到电子设备的至少一个侧壁上的排气孔。

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