公开(公告)号：EP2112767A4

公开(公告)日：2010-02-03

申请号：EP07807014

申请日：2007-09-10

Applicant: TOA CORP

Inventor： NAKASHIMA MITSURU ,  MORIGUCHI KOJI

IPC: H04B1/04 ,  H01Q9/16

CPC classification number: H01Q1/50 ,  H01Q9/16

公开(公告)号：CA2662472C

公开(公告)日：2013-09-03

申请号：CA2662472

申请日：2007-09-10

Applicant: TOA CORP

Inventor： NAKASHIMA MITSURU ,  MORIGUCHI KOJI

IPC: H04B1/04 ,  H01Q9/16

Abstract: A wireless microphone device enables a circuit board, which is to be provided with an oscillation circuit, to be decreased in size without deteriorating radiation characteristics. The wireless microphone device includes: a circuit board that is sectioned into circuit areas and makes the respective circuit areas function as antenna elements of a dipole antenna; an oscillation circuit that is arranged in the circuit area and generates a high frequency signal on the basis of a voice signal from a microphone; a feeding path for feeding the high frequency signal to an electrically conductive layer in the circuit area through a feeding point positioned on the circuit area side distant from the oscillation circuit; and a high frequency shield covering at least a part of the feeding path. The high frequency shield is formed by covering the feeding path with a metal case having an opening at a bottom face and conducting the metal case to the electrically conducting layer in the circuit area.

公开(公告)号：CA2662472A1

公开(公告)日：2008-03-20

申请号：CA2662472

申请日：2007-09-10

Applicant: TOA CORP

Inventor： NAKASHIMA MITSURU ,  MORIGUCHI KOJI

IPC: H04B1/04 ,  H01Q9/16

Abstract: [PROBLEMS] To provide a wireless microphone device capable of reducing a circuit substrate where an oscillation circuit is provided without degrading the radiation characteristic. [MEANS FOR SOLVING PROBLEMS] A wireless micro phone device includes: a circuit substrate (5) divided into circuit regions (11a, 11b) so that each of the circuit regions functions as an antenna eleme nt of a dipole antenna; an oscillation circuit (21) arranged in the circuit region (11b) and generating a high-frequency signal according to an audio si gnal from a microphone (2a); a power supply channel for supplying the high-f requency signal to a conductive layer (11) in the circuit region (11b); and a high-frequency shield covering at least a part of the power supply channel . The high-frequency shield is formed by a metal case (12) having an opening at its bottom. The metal case (12) covers the power supply channel and conn ected to the conductive layer (11) in the circuit region (11b).