公开(公告)号：HK1131457A1

公开(公告)日：2010-01-22

申请号：HK09111142

申请日：2009-11-27

Applicant: TOPPAN FORMS CO LTD

Inventor： SAKURAI TAKAHIRO ,  ITO YUICHI

IPC: B42D20060101 ,  G06K20060101

Abstract: This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.

公开(公告)号：HK1131836A1

公开(公告)日：2010-02-05

申请号：HK09110797

申请日：2009-11-18

Applicant: TOPPAN FORMS CO LTD

Inventor： SAKURAI TAKAHIRO ,  ITO YUICHI

IPC: B42D20060101 ,  G06K20060101

Abstract: The window base material of the present invention is provided with an intermediate layer having a window section composed of transparent resin and a colored section composed of colored resin surrounding the window section, and a transparent first base material and second base material which sandwich the intermediate layer. The card with embedded module of the present invention is provided with a module having a display element, an adhesive layer covering the module, and a paired third base material and fourth base material which sandwich the module with interposition of the adhesive layer, wherein the third base material is composed of the window base material, and the display section of the display element is disposed so as to face the window section of the window base material. According to the present invention, a card with embedded module is offered, which incorporates a display element as an electronic component, which renders the display section of this display element visible from the outside, and which is easy to manufacture.

公开(公告)号：EP2085914A4

公开(公告)日：2012-09-12

申请号：EP07831391

申请日：2007-11-07

Applicant: TOPPAN FORMS CO LTD

Inventor： SAKURAI TAKAHIRO ,  ITO YUICHI

IPC: G06K19/077 ,  B32B5/14 ,  B42D15/10 ,  G06K19/07

CPC classification number: G06K19/077 ,  B32B3/08 ,  B32B3/18 ,  B32B5/024 ,  B32B7/12 ,  B32B27/08 ,  B32B27/10 ,  B32B27/12 ,  B32B27/16 ,  B32B27/20 ,  B32B27/28 ,  B32B27/281 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2307/40 ,  B32B2307/402 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2307/714 ,  B32B2307/734 ,  B32B2425/00 ,  G06K19/07703 ,  Y10T29/49146

公开(公告)号：EP2093704A4

公开(公告)日：2010-01-20

申请号：EP07831392

申请日：2007-11-07

Applicant: TOPPAN FORMS CO LTD

Inventor： SAKURAI TAKAHIRO ,  ITO YUICHI

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07

CPC classification number: G06K19/07749 ,  G06K19/07728 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：JP2014170102A

公开(公告)日：2014-09-18

申请号：JP2013041655

申请日：2013-03-04

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： ITO YUICHI

IPC: G09F9/30

Abstract: PROBLEM TO BE SOLVED: To improve visibility without providing a concealing layer or without increase in cost of using a multilayer substrate.SOLUTION: A direction of display electrodes wiring 13a-13p toward display electrodes 11a-11p, and a direction of background electrode wiring 14a-14z and 15a-15c toward background electrodes 12a-12x are configured in mutually opposite directions in the display electrodes 11a-11p and the background electrodes 12a-12x surrounding those.

Abstract translation: 要解决的问题：提高可见度而不提供隐蔽层或不增加使用多层基板的成本。解决方案：显示电极布线13a-13p朝向显示电极11a-11p的方向和背景电极布线14a的方向 朝向背景电极12a-12x的-14z和15a-15c在显示电极11a-11p和围绕它们的背景电极12a-12x之间沿彼此相反的方向配置。

公开(公告)号：JP2013071330A

公开(公告)日：2013-04-22

申请号：JP2011212476

申请日：2011-09-28

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： ITO YUICHI

IPC: B42D15/10

Abstract: PROBLEM TO BE SOLVED: To provide an information card, the bar code formed on the end face of which can be individually read while a number of information cards are superposed, and to provide a method for manufacturing the same.SOLUTION: The information card 10 includes a core base material 11, and surface base materials 12 and 13 laminated on both sides of the core base material 11. The core base material 11 comprises polyvinyl chloride, and the surface base materials 12 and 13 comprise a base material whose quality is different from that of the core base material 11, and a machine read code 14 is formed on the end surface 11c of the core base material 11.

Abstract translation: 要解决的问题：为了提供一种信息卡，可以在多个信息卡叠加时在其端面上形成的条形码被单独读取，并提供其制造方法。 解决方案：信息卡10包括芯基材11和层叠在芯基材11的两侧的表面基材12和13.芯基材11包括聚氯乙烯，表面基材12和 13包括与芯基材11的质量不同的基材，并且在芯基材11的端面11c上形成机器读码14.权利要求（C）2013，JPO＆INPIT

公开(公告)号：JP2011210123A

公开(公告)日：2011-10-20

申请号：JP2010078948

申请日：2010-03-30

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KIMURA TOSHIBUMI ,  ITO YUICHI ,  ASHINA HIROYUKI

IPC: G06K19/077 ,  G06K19/07

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a non-contact type data reception/transmission body in which it is prevented that a streak caused by a coating film composed of a cured substance of a two-liquid mixing type polyurethane resin is generated on the surface of the non-contact type data reception/transmission body, in the manufacturing of the sheet-like non-contact type data reception/transmission body using the two-liquid mixing type polyurethane resin.SOLUTION: This method for manufacturing the non-contact type reception/transmission body includes a process B of making a pair of suppression members 34, 35 disposed at an interval b smaller than a width (a) of a first adhesive 13A abut on the first adhesive applied to a first release base material 21 from both sides of a width direction thereof immediately before lapping an inlet sheet 22 on the first release base material 21.

Abstract translation: 要解决的问题：提供一种制造非接触型数据接收/发送体的方法，其中防止了由由双液混合型聚氨酯树脂的固化物构成的涂膜引起的条纹 在非接触型数据接收/发送体的表面上，使用双液混合型聚氨酯树脂制造片状非接触型数据接收/发送体的方法。解决方案： - 接触型接收/传输体包括制造一对抑制构件34,35的处理B，所述抑制构件34,35以小于第一粘合剂13A的宽度（a）的间隔b布置，所述第一粘合剂13A抵接在施加到第一释放基材上的第一粘合剂上 在第一脱模基材21上研磨入口片22之前，从宽度方向的两侧开始。

公开(公告)号：JP2011070647A

公开(公告)日：2011-04-07

申请号：JP2010149194

申请日：2010-06-30

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： ITO YUICHI ,  NAKAHARA KOSUKE ,  KIMURA TOSHIBUMI

IPC: G06K19/077 ,  G06K19/07

Abstract: PROBLEM TO BE SOLVED: To provide a non-contact type data receiver/transmitter which is thin, has excellent flexibility, is capable of being attached on an object without using adhesive material and the like, and is capable of being easily manufactured, and a manufacturing method therefor.
SOLUTION: The non-contact type data receiver/transmitter 10 is provided with an inlet 11, and a coating material 12 for coating one face 11a of the inlet 11. The coating material 12 is composed of a two-part cured urethane adhesive.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种薄型，具有优异的柔性的非接触型数据接收/发送器，能够在不使用粘合材料等的情况下附着在物体上，并且能够容易地制造 ，及其制造方法。 解决方案：非接触式数据接收/发射器10设置有入口11和用于涂覆入口11的一个面11a的涂层材料12.涂层材料12由两部分固化的聚氨酯 胶粘剂。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010113578A

公开(公告)日：2010-05-20

申请号：JP2008286446

申请日：2008-11-07

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： ITO YUICHI ,  HIROHATA WATARU

IPC: G06K19/077

Abstract: PROBLEM TO BE SOLVED: To prevent adhesive from leaking from a through hole formed on a surface base material, and arrange an exposed surface of an exposed electric component such as a contact IC chip and the surface of a substrate on the same plane. SOLUTION: A method for manufacturing an IC card 10 sandwiching a module 5 mounted with a contact IC chip 12 exposed from the through hole 2 of the first base material 1 via an adhesive layer 11 between a first base material 1 and one surface of a second base material 8, includes: a step for forming the through hole 2 in the first base material 1; a step for attaching a removable adhesive sheet to a surface 1b of the first base material 1 so as to cover the through hole 2; a step for partially providing the adhesive as the adhesive layer 11 on a surface 1a of the first base material 1 or the one surface of the second base material 8; a step for bonding the first base material 1 to the module 5 by inserting the contact IC chip 12 into the through hole 2 and attaching the exposed surface 12a to the removable adhesive sheet; and a step for superposing the second base material 8 on a laminate of the first base material 1 and the module 5, applying pressure to the laminate from outside, and extending and curing the adhesive. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了防止粘合剂从形成在表面基材上的通孔泄漏，并且将暴露的电气部件如接触IC芯片和基板的表面的暴露表面布置在同一平面上 。 解决方案：一种IC卡10的制造方法，其夹持安装有从第一基材1的通孔2露出的接触IC芯片12的模块5，该第一基材1经由第一基材1和一个表面之间的粘合剂层11 第二基材8包括：在第一基材1中形成通孔2的步骤; 将可移除粘合片附着到第一基材1的表面1b以覆盖通孔2的步骤; 在第一基材1的表面1a或第二基材8的一个表面上部分地提供作为粘合剂层11的粘合剂的步骤; 通过将接触IC芯片12插入到通孔2中并将暴露表面12a附接到可移除的粘合片上而将第一基材1粘合到模块5的步骤; 以及将第二基材8叠置在第一基材1和模块5的层压体上的步骤，从外部向层叠体施加压力，并延伸和固化粘合剂。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010113577A

公开(公告)日：2010-05-20

申请号：JP2008286445

申请日：2008-11-07

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： ITO YUICHI ,  HIROHATA WATARU

IPC: G06K19/077 ,  B42D15/10

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC card capable of preventing adhesive from leaking from a through hole formed on a surface base material, and surely mounting exposed electric components such as a contact IC chip in a component mounting section of a module. SOLUTION: A method for manufacturing an IC card 10 sandwiching the module 5 having the component mounting section 6 for mounting the contact IC chip 2 exposed from the through hole 2 formed on the first base material 1 via an adhesive layer 11 between a surface 1a of a first base material 1 and one surface of a second base material 8, includes: a step for forming the through hole 2 in the first base material 1; a step for partially providing the adhesive as the adhesive layer 11 on the surface 1a of the first base material 1 in which the through hole 2 is formed or the one surface of the second base material 8; a step for bonding the first base material 1 to the module 5 so that the through hole 2 and the component mounting section 6 are positioned in the frame via an adhesive material 3 having frame-like plane shape; and a step for superposing the second base material 8 on a laminate of the first base material 1 and the module 5, applying pressure to the first base material 1 and the second base material 8 from outside, and extending and curing the adhesive. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种制造能够防止粘合剂从形成在表面基材上的通孔泄漏的IC卡的方法，并将暴露的电气部件如接触IC芯片安装在组件安装中 模块的一部分。 解决方案：一种用于制造IC卡10的方法，该IC卡10具有用于安装从形成在第一基材1上的通孔2露出的接触IC芯片2的组件安装部分6的模块5， 第一基材1的表面1a和第二基材8的一个表面包括：在第一基材1中形成通孔2的步骤; 在形成有通孔2的第一基材1的表面1a或第二基材8的一个表面上部分地提供作为粘合剂层11的粘合剂的步骤; 将第一基材1与模块5接合，使得通孔2和部件安装部6经由具有框状平面形状的粘合材料3定位在框架中的步骤; 以及将第二基材8叠置在第一基材1和模块5的层叠体上的步骤，从外部向第一基材1和第二基材8施加压力，并且使粘合剂延伸固化。 版权所有（C）2010，JPO＆INPIT