Abstract:
he colnr .Mnanse ftv ofan LED c.hip wich a nhosphorco•ntai nbc resin sheet obtained byring the phosphor-cents resin sheet Lo Ine LED chip, improve the ease of production, and improve the sfoofee ofLfeCdOM an de in vided ie a resin sheet laminateorovWded with a ohs -containi resin -hoot racube material, wherein the phosphor-containing resin sheet is ad into a urallisi,
Abstract:
A phosphor-containing cured silicone which comprises a cured silicone that has a structure represented by general formula (1) and/or (2) and that comprises units represented by general formula (3) and/or (4) and which further contains a phosphor and particles that comprise units represented by general formula (3) and/or (4); a process for the production of the phosphor -containing cured silicone; a phosphor-containing silicone composition for the production of the phosphor-containing cured silicone; and a phosphor-containing silicone composition precursor for the production of the phosphor-containing cured silicone. In general formulae (1) to (4), R1 to R3 are each hydrogen, methyl, ethyl or propyl; X is methylene, dimethylene or trimethylene; and R4 to R6 are each a substituted or unsubstituted monovalent hydrocarbon group, and may be the same or different.
Abstract:
A PHOSPHOR-CONTAINING CURED SILICONE THAT IS A CURED SILICONE WHICH HAS A STRUCTURE REPRESENTED BY GENERAL FORMULAE (1) AND/OR (2) AND ALSO HAS UNITS SELECTED FROM GENERAL FORMULAE (3) AND/OR (4), THE PHOSPHOR-CONTAINING CURED SILICONE INCLUDES A PHOSPHOR AND PARTICLES HAVING UNITS SELECTED FROM GENERAL FORMULAE (3) AND/OR (4): [CHEM. 1] WHEREIN R¹ TO R³ ARE EACH A HYDROGEN ATOM, A METHYL GROUP, AN ETHYL GROUP OR A PROPYL GROUP; X REPRESENTS A METHYLENE GROUP, A DIMETHYLENE GROUP OR A TRIMETHYLENE GROUP, AND MAY BE THE SAME OR DIFFERENT; AND R⁴ TO R⁶ ARE EACH A SUBSTITUTED OR UNSUBSTITUTED MONOVALENT HYDROCARBON GROUP, AND MAY BE THE SAME OR DIFFERENT. AN OBJECT OF THE PRESENT INVENTION IS TO PROVIDE A CURED SILICONE IN WHICH A PHOSPHOR IS UNIFORMLY DISPERSED, THE CURED SILICONE IS CHARACTERIZED IN THAT A SILICONE MATERIAL HAS GOOD THERMAL RESISTANCE AND LIGHTFASTNESS. IN ADDITION, AN OBJECT OF THE PRESENT INVENTION IS TO PROVIDE A PROCESS FOR PRODUCTION OF AN LED-MOUNTED SUBSTRATE BY WHICH A PLURALITY OF LED ELEMENTS CAN BE CONTINUOUSLY MOUNTED IN A BATCH MANNER.
Abstract:
AbstractA phcsrcncrc.orit.arxt ii she stoca25°C and a storage, moou 05 ci• less than Cc. 1 Pa at 100°C, wherein a sin main compodect of the phosphor-contain 1g sheet is a crossdinked formed op suThecticag a crossc inkahiLe silicone compositdo c.:ontainingcomposition to a hydrost 1.yiaticn reaction. This phosphorcontaini.nq sheet provides a phosphor sheet having good pahi ii ty and igh adhesive power asto an LED chip, as a wavelength conversion layer.
Abstract:
The present invention is a sheet used for LED encapsulant, etc., with the objective of providing a sheet with excellent light resistance or of providing a phosphor sheet (1) in which the optical properties thereof are not impaired and which exhibits excellent film thickness uniformity even when comprising large-sized phosphor particles in high concentration. The constitution of the present invention is, in one embodiment, a phosphor sheet (1) in which the content of phosphor is 53 weight?/o or more of the total sheet, and in another embodiment, a phosphor sheet (1) characterized by comprising at least a silicone resin, a phosphor and silicone fine particles.
Abstract:
A PHOSPHOR-CONTAINING SHEET HAVING A STORAGE MODULUS OF 0.1 MPA OR MORE AT 25°C. AND A STORAGE MODULUS OF LESS THAN 0.1 MPA AT 100°C., WHEREIN A RESIN MAIN COMPONENT OF THE PHOSPHOR-CONTAINING SHEET IS A CROSSLINKED PRODUCT FORMED BY SUBJECTING A CROSSLINKABLE SILICONE COMPOSITION CONTAINING A SPECIFIC COMPOSITION TO A HYDROSILYLATION REACTION. THIS PHOSPHOR-CONTAINING SHEET PROVIDES A PHOSPHOR SHEET HAVING GOOD SHAPABILITY AND HIGH ADHESIVE POWER AS A PHOSPHOR SHEET BONDED TO AN LED CHIP AS A WAVELENGTH CONVERSION LAYER.
Abstract:
The present invention is a sheet used for an LED encapsulant, etc., with the objective of providing a sheet with excellent light resistance or of providing a phosphor sheet in which the optical properties thereof are not impaired and which exhibits excellent film thickness uniformity even when comprising large-sized phosphor particles in high concentration. The constitution of the present invention is, in one embodiment, a phosphor sheet in which the content of phosphor is 53 weight% or more of the total sheet, and in another embodiment, a phosphor sheet characterized by comprising at least a silicone resin, a phosphor and silicone particles.
Abstract:
A phosphor-containing sheet having a storage modulus of 0.1 MPa or more at 25°C and a storage modulus of less than 0.1 MPa at 100°C, wherein a resin main component of the phosphor-containing sheet is a crosslinked product formed by subjecting a crosslinkable silicone composition containing a specific composition to a hydrosilylation reaction. This phosphor-containing sheet provides a phosphor sheet having good shapability and high adhesive power as a phosphor sheet bonded to an LED chip as a wavelength conversion layer.
Abstract:
The present invention is a sheet used for LED encapsulant, etc. , with the objective of providing a sheet with excellent light resistance or of providing a phosphor sheet in which the optical properties thereof are not impaired and which exhibits excellent film thickness uniformity even when comprising large-sized phosphor particles in high concentration. The constitution of the present invention is, in one embodiment, a phosphor sheet in which the content of phosphor is 53 weight% or more of the total sheet, and in another embodiment, a phosphor sheet characterized by comprising at least a silicone resin, a phosphor and silicone fine particles.