公开(公告)号：HK1054566A1

公开(公告)日：2003-12-05

申请号：HK03106835

申请日：2003-09-23

Applicant: TORAY INDUSTRIES

Inventor： FUJIMARU KOICHI ,  YOSHIMURA TOSHIO ,  MATSUMURA NOBUO

IPC: C09J7/02 ,  B32B15/04 ,  H01L23/495 ,  H05K3/38 ,  C09J ,  H01L

Abstract: A resin composition has a phase separation structure having at least two phases and inorganic particles having a mean primary particle size of 0.1 mu m or less. The phase separation structure includes a matrix phase and a disperse phase. The inorganic particles are mainly present in any one of the matrix phase, the disperse phase, and the interface between the matrix phase and the disperse phase. The resin composition has a high thermal expansion coefficient and elastic modulus, and thus provides an adhesive for semiconductor devices which has excellent reflow resistance and adhesion.

公开(公告)号：SG11201408708SA

公开(公告)日：2015-02-27

申请号：SG11201408708S

申请日：2013-06-13

Applicant: TORAY INDUSTRIES

Inventor： MATSUMURA NOBUO ,  ISHIDA YUTAKA ,  GOTO TETSUYA

IPC: H01L33/50

Abstract: Provided is a resin sheet laminate which is provided with a phosphor-containing resin layer on a base material, characterized in that: the Phosphor-containing resin layer has a plurality of subdivisions; the base material has lengthwise and widthwise directions; and a plurality of the subdivisions are repeatedly arranged in the lengthwise direction of the base material in a line, and the resin sheet laminate can improve the uniformity of color or luminance of a semiconductor light-emitting element having a phosphor-containing resin layer bonded thereon, the ease of production of the element, the degree of freedom in design thereof, and so on.

公开(公告)号：AT319777T

公开(公告)日：2006-03-15

申请号：AT02014361

申请日：2002-06-27

Applicant: TORAY INDUSTRIES

Inventor： FUJIMARU KOICHI ,  YOSHIMURA TOSHIO ,  MATSUMURA NOBUO

IPC: C09J7/02 ,  B32B15/04 ,  H01L23/495 ,  H05K3/38 ,  C08L77/06 ,  C09J177/06 ,  B32B19/02 ,  H01L23/29

Abstract: A resin composition has a phase separation structure having at least two phases and inorganic particles having a mean primary particle size of 0.1 mu m or less. The phase separation structure includes a matrix phase and a disperse phase. The inorganic particles are mainly present in any one of the matrix phase, the disperse phase, and the interface between the matrix phase and the disperse phase. The resin composition has a high thermal expansion coefficient and elastic modulus, and thus provides an adhesive for semiconductor devices which has excellent reflow resistance and adhesion.

公开(公告)号：SG189315A1

公开(公告)日：2013-05-31

申请号：SG2013026216

申请日：2012-04-24

Applicant: TORAY INDUSTRIES

Inventor： MATSUMURA NOBUO ,  ISHIDA YUTAKA ,  KAWAMOTO KAZUNARI ,  INOUE TAKEJIRO ,  SADAKUNI HIRONOBU ,  YOSHIOKA MASAHIRO ,  KITAGAWA TAKAO

Abstract: he colnr .Mnanse ftv ofan LED c.hip wich a nhosphorco•ntai nbc resin sheet obtained byring the phosphor-cents resin sheet Lo Ine LED chip, improve the ease of production, and improve the sfoofee ofLfeCdOM an de in vided ie a resin sheet laminateorovWded with a ohs -containi resin -hoot racube material, wherein the phosphor-containing resin sheet is ad into a urallisi,

公开(公告)号：DE60209594T2

公开(公告)日：2006-08-10

申请号：DE60209594

申请日：2002-06-27

Applicant: TORAY INDUSTRIES

Inventor： FUJIMARU KOICHI ,  YOSHIMURA TOSHIO ,  MATSUMURA NOBUO

IPC: C08L77/06 ,  C09J7/02 ,  B32B15/04 ,  B32B19/02 ,  C09J177/06 ,  H01L23/29 ,  H01L23/495 ,  H05K3/38

Abstract: A resin composition has a phase separation structure having at least two phases and inorganic particles having a mean primary particle size of 0.1 mu m or less. The phase separation structure includes a matrix phase and a disperse phase. The inorganic particles are mainly present in any one of the matrix phase, the disperse phase, and the interface between the matrix phase and the disperse phase. The resin composition has a high thermal expansion coefficient and elastic modulus, and thus provides an adhesive for semiconductor devices which has excellent reflow resistance and adhesion.

公开(公告)号：SG191709A1

公开(公告)日：2013-09-30

申请号：SG2013026232

申请日：2012-05-14

Applicant: TORAY INDUSTRIES

Inventor： MATSUMURA NOBUO ,  INOUE TAKEJIRO ,  SADAKUNI HIRONOBU ,  ISHIDA YUTAKA ,  KAWAMOTO KAZUNARI ,  YOSHIOKA MASAHIRO ,  GOTO TETSUYA

Abstract: AbstractA phcsrcncrc.orit.arxt ii she stoca25°C and a storage, moou 05 ci• less than Cc. 1 Pa at 100°C, wherein a sin main compodect of the phosphor-contain 1g sheet is a crossdinked formed op suThecticag a crossc inkahiLe silicone compositdo c.:ontainingcomposition to a hydrost 1.yiaticn reaction. This phosphorcontaini.nq sheet provides a phosphor sheet having good pahi ii ty and igh adhesive power asto an LED chip, as a wavelength conversion layer.

公开(公告)号：DE60209594D1

公开(公告)日：2006-05-04

申请号：DE60209594

申请日：2002-06-27

Applicant: TORAY INDUSTRIES

Inventor： FUJIMARU KOICHI ,  YOSHIMURA TOSHIO ,  MATSUMURA NOBUO

IPC: C08L77/06 ,  C09J7/02 ,  B32B15/04 ,  B32B19/02 ,  C09J177/06 ,  H01L23/29 ,  H01L23/495 ,  H05K3/38

Abstract: A resin composition has a phase separation structure having at least two phases and inorganic particles having a mean primary particle size of 0.1 mu m or less. The phase separation structure includes a matrix phase and a disperse phase. The inorganic particles are mainly present in any one of the matrix phase, the disperse phase, and the interface between the matrix phase and the disperse phase. The resin composition has a high thermal expansion coefficient and elastic modulus, and thus provides an adhesive for semiconductor devices which has excellent reflow resistance and adhesion.

公开(公告)号：MY175544A

公开(公告)日：2020-07-01

申请号：MYPI2013700937

申请日：2011-12-01

Applicant: TORAY INDUSTRIES

Inventor： MATSUMURA NOBUO ,  ISHIDA YUTAKA ,  KAWAMOTO KAZUNARI ,  GOTO KAZUKI ,  KITAGAWA TAKAO ,  INOUE TAKEJIRO ,  SADAKUNI HIRONOBU ,  SEKIGUCHI HIROKI ,  YOSHIOKA MASAHIRO

Abstract: The present invention is a sheet used for LED encapsulant, etc., with the objective of providing a sheet with excellent light resistance or of providing a phosphor sheet (1) in which the optical properties thereof are not impaired and which exhibits excellent film thickness uniformity even when comprising large-sized phosphor particles in high concentration. The constitution of the present invention is, in one embodiment, a phosphor sheet (1) in which the content of phosphor is 53 weight?/o or more of the total sheet, and in another embodiment, a phosphor sheet (1) characterized by comprising at least a silicone resin, a phosphor and silicone fine particles.

公开(公告)号：MY166515A

公开(公告)日：2018-07-05

申请号：MYPI2013700512

申请日：2012-05-14

Applicant: TORAY INDUSTRIES

Inventor： MATSUMURA NOBUO ,  INOUE TAKEJIRO ,  SADAKUNI HIRONOBU ,  ISHIDA YUTAKA ,  KAWAMOTO KAZUNARI ,  YOSHIOKA MASAHIRO ,  GOTO TETSUYA

IPC: C08L83/07 ,  C08J5/18 ,  C08L83/05 ,  H01L33/50

Abstract: A PHOSPHOR-CONTAINING SHEET HAVING A STORAGE MODULUS OF 0.1 MPA OR MORE AT 25°C. AND A STORAGE MODULUS OF LESS THAN 0.1 MPA AT 100°C., WHEREIN A RESIN MAIN COMPONENT OF THE PHOSPHOR-CONTAINING SHEET IS A CROSSLINKED PRODUCT FORMED BY SUBJECTING A CROSSLINKABLE SILICONE COMPOSITION CONTAINING A SPECIFIC COMPOSITION TO A HYDROSILYLATION REACTION. THIS PHOSPHOR-CONTAINING SHEET PROVIDES A PHOSPHOR SHEET HAVING GOOD SHAPABILITY AND HIGH ADHESIVE POWER AS A PHOSPHOR SHEET BONDED TO AN LED CHIP AS A WAVELENGTH CONVERSION LAYER.

公开(公告)号：SG190320A1

公开(公告)日：2013-07-31

申请号：SG2013038070

申请日：2011-12-01

Applicant: TORAY INDUSTRIES

Inventor： MATSUMURA NOBUO ,  ISHIDA YUTAKA ,  KAWAMOTO KAZUNARI ,  GOTO KAZUKI ,  KITAGAWA TAKAO ,  INOUE TAKEJIRO ,  SADAKUNI HIRONOBU ,  SEKIGUCHI HIROKI ,  YOSHIOKA MASAHIRO

Abstract: The present invention is a sheet used for an LED encapsulant, etc., with the objective of providing a sheet with excellent light resistance or of providing a phosphor sheet in which the optical properties thereof are not impaired and which exhibits excellent film thickness uniformity even when comprising large-sized phosphor particles in high concentration. The constitution of the present invention is, in one embodiment, a phosphor sheet in which the content of phosphor is 53 weight% or more of the total sheet, and in another embodiment, a phosphor sheet characterized by comprising at least a silicone resin, a phosphor and silicone particles.