公开(公告)号：JP2003094393A

公开(公告)日：2003-04-03

申请号：JP2001290797

申请日：2001-09-25

Applicant: TORAY INDUSTRIES

Inventor： KUBO YOSHIHIKO ,  NAKAMURA YASUHIRO ,  FURUSHO KAZUHIKO

IPC: G02F1/13 ,  B26F3/00 ,  B28D5/00 ,  C03B33/027 ,  C03B33/037 ,  C03B33/07 ,  C03B33/10 ,  G02F1/1333

Abstract: PROBLEM TO BE SOLVED: To provide a method and device capable of improving on the yield of the substrate cutting process in the manufacture of display devices. SOLUTION: The cutting method and device are applicable to the cutting of substrates by scribing, wherein the cutter pressure varies according to the given value of the accumulated processing distance of the scribing cutter.