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公开(公告)号：JPH0657020A
公开(公告)日：1994-03-01
申请号：JP21514992
申请日：1992-08-12
Applicant: TORAY INDUSTRIES
Inventor： NAKAWA TAKAHIRO , NAGAHAMA AKIHIKO , SUZUKI MASARU
Abstract: PURPOSE:To provide a polyester film, comprising a specific copolyester and specified inorganic fine particles and excellent in mechanical characteristics, especially under tension, heat and abrasion resistance, readily handleable even if the thickness is small and suitable as magnetic recording media, etc. CONSTITUTION:This copolyester film comprises (A) a polyester composed of a unit of formulas I and II [Ar1 to Ar4 are each a bivalent aromatic residue; R1 and R2 are each a 1-12C linear, branched or a cyclic bivalent aliphatic group; (x+y) is 1; 0.02 /g or more, preferably 5-1000m /g specific surface area and preferably 0.001-5mum average particle diameter in an amount of 0.01-5wt.%, preferably 0.05-4wt.% based on the component (A). The surface orientation index of this film is 0.15 or higher.
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公开(公告)号：JPH04335063A
公开(公告)日：1992-11-24
申请号：JP10752491
申请日：1991-05-13
Applicant: TORAY INDUSTRIES
Inventor： NAKAWA TAKAHIRO , ITO NOBUAKI
Abstract: PURPOSE:To provide an aromatic polyamide composition excellent in an affinity for a filler. CONSTITUTION:An aromatic polyamide composition containing 10-90vol.% filler and 1-50mol% diamine residues containing at least one member selected from among Si, Ge and Sn. Because this composition has a good affinity for the filler, it can give a film not impaired in mechanical properties even when it is highly filled.
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公开(公告)号：JPH04163149A
公开(公告)日：1992-06-08
申请号：JP28997090
申请日：1990-10-26
Applicant: TORAY INDUSTRIES
Inventor： NAKAWA TAKAHIRO , ITO NOBUAKI , OWADA JUN
Abstract: PURPOSE:To obtain a laminated sheet with excellent heat resistance, mechanical property and economic property by a method wherein the quantity of aromatic polyamide to constitute a heat resistant film, which is made of a blend resin of aromatic polyamide and a soluble resin, is specified. CONSTITUTION:The title laminated sheets is a laminated sheet for which at least 2 layers of a heat resistant film, which is made of a bland resin of aromatic polyamide and a soluble resin without using an adhesive layer, and the quantity of the aromatic polyamide which constitutes the heat resistant film is in a range which is not less than 5wt.% and not more than 90wt.% of the blend resin. For the aromatic polyamide, the one which contains not less than 50mol% of one type or more repeating units shown by equations is preferable, and the soluble resin means one type or more resins which is dissolved by 1wt.% or more by a solvent to dissolve aromatic polyamide, and an amorphous resin which shows remarkable modification of mechanical property at a high temperature and has an excellent humidity property, e.g. polycarbonate, polyethersulfone, polysulfone, polyarylate or polysulfidosulfone is more preferable.
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公开(公告)号：JPH04117433A
公开(公告)日：1992-04-17
申请号：JP23830690
申请日：1990-09-07
Applicant: TORAY INDUSTRIES
Inventor： OWADA JUN , NAKAWA TAKAHIRO , ITO NOBUAKI
Abstract: PURPOSE:To obtain a film excellent in mechanical properties, heat resistance, moisture absorption characteristics and economical efficiency by forming a film from a resin solution containing a polymer prepared by polymerizing an aromatic polyamide in the presence of a soluble resin. CONSTITUTION:The purpose film is formed from a resin solution containing at least 30wt.%, based on the total resin, polymer obtained by polymerizing an aromatic polyamide in the presence of a soluble resin. As the aromatic polyamide used, one comprising 50mol% or above repeating units of the formula is desirable. Because the mechanical properties and resistance to dimensional change with temperature and humidity are improved, it is desirable that the aromatic polyamide is one in which the aromatic rings are mainly para-oriented, and because the moisture absorptivity can be lowered, it is desirable that one in which the aromatic rings are substituted with chlorine is used.
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公开(公告)号：JPH03237155A
公开(公告)日：1991-10-23
申请号：JP3484590
申请日：1990-02-15
Applicant: TORAY INDUSTRIES
Inventor： NAKAWA TAKAHIRO , OWADA JUN , ITO NOBUAKI
Abstract: PURPOSE:To obtain a composition, containing an aromatic polycarbonate/ aromatic polyamide block copolymer and having characteristics of both the aromatic polycarbonate and aromatic polyamide and excellent in heat and humidity resistance characteristics. CONSTITUTION:A composition containing (A) 10-100wt.%, preferably 20-100wt.% block copolymer composed of aromatic polycarbonate segments containing preferably >=50mol% recurring units expressed by formula I (Ar1 is one or more structures containing >=1 aromatic rings) and aromatic polyamide segments containing preferably >=50mol% recurring units expressed by formula II (Ar2 and Ar3 are same as Ar1) and (B) preferably at least one of an aromatic polyamide and a soluble resin [a resin soluble in an amount of >=1wt.% in a solvent capable of dissolving the component (A) alone or both the component (A) and the aromatic polyamide, preferably aromatic polycarbonate].
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Patent Agency Ranking
公开(公告)号：JPH03138129A
公开(公告)日：1991-06-12
申请号：JP27750689
申请日：1989-10-25
Applicant: TORAY INDUSTRIES
Inventor： NAKAWA TAKAHIRO , ITO NOBUAKI , MIZOUCHI MASANORI
Abstract: PURPOSE:To enhance mechanical properties, chemical properties (hygroscopic properties) and economics (cost) by specifying heat shrinkage rate, hygroscopic rate and tensile elongation of a film. CONSTITUTION:A film is formed from resin composed of aromatic polyimide mixed with resin A, soluble in an organic solvent for dissolving aromatic polyimide or aromatic polyimide acid led by aromatic polyimide, at the weight ratio of 1/99-90/10. The heat shrinkage rate of the film at 250 deg.C is made 20% or less and hygroscopic rate is made 5% or less, while tensile elongation is made 10% or more. The heat shrinkage rate at the high temperature is smaller by said arrangement, and dimension stability and mechanical properties, particularly tensile elongation, strength and humidity characteristics (hygroscopic properties), are improved to reduce the manufacturing cost of the film.
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公开(公告)号：JPH03126733A
公开(公告)日：1991-05-29
申请号：JP26452689
申请日：1989-10-11
Applicant: TORAY INDUSTRIES
Inventor： NAKAWA TAKAHIRO , HIRANO TAKUMI , ITO NOBUAKI
Abstract: PURPOSE:To obtain an inorganic film useful as magnetic tape base, material for FPC, material for heat-sensitive transfer, interior trim of airplane, EL substrate, having flexibility and self retention, comprising a three dimensional crosslinked material composed of Si, B and O as a skeleton. CONSTITUTION:The objective film which is made of a three dimensional crosslinked material composed of Si, B and O as a skeleton and has composition comprising preferably 10-50mol% silicon based on 1mol boron, 10-60wt.% carbon content, 10-100mol CH3 group based on 1mol boron, 5-50mol Ph-group based on 1mol boron and a molar ratio of CH3/Ph of 1/1-10/1.
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公开(公告)号：JPH02177310A
公开(公告)日：1990-07-10
申请号：JP33142088
申请日：1988-12-27
Applicant: TORAY INDUSTRIES
Inventor： KIMURA SHIZU , NAKAWA TAKAHIRO , ITO NOBUAKI
Abstract: PURPOSE:To obtain an insulator whose dielectric property is stable by using a film-shaped substance consisting of mixture of at least one kind, which is selected between titanium oxide and titanic acid metallic salt, and resin, whose glass transition point is specified, for electric insulating material used for a capacitor, and further prescribing the thickness, flatness, etc., of the film-shaped substance. CONSTITUTION:One kind or two kinds of titanic acid metallic salts such as titanium oxide, barium titanate, lead titanate, etc., of rutile-type, anatase-type, or the like are mixed. Hereupon, the average grain diameter of these particles should be preferably 1mum or less and the particles above 30mum shall be within 30%. Next, they are mixed with resin whose glass transition point is 65 deg.C or more, for example, polyethylene telephthalate, polystyrene, aliphatic polyamide, etc., and this is made into film shape. At this time, the thick of this film-shaped substance as 0.1-30mum, the depth of the center line at the surface as 0.01-5.0mum, and the average sectional flatness of surface projections as 0.005-0.3, are prescribed, respectively. By doing it this way, an insulator having high permittivity, which is fit for practical use even if thin, can be obtained.
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公开(公告)号：JPH01248404A
公开(公告)日：1989-10-04
申请号：JP7734588
申请日：1988-03-29
Applicant: TORAY INDUSTRIES
Inventor： NAKAWA TAKAHIRO , KIMURA SHIZU
Abstract: PURPOSE:To make it possible to obtain a high dielectric constant film outstand ing in its heat resistance and mechanical characteristics by making its dielectric constant in a range from 5 to 50. CONSTITUTION:This is a film composed of one or more kinds of polymers selected from aromatic polyamides and aromatic polyimides, and an inorganic filler with a high dielectric constant, and its dielectric constant is made in a range from 5 to 50. Thus, the film is produced by making the inorganic filler exist in a solution in which aromatic polyamide, aromatic polyimide or polyam ide acid is dissolved by making a membrane from the solution. This allows the dielectric constant of the film to be in a range from 5 to 50 and its thickness very small. With this procedure it is possible to obtain a high dielectric constant film outstanding in its mechanical characteristics and heat resistance.
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公开(公告)号：JP2000297206A
公开(公告)日：2000-10-24
申请号：JP10877599
申请日：1999-04-16
Applicant: TORAY INDUSTRIES
Inventor： AOKI HIROMICHI , NAKAWA TAKAHIRO , UEMATSU KIMITAKE
Abstract: PROBLEM TO BE SOLVED: To obtain a polyester composition having controlled discoloration, when made into a biaxially oriented film, showing excellent flatness, slipperiness and abrasion resistance. SOLUTION: This polyester composition and a film comprising the composition contain 0.05-10 wt.% of a crosslinked organic particle having 0.05-3 μm average particle diameter synthesized by using a monomer containing 0.01-1 wt.% of an aromatic compound containing 1-4 hydroxy groups.
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