1.
    发明专利
    未知

    公开(公告)号:DE69922155T2

    公开(公告)日:2005-12-08

    申请号:DE69922155

    申请日:1999-09-07

    Abstract: The present invention relates to a positive-working photosensitive resin precursor composition which is characterized in that it contains (a) polymer in which the chief component comprises structural units of the kind where the bonding between structural units is represented by general formula (1) and (b) photoacid generator, and it can form a pattern by light irradiation and subsequent developing, and the total carboxyl groups contained in said polymer is from 0.02 to 2.0 mmol/g, and it provides a photosensitive resin composition of high sensitivity which can be developed by alkali. (R is an organic group of valency from 3 to 8 having at least 2 carbon atoms, R is an organic group of valency from 2 to 6 having at least 2 carbon atoms, R is hydrogen or an organic group with from 1 to 20 carbons. n is an integer of value from 3 to 100,000, m is 1 or 2, p and q are integers of value from 0 to 4 and p + q > 0.)

    2.
    发明专利
    未知

    公开(公告)号:DE69922155D1

    公开(公告)日:2004-12-30

    申请号:DE69922155

    申请日:1999-09-07

    Abstract: The present invention relates to a positive-working photosensitive resin precursor composition which is characterized in that it contains (a) polymer in which the chief component comprises structural units of the kind where the bonding between structural units is represented by general formula (1) and (b) photoacid generator, and it can form a pattern by light irradiation and subsequent developing, and the total carboxyl groups contained in said polymer is from 0.02 to 2.0 mmol/g, and it provides a photosensitive resin composition of high sensitivity which can be developed by alkali. (R is an organic group of valency from 3 to 8 having at least 2 carbon atoms, R is an organic group of valency from 2 to 6 having at least 2 carbon atoms, R is hydrogen or an organic group with from 1 to 20 carbons. n is an integer of value from 3 to 100,000, m is 1 or 2, p and q are integers of value from 0 to 4 and p + q > 0.)

    POSITIVE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION AND PROCESS FOR PRODUCING THE SAME
    6.
    发明公开
    POSITIVE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION AND PROCESS FOR PRODUCING THE SAME 有权
    PRE一种感光性树脂组合物和方法及其

    公开(公告)号:EP1037112A4

    公开(公告)日:2002-12-18

    申请号:EP99940701

    申请日:1999-09-07

    CPC classification number: G03F7/0233 C08G73/1025 C08L79/08

    Abstract: A positive photosensitive resin precursor composition characterized by comprising (a) a polymer consisting mainly of structural units bonded to each other in the manner shown by general formula (1) and (b) a photo-acid generator, being capable of forming a pattern through light irradiation and subsequent development, and having a total carboxyl group content of 0.02 to 2.0 mmol per g of the polymer. It provides a photosensitive resin composition which is capable of alkali development and is highly sensitive. (R represents a tri- to octavalent C2+ organic group; R represents a di- to hexavalent C2+ organic group; R represents hydrogen or a C1-20 organic group; n is an integer of 3 to 100,000; m is 1 or 2; and p and q each is an integer of 0 to 4, provided that p+q>0).

    Abstract translation: 本发明涉及一种正型感光性树脂前体组合物的所有其特征DASS它含有(a)聚合物,其中主要组分包括其中结构单元之间的键合是通过通式种结构单元(1)和 (b)中光产酸剂,和它可形成由包含在所述聚合物光照射和随后的显影,并且总羧基的图案是从0点02至2.0毫摩尔/ g,且它提供了高灵敏度后者可以是感光性树脂组合物 碱开发。 (R <1>是化合价的有机基团3至8个具有至少2个碳原子,R <2>是化合价的有机基团的2至6具有至少2个碳原子,R <3> 是氢或有机基团具有1至20个碳原子。N + q为> 0至3的整数值至100,000,m是1或2,p和q是从0的值至4的整数且p)

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