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公开(公告)号：KR20180071281A
公开(公告)日：2018-06-27
申请号：KR20187012483
申请日：2016-09-21
Applicant: TORAY INDUSTRIES
Inventor： MASUDA YUKI , SHOJI YU , ISOBE KIMIO , OKUDA RYOJI
Abstract: 고신도, 저응력, 고금속밀착의경화막을얻을수 있는수지및 감광성수지조성물을제공한다. (A) 폴리아미드구조와, 이미드전구체구조및 이미드구조중 적어도어느것의구조를갖는수지이며, 상기 (A) 수지의구조중 적어도어느것에, 지방족기를갖는디아민잔기를갖는것을특징으로하는수지.
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公开(公告)号：SG11201400614RA
公开(公告)日：2014-09-26
申请号：SG11201400614R
申请日：2012-09-13
Applicant: TORAY INDUSTRIES
Inventor： NORO YOHEI , OKUDA RYOJI , FUKUDA SEIJI
IPC: H01L21/304 , B24B37/26
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公开(公告)号：SG11201807054RA
公开(公告)日：2018-09-27
申请号：SG11201807054R
申请日：2017-01-24
Applicant: TORAY INDUSTRIES
Inventor： BABA OSAMU , HAYASAKA MAKOTO , OKUDA RYOJI
Abstract: An object of the present invention is to provide a resin composition capable of suppressing surface roughness in a thin film portion and maintaining insulation reliability of a thin film portion, a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor electronic component or a semiconductor equipment using the cured relief pattern. The constitution of the present invention for achieving the above-mentioned object is as follows. That is, the present invention provides a resin composition containing: (a) at least one resin selected from an alkali-soluble polyimide, an alkali-soluble polybenzoxazole, an alkali-soluble polyamide-imide, precursors thereof, and copolymers thereof; and (b) an alkali-soluble phenol resin, wherein a ratio (Rb/Ra) between an alkali dissolution rate (Ra) of the resin (a) and an alkali dissolution rate (Rb) of the resin (b) satisfies a relationship of 0.5≤Rb/Ra≤2.0. The present invention also provides a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor electronic component or a semiconductor equipment using the cured relief pattern.
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公开(公告)号：SG11201707712TA
公开(公告)日：2017-10-30
申请号：SG11201707712T
申请日：2016-03-18
Applicant: TORAY INDUSTRIES
Inventor： SHOJI YU , MASUDA YUKI , KOYAMA YUTARO , OKUDA RYOJI
Abstract: A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.
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公开(公告)号：SG192774A1
公开(公告)日：2013-09-30
申请号：SG2013061759
申请日：2012-02-08
Applicant: TORAY INDUSTRIES
Inventor： TAKEUCHI NANA , FUKUDA SEIJI , OKUDA RYOJI , KASAI SHIGETAKA
Abstract: A polishing pad comprising at least a polishing layer and a cushion layer, wherein a groove is formed on a polishing surface of the polishing pad, at least one of angles formed by the polishing surface and a side surface of the groove which continues to the polishing surface is 105-150° inclusive, and the cushion layer has a strain constant of 7.3x10-6 to 4.4x10-4 µm/Pa inclusive. The use of the polishing pad can achieve a purpose of preventing the fluctuation in apolishing rate while keeping the polishing rate at a high level.Figure 2
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Patent Agency Ranking
公开(公告)号：DE69922155T2
公开(公告)日：2005-12-08
申请号：DE69922155
申请日：1999-09-07
Applicant: TORAY INDUSTRIES
Inventor： TOMIKAWA MASAO , OKAMOTO NAOYO , YOSHIDA SATOSHI , OKUDA RYOJI
Abstract: The present invention relates to a positive-working photosensitive resin precursor composition which is characterized in that it contains (a) polymer in which the chief component comprises structural units of the kind where the bonding between structural units is represented by general formula (1) and (b) photoacid generator, and it can form a pattern by light irradiation and subsequent developing, and the total carboxyl groups contained in said polymer is from 0.02 to 2.0 mmol/g, and it provides a photosensitive resin composition of high sensitivity which can be developed by alkali. (R is an organic group of valency from 3 to 8 having at least 2 carbon atoms, R is an organic group of valency from 2 to 6 having at least 2 carbon atoms, R is hydrogen or an organic group with from 1 to 20 carbons. n is an integer of value from 3 to 100,000, m is 1 or 2, p and q are integers of value from 0 to 4 and p + q > 0.)
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公开(公告)号：SG11201903455QA
公开(公告)日：2019-05-30
申请号：SG11201903455Q
申请日：2017-08-28
Applicant: TORAY INDUSTRIES
Inventor： MASUDA YUKI , OKUDA RYOJI
IPC: C07C237/04 , C07C235/24 , C08G69/26 , C08G73/08 , C08G73/10 , H01L21/336 , H01L23/12 , H01L23/29 , H01L23/31 , H01L27/32 , H01L29/786 , H01L51/50 , H05B33/02 , H05B33/12 , H05B33/22
Abstract: The present invention relates to: a novel diamine compound; a heat-resistant resin which uses this diamine compound; and a resin composition which uses this heat-resistant resin. Consequently, the present invention enables the achievement of a cured film that has excellent chemical resistance and film characteristics even in cases where a heat treatment is carried out at such a low temperature as 200°C or less. The novel diamine is represented by general formula (1). A heat-resistant resin or a resin composition according to the present invention is suitable for use in a surface protective film or an interlayer insulating film of a semiconductor device and an insulating layer or a planarization layer of an organic electroluminescent (organic EL) element.
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公开(公告)号：SG11201901693YA
公开(公告)日：2019-03-28
申请号：SG11201901693Y
申请日：2017-08-30
Applicant: TORAY INDUSTRIES
Inventor： MASUDA YUKI , HASHIMOTO KEIKA , OKUDA RYOJI
IPC: C08G73/14 , C08G69/26 , C08G73/06 , C08G73/10 , C08J5/18 , G03F7/004 , G03F7/023 , G03F7/16 , G03F7/40
Abstract: The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.
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公开(公告)号：PH12018500548A1
公开(公告)日：2018-09-17
申请号：PH12018500548
申请日：2018-03-13
Applicant: TORAY INDUSTRIES
Inventor： SHOJI YU , MASUDA YUKI , ISOBE KIMIO , OKUDA RYOJI
Abstract: Provided is a cured film having high elongation, low stress properties, and high metallic copper adhesion. A cured film in which a photosensitive resin composition is cured, wherein the cured film is characterized in that the photosensitive resin composition contains a polyhydroxyamide, and the ring closure rate of the polyhydroxyamide in the cured film is 10 pcnt or less.
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公开(公告)号：DE69922155D1
公开(公告)日：2004-12-30
申请号：DE69922155
申请日：1999-09-07
Applicant: TORAY INDUSTRIES
Inventor： TOMIKAWA MASAO , OKAMOTO NAOYO , YOSHIDA SATOSHI , OKUDA RYOJI
Abstract: The present invention relates to a positive-working photosensitive resin precursor composition which is characterized in that it contains (a) polymer in which the chief component comprises structural units of the kind where the bonding between structural units is represented by general formula (1) and (b) photoacid generator, and it can form a pattern by light irradiation and subsequent developing, and the total carboxyl groups contained in said polymer is from 0.02 to 2.0 mmol/g, and it provides a photosensitive resin composition of high sensitivity which can be developed by alkali. (R is an organic group of valency from 3 to 8 having at least 2 carbon atoms, R is an organic group of valency from 2 to 6 having at least 2 carbon atoms, R is hydrogen or an organic group with from 1 to 20 carbons. n is an integer of value from 3 to 100,000, m is 1 or 2, p and q are integers of value from 0 to 4 and p + q > 0.)
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