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公开(公告)号：JP2003268199A
公开(公告)日：2003-09-25
申请号：JP2002069682
申请日：2002-03-14
Applicant: TORAY INDUSTRIES
Inventor： OTSU TAKASHI , TABATA AKIHIRO , TSUJI YOSHIYUKI
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition with improved reliability to reflow resistance and forming less void, and a semiconductor device sealed with the epoxy resin composition. SOLUTION: The epoxy resin composition for sealing the semiconductor comprises (A), an epoxy resin, (B) a curing agent and (C) a filler, and contains one or more essential components of the epoxy resin composition of chemical formula (I). The component (I) has a specific acrylic acid ester unit. The epoxy resin composition is used for semiconductor sealing. COPYRIGHT: (C)2003,JPO
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公开(公告)号：JP2003226739A
公开(公告)日：2003-08-12
申请号：JP2002030224
申请日：2002-02-07
Applicant: TORAY INDUSTRIES
Inventor： TABATA AKIHIRO , OTSU TAKASHI , TSUJI YOSHIYUKI
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent flame retardance, anti-reflow reliability such as exfoliation resistance and blistering properties at reflowing as well as filling ability in molding. SOLUTION: This epoxy resin composition comprises an epoxy resin (A), a curing agent (B) and a filler (C). The epoxy resin (A) comprises a bisphenol-F type epoxy resin (a1) represented by the general formula (I) and comprises a metal hydroxide (D) as an indispensable component. The bisphenol-F type epoxy resin (a1) may be a tetramethyl bisphenol-F type epoxy resin represented by chemical formula (II). COPYRIGHT: (C)2003,JPO
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公开(公告)号：JP2003128750A
公开(公告)日：2003-05-08
申请号：JP2001321284
申请日：2001-10-19
Applicant: TORAY INDUSTRIES
Inventor： TSUJI YOSHIYUKI , TABATA AKIHIRO , OTSU TAKASHI
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in exfoliation resistance in reflow, reliability such as swelling property and releasability in molding. SOLUTION: This epoxy-based resin composition comprises an epoxy resin (A), a curing agent (B), a filler (C) and a releasing agent (D) and is characterized by that the epoxy resin (A) contains a tetramethylbisphenol F-type epoxy resin (a) represented by the general formula (I) and the releasing agent (D) contains at least one selected from montanoic acid ester wax and polyethylene wax.
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公开(公告)号：JP2002097344A
公开(公告)日：2002-04-02
申请号：JP2000291190
申请日：2000-09-25
Applicant: TORAY INDUSTRIES
Inventor： OTSU TAKASHI , TABATA AKIHIRO
IPC: C08L63/00 , C08G59/24 , C08G59/30 , C08G59/40 , C08K3/00 , C08K5/5419 , C08L83/04 , H01L23/29 , H01L23/31
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor excellent in soldering heat resistance (adhesiveness) and molding property (external void, internal void and surface appearance of a package). SOLUTION: The epoxy resin composition contains an epoxy resin (A), a hardening agent (B), a hardening accelerator (C), a filler (D) and a silicone compound (E) as essential components. The content of the filler (D) is 83-95 wt.% based on the whole resin composition, and the silicone compound (E) is an organic group-modified silicone compound having a specific structure.
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公开(公告)号：JP2003252959A
公开(公告)日：2003-09-10
申请号：JP2002059520
申请日：2002-03-05
Applicant: TORAY INDUSTRIES
Inventor： OTSU TAKASHI , TABATA AKIHIRO , TSUJI YOSHIYUKI
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high flame retardancy and reliability of reflowing resistance and a semiconductor device sealed with it. SOLUTION: The composition contains (A) an epoxy resin, (B) a hardening agent, (C) a filler and (D) a flame retardant, and (B) contains a phenol compound having repeated structural units of formula (I) (wherein R 1 -R 4 are each a hydrogen atom or a methyl group) and those of formula (II) (wherein R 5 -R 8 are each a hydrogen atom or a methyl group). Preferably, (D) consists of one or more of (d1) organic phosphorus compounds, (d2) red phosphorus and (d3) metal hydroxides. COPYRIGHT: (C)2003,JPO
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Patent Agency Ranking
公开(公告)号：JP2002265761A
公开(公告)日：2002-09-18
申请号：JP2001069315
申请日：2001-03-12
Applicant: TORAY INDUSTRIES
Inventor： OTSU TAKASHI , TABATA AKIHIRO
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor excellent in soldering heat resistance (adhesion) and molding properties (external void, internal void, package surface appearance). SOLUTION: The epoxy resin composition for sealing the semiconductor comprises an epoxy resin (A), a curing agent (B), a filler (C), a compound (D) having a structure represented by formula (I) and an elastomer (E). There is also provided a semiconductor device.
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公开(公告)号：JP2001279064A
公开(公告)日：2001-10-10
申请号：JP2000096508
申请日：2000-03-31
Applicant: TORAY INDUSTRIES
Inventor： OTSU TAKASHI , NIWA KATSUHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor sealing excellent in reliability of crack resistance to soldering, peeling resistance, etc., and moldability such as fluidity in molding, curing properties and mold release properties from a mold. SOLUTION: This epoxy resin composition for semiconductor sealing comprises (A) an epoxy resin, (B) a phenolic curing agent and (C) inorganic filler. The epoxy resin composition is characterized in that the epoxy resin (A) comprises an epoxy resin (a) having a structure having two or more epoxy groups and having two aromatic rings between two epoxy groups and having oxygen or sulfur atom between two aromatic rings and the phenolic curing agent (B) comprises a phenol compound (b) having two or more aromatic groups to which hydroxyl groups are directly bonded and an alicyclic group is disposed between the aromatic groups as an essential component.
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公开(公告)号：JP2003252961A
公开(公告)日：2003-09-10
申请号：JP2002059522
申请日：2002-03-05
Applicant: TORAY INDUSTRIES
Inventor： TABATA AKIHIRO , OTSU TAKASHI , TSUJI YOSHIYUKI
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy-based resin composition that is excellent in flame retardancy, curability, anti-reflow reliability and moldability and to provide a semiconductor device sealed with a cured product of the epoxy-based resin composition. SOLUTION: The epoxy-based resin composition comprises an epoxy resin (A), a curing agent (B) and a filler (C) wherein the epoxy resin (A) contains (a) a biphenyl novolak-type epoxy resin represented by formula (I) and the curing agent (B) contains a phenol compound having repeating unit structures represented by formula (II) and formula (III) and further wherein the amount of the filler (C) is 80-96 wt.% based on the total resin composition. COPYRIGHT: (C)2003,JPO
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公开(公告)号：JP2003238768A
公开(公告)日：2003-08-27
申请号：JP2002042848
申请日：2002-02-20
Applicant: TORAY INDUSTRIES
Inventor： TSUJI YOSHIYUKI , TABATA AKIHIRO , OTSU TAKASHI
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which is useful for the operation simplification and process stabilization in the semiconductor manufacturing process without lowering the characteristics of heat resistance, reliability, and the like, which are required for semiconductor device and which can meet a variety of recent requirements for chromatic color, and to provide a semiconductor device sealed with this epoxy resin composition. SOLUTION: The epoxy resin composition is the one which contains an epoxy resin (A), a curing agent (B), a filler (C), a curing accelerator (D) and a colorant (E) and whose color is applicable to the following range, i.e., a*≤-5 or a*≥5 or b*≤-5 or b*≥5, when the color is indicated by the coordinates (a*, b*) of the L*a*b* color specification system. COPYRIGHT: (C)2003,JPO
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公开(公告)号：JP2003105173A
公开(公告)日：2003-04-09
申请号：JP2001303427
申请日：2001-09-28
Applicant: TORAY INDUSTRIES
Inventor： OTSU TAKASHI , TABATA AKIHIRO , TSUJI YOSHIYUKI
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent reliability of peeling resistance, blistering properties and the like on reflowing and filling properties on molding. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a silane coupling agent, and the above epoxy resin (A) contains a tetramethylbisphenol F type epoxy resin and, simultaneously, the above silane coupling agent (D) is composed of (D-1) 3-97 wt.% aminosilane coupling agent in which all amino groups are secondary and (D-2) 97-3 wt.% silane coupling agent other than D-1.
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