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公开(公告)号：JP2003252959A
公开(公告)日：2003-09-10
申请号：JP2002059520
申请日：2002-03-05
Applicant: TORAY INDUSTRIES
Inventor： OTSU TAKASHI , TABATA AKIHIRO , TSUJI YOSHIYUKI
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high flame retardancy and reliability of reflowing resistance and a semiconductor device sealed with it. SOLUTION: The composition contains (A) an epoxy resin, (B) a hardening agent, (C) a filler and (D) a flame retardant, and (B) contains a phenol compound having repeated structural units of formula (I) (wherein R 1 -R 4 are each a hydrogen atom or a methyl group) and those of formula (II) (wherein R 5 -R 8 are each a hydrogen atom or a methyl group). Preferably, (D) consists of one or more of (d1) organic phosphorus compounds, (d2) red phosphorus and (d3) metal hydroxides. COPYRIGHT: (C)2003,JPO
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公开(公告)号：JP2002265761A
公开(公告)日：2002-09-18
申请号：JP2001069315
申请日：2001-03-12
Applicant: TORAY INDUSTRIES
Inventor： OTSU TAKASHI , TABATA AKIHIRO
Abstract: PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor excellent in soldering heat resistance (adhesion) and molding properties (external void, internal void, package surface appearance). SOLUTION: The epoxy resin composition for sealing the semiconductor comprises an epoxy resin (A), a curing agent (B), a filler (C), a compound (D) having a structure represented by formula (I) and an elastomer (E). There is also provided a semiconductor device.
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公开(公告)号：JP2001077515A
公开(公告)日：2001-03-23
申请号：JP24567099
申请日：1999-08-31
Applicant: TORAY INDUSTRIES
Inventor： TABATA AKIHIRO , SHINOHARA HIDEKI , KIGOSHI SHOJI
Abstract: PROBLEM TO BE SOLVED: To improve shelf life stability and solder heat resistance by at least a certain portion of a carboxyl group of a carboxyl group-containing acrylonitrile butadience rubber to be a block in a form which is expressed by a specific equation. SOLUTION: A thermo-setting adhesive is used which comprises, as an essential component, epoxy resin 100 pts.wt., carboxyl group-containing acrylonitrile butadience rubber 20-200 pts.wt., hardener 0.5-50 pts.wt., inorganic particle 10-100 pts.wt. Related to a cover-lay film comprising a laminated body comprising an insulating plastic film layer on which the adhesive layer is coated and a separation film, at least 10% of carboxyl group of the carboxyl group-containing acrylonitrile butadience rubber is made into a block in a form which is expressed with an equation (1). R1, R2, and R3 in the equation are organic radical of hydrogen or carbon number 1-18, and R4 is organic radical of carbon number 1-18.
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公开(公告)号：JP2003268199A
公开(公告)日：2003-09-25
申请号：JP2002069682
申请日：2002-03-14
Applicant: TORAY INDUSTRIES
Inventor： OTSU TAKASHI , TABATA AKIHIRO , TSUJI YOSHIYUKI
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition with improved reliability to reflow resistance and forming less void, and a semiconductor device sealed with the epoxy resin composition. SOLUTION: The epoxy resin composition for sealing the semiconductor comprises (A), an epoxy resin, (B) a curing agent and (C) a filler, and contains one or more essential components of the epoxy resin composition of chemical formula (I). The component (I) has a specific acrylic acid ester unit. The epoxy resin composition is used for semiconductor sealing. COPYRIGHT: (C)2003,JPO
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公开(公告)号：JP2003226739A
公开(公告)日：2003-08-12
申请号：JP2002030224
申请日：2002-02-07
Applicant: TORAY INDUSTRIES
Inventor： TABATA AKIHIRO , OTSU TAKASHI , TSUJI YOSHIYUKI
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent flame retardance, anti-reflow reliability such as exfoliation resistance and blistering properties at reflowing as well as filling ability in molding. SOLUTION: This epoxy resin composition comprises an epoxy resin (A), a curing agent (B) and a filler (C). The epoxy resin (A) comprises a bisphenol-F type epoxy resin (a1) represented by the general formula (I) and comprises a metal hydroxide (D) as an indispensable component. The bisphenol-F type epoxy resin (a1) may be a tetramethyl bisphenol-F type epoxy resin represented by chemical formula (II). COPYRIGHT: (C)2003,JPO
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Patent Agency Ranking
公开(公告)号：JP2003128750A
公开(公告)日：2003-05-08
申请号：JP2001321284
申请日：2001-10-19
Applicant: TORAY INDUSTRIES
Inventor： TSUJI YOSHIYUKI , TABATA AKIHIRO , OTSU TAKASHI
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in exfoliation resistance in reflow, reliability such as swelling property and releasability in molding. SOLUTION: This epoxy-based resin composition comprises an epoxy resin (A), a curing agent (B), a filler (C) and a releasing agent (D) and is characterized by that the epoxy resin (A) contains a tetramethylbisphenol F-type epoxy resin (a) represented by the general formula (I) and the releasing agent (D) contains at least one selected from montanoic acid ester wax and polyethylene wax.
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公开(公告)号：JP2002275240A
公开(公告)日：2002-09-25
申请号：JP2001076603
申请日：2001-03-16
Applicant: TORAY INDUSTRIES
Inventor： TABATA AKIHIRO , KITAMURA TOMOHIRO , TOKUNAGA ATSUTO
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in reliability to release resistance and blistering property, etc., in reflow and packing property in molding. SOLUTION: This epoxy-based resin composition comprises (A) an epoxy resin, (B) a curing agent and (C) filler. The epoxy-based resin composition is characterized in that a ratio of the filler (C) is 88-96 wt.% based on total resin composition and the epoxy resin comprises (a) a bisphenol F type epoxy resin represented by the chemical formula (I) and a tetramethylbisphenol F type epoxy resin represented by the chemical formula (II).
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公开(公告)号：JP2002097344A
公开(公告)日：2002-04-02
申请号：JP2000291190
申请日：2000-09-25
Applicant: TORAY INDUSTRIES
Inventor： OTSU TAKASHI , TABATA AKIHIRO
IPC: C08L63/00 , C08G59/24 , C08G59/30 , C08G59/40 , C08K3/00 , C08K5/5419 , C08L83/04 , H01L23/29 , H01L23/31
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor excellent in soldering heat resistance (adhesiveness) and molding property (external void, internal void and surface appearance of a package). SOLUTION: The epoxy resin composition contains an epoxy resin (A), a hardening agent (B), a hardening accelerator (C), a filler (D) and a silicone compound (E) as essential components. The content of the filler (D) is 83-95 wt.% based on the whole resin composition, and the silicone compound (E) is an organic group-modified silicone compound having a specific structure.
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公开(公告)号：JP2001040317A
公开(公告)日：2001-02-13
申请号：JP22090399
申请日：1999-08-04
Applicant: TORAY INDUSTRIES
Inventor： TABATA AKIHIRO , SHINOHARA HIDEKI , KIGOSHI SHOJI
IPC: H05K1/03 , C09J7/02 , C09J109/02 , C09J163/00
Abstract: PROBLEM TO BE SOLVED: To provide novel covering films having excellent soldering heat resistance, adhesion and storage stability, and adhesive sheets and flexible printed circuit boards on an industrial scale. SOLUTION: In a covering film constituted by a laminate of an insulating plastic film layer which contains, as the essential components, (A) 100 pts.wt. epoxy resin, (B) 20-200 pts.wt. carboxyl group-containing acrylonitrile/butadiene rubber, (C) 0.01-50 pts.wt. curing agent, and (D) 10-100 pts.wt. inorganic particles containing aminosilane in their surfaces and is coated with a heat curable adhesive layer and a release film layer, the amount of the aminosilane of component (D) is 1.2-10 wt.% based on the inorganic particles.
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公开(公告)号：JP2003105175A
公开(公告)日：2003-04-09
申请号：JP2001303535
申请日：2001-09-28
Applicant: TORAY INDUSTRIES
Inventor： OTSU TAKASHI , TABATA AKIHIRO , TSUJI YOSHIYUKI
IPC: C08L63/02 , C08G59/62 , C08K3/00 , C08K3/22 , C08K5/06 , C08K5/136 , C08L101/04 , H01L23/29 , H01L23/31
Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin composition having flame retardance, reflowing reliability such as adhesion and blistering properties on reflowing and filling properties on molding. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, and (C) a filler, and the above epoxy resin (A) contains a tetramethylbisphenol F type epoxy resin to be represented by formula (I) ; simultaneously the content of a bromine compound based on the entire composition is
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