POLYAMIDE RESIN COMPOSITION
    1.
    发明专利

    公开(公告)号:JPH09124934A

    公开(公告)日:1997-05-13

    申请号:JP28472695

    申请日:1995-11-01

    Abstract: PROBLEM TO BE SOLVED: To obtain a resin composition which gives a molded article excellent in impact strength, heat resistance, deicer resistance, appearance, and flex resistance at a hinge part. SOLUTION: This polyamide resin composition consists of a polyamide (A) containing structural units formed from a 4-18C aliphatic diamine and terephthalic acid, a polyolefin (B) modified with an unsaturated carboxylic acid compound, and an epoxidized polymer (C), wherein the component A and the total of components B and C account for 55-85wt.% and 45-15wt.%, respectively, of the composition, and the component B accounts for 20-80wt.% of the total of components B and C.

    NYLON RESIN COMPOSITION
    2.
    发明专利

    公开(公告)号:JPH11172101A

    公开(公告)日:1999-06-29

    申请号:JP34025797

    申请日:1997-12-10

    Abstract: PROBLEM TO BE SOLVED: To obtain a nylon resin composition excellent in electric properties such as tracking resistance, having excellent flame resistance, mechanical properties, heat resistance and moldability, and useful as an electric part, an electronic part, an automobile electric or electronic part or the like by compounding a nylon resin, a brominated flame retardant, an antimony compound, magnesium hydroxide and glass fiber. SOLUTION: This composition is obtained by compounding (A) a nylon resin (e.g. nylon 6) preferably in an amount of 100 pts.wt. with (B) 5-50 pts.wt. of a brominated flame retardant (e.g. polydibromostyrene), (C) 2-15 pts.wt. of an anitomony compound (e.g. antimony trioxide), (D) 20-50 pts.wt. of magnesium hydroxide and (E) 10-100 pts.wt. of glass fiber, and preferably further, (F) 0.01-5 pts.wt. of a fluororesin and (G) 0.01-3 pts.wt. of a hindered phenol-based stabilizer. The bromine content of the component B is preferably >=60 wt.%. Further, the aspect ratio of the component E is preferably 15-45.

    POLYAMIDE RESIN COMPOSITION AND ITS MOLDED ARTICLE

    公开(公告)号:JPH07207155A

    公开(公告)日:1995-08-08

    申请号:JP505594

    申请日:1994-01-21

    Abstract: PURPOSE:To obtain a polyamide resin composition having excellent heat- resistance, toughness, rigidity in water-absorbed state and dimensional-stability and remarkably exhibiting these effects especially in molded articles having thin wall part. CONSTITUTION:This polyamide resin composition and its molded article is produced by compounding (a) 45-78wt.% of a 66/6T copolyamide having a melting point of 270-300 deg.C, (b) 40-20wt.% of an amorphous graft-modified polyolefin having a glass transition temperature of >=100 deg.C and (c) 15-2wt.% of a graft- modified ethylene/alpha-olefin copolymer having a crystallinity of 5-20%.

    RESIN COMPOSITION FOR CONNECTOR
    4.
    发明专利

    公开(公告)号:JPH07207151A

    公开(公告)日:1995-08-08

    申请号:JP505494

    申请日:1994-01-21

    Abstract: PURPOSE:To obtain a resin composition excellent in heat resistance, wet stiffness, toughness, dimensional stability and resistance to a road-antifreezing agent and suitable for a molding material for connector. CONSTITUTION:This resin composition for connector contains 100 pts.wt. mixture composed of (a) 55 to 84wt.% polyamide resin containing an aromatic ring, (b) 35 to 15wt.% modified polyolefin resin and (c) 10 to 1wt.% modified ethylene-alpha-olefin random copolymer having 0 to 20% crystallinity index and 70 to 95mol% ethylene content and (d) 0 to 100 pts.wt. inorganic reinforcing material.

    METHOD FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION

    公开(公告)号:JP2006225535A

    公开(公告)日:2006-08-31

    申请号:JP2005041869

    申请日:2005-02-18

    Abstract: PROBLEM TO BE SOLVED: To provide a method for producing a thermoplastic resin composition, capable of preventing the scattering of an additive to the outside of a solid phase polymerization vessel accompanying with the decrease of pressure in the solid phase polymerization. SOLUTION: This method for producing the thermoplastic resin composition is characterized in that a tablet-formed additive is used in one or a plural number of additives used in a rotary batch type solid phase polymerization device under a reduced pressure, also among the composition of the additives, the melting point of at least one of them is at or less than the temperature for the solid phase polymerization, the ratio of the diameter to height of the tablet-formed additive is 0.5-2.5 and also the breaking strength of the tablet-formed additive is 3-15 kg. COPYRIGHT: (C)2006,JPO&NCIPI

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